Inventor · disambiguated record
Gary L. Swiss
Also filed as: SWISS GARY L
4 granted patents·345 citations·filing 1999–2000
82Inventor score
Files withAMKOR TECHNOLOGY INC4
Top patents by PatentIndex Score
4 records- 0196US6444499B1Method for fabricating a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic componentsAMKOR TECHNOLOGY INC·Filed 2000·Granted Sep 3, 2002·213 cites·45 claims
- 0291US6309943B1Precision marking and singulation methodAMKOR TECHNOLOGY INC·Filed 2000·Granted Oct 30, 2001·67 cites·29 claims
- 0385US6441504B1Precision aligned and marked structureAMKOR TECHNOLOGY INC·Filed 2000·Granted Aug 27, 2002·44 cites·25 claims
- 0453US6476478B1Cavity semiconductor package with exposed leads and die padAMKOR TECHNOLOGY INC·Filed 1999·Granted Nov 5, 2002·21 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →