Inventor · disambiguated record
Gerald Friese
Also filed as: FRIESE GERALD · FRIESE GERALD R
13 granted patents·3 pending applications·424 citations·filing 2001–2008
93Inventor score
Top patents by PatentIndex Score
16 records- 0196US6949442B2Methods of forming MIM capacitorsINFINEON TECHNOLOGIES AG·Filed 2003·Granted Sep 27, 2005·112 cites·43 claims
- 0294US6720212B2Method of eliminating back-end rerouting in ball grid array packagingINFINEON TECHNOLOGIES AG·Filed 2002·Granted Apr 13, 2004·96 cites·11 claims
- 0391US6730982B2FBEOL process for Cu metallizations free from Al-wirebond padsINFINEON TECHNOLOGIES AG·Filed 2001·Granted May 4, 2004·74 cites·16 claims
- 0488US6451664B1Method of making a MIM capacitor with self-passivating platesINFINEON TECHNOLOGIES AG·Filed 2001·Granted Sep 17, 2002·51 cites·17 claims
- 0581US6559042B2Process for forming fusible linksIBM·Filed 2001·Granted May 6, 2003·33 cites·5 claims
- 0678US6872648B2Reduced splattering of unpassivated laser fusesINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 29, 2005·26 cites·16 claims
- 0773US7436016B2MIM capacitor with a cap layer over the conductive platesINFINEON TECHNOLOGIES AG·Filed 2005·Granted Oct 14, 2008·3 cites·22 claims
- 0867US6750113B2Metal-insulator-metal capacitor in copperIBM·Filed 2001·Granted Jun 15, 2004·12 cites·5 claims
- 0965US6866943B2Bond pad structure comprising tungsten or tungsten compound layer on top of metallization levelINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 15, 2005·10 cites·18 claims
- 1064US7843035B2MIM capacitors with catalytic activation layerINFINEON TECHNOLOGIES AG·Filed 2008·Granted Nov 30, 2010·1 cites·20 claims
- 1152US7786007B2Method and apparatus of stress relief in semiconductor structuresINFINEON TECHNOLOGIES AG·Filed 2008·Granted Aug 31, 2010·0 cites·18 claims
- 1249US6960835B2Stress-relief layer for semiconductor applicationsUNITED MICROELECTRONICS CO·Filed 2003·Granted Nov 1, 2005·4 cites·27 claims
- 1347US7368804B2Method and apparatus of stress relief in semiconductor structuresINFINEON TECHNOLOGIES AG·Filed 2003·Granted May 6, 2008·2 cites·19 claims
- 1444US2005221610A1Method and apparatus of stress relief in semiconductor structuresHOINKIS MARK·Filed 2005·Application pending·0 cites
- 1534US2002016070A1Power pads for application of high current per bond pad in silicon technologyFiled 2001·Application pending·0 cites
- 1633US2002155676A1Zero mask MIMcap process for a low k BEOLFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →