Inventor · disambiguated record
Gernot Schulz
Also filed as: SCHULZ GERNOT
9 granted patents·6 pending applications·12 citations·filing 2014–2024
79Inventor score
Top patents by PatentIndex Score
15 records- 0183US11574849B2Package with embedded electronic component being encapsulated in a pressureless wayAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Feb 7, 2023·8 cites·15 claims
- 0279US11430703B2Aligning component carrier structure with known-good sections and critical section with other component carrier with components and dummiesAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Aug 30, 2022·1 cites·8 claims
- 0366US11058007B2Component carrier with two component carrier portions and a component being embedded in a blind opening of one of the component carrier portionsAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted Jul 6, 2021·1 cites·13 claims
- 0466US9867284B2Warpage control with intermediate materialAUSTRIA TECH & SYSTEM TECH·Filed 2015·Granted Jan 9, 2018·2 cites·20 claims
- 0558US2024329163A1Monitoring unit comprising an integrated magnetic field sensorAUSTRIA TECH & SYSTEM TECH·Filed 2024·Application pending·0 cites
- 0654US11366181B2Component carrier with integrated flux gate sensorAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted Jun 21, 2022·0 cites·17 claims
- 0753US12262482B2Method of manufacturing component carrier and component carrier intermediate productAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Granted Mar 25, 2025·0 cites·11 claims
- 0852US11197367B2Component carrier comprising a double layer structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Dec 7, 2021·0 cites·9 claims
- 0948US10225920B2Printed circuit board structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2014·Granted Mar 5, 2019·0 cites·10 claims
- 1047US2022190464A1Component Carrier Having at Least a Part Formed as a Three-Dimensionally Printed Structure Forming an AntennaAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Application pending·0 cites
- 1140US2019110366A1Component Carrier Having at Least a Part Formed as a Three-Dimensionally Printed StructureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Application pending·0 cites
- 1234US10109554B2Mechanically stable, thermally conductive and electrically insulating stack forming a mounting device for electronic componentsAUSTRIA TECH & SYSTEM TECH·Filed 2015·Granted Oct 23, 2018·0 cites·20 claims
- 1327US2017079130A1Heat Spreader in Multilayer Build UpsAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2015·Application pending·0 cites
- 1427US2017142830A1Reinforcement Structures With a Thermal Conductivity-Increasing Coating in the Resin Matrix, and Electrical Conductor Structure Which is Separate From the CoatingAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2015·Application pending·0 cites
- 1526US2017245358A1Adhesion Promoting Material-Coated Electrically Conductive Carrier With Thermally Conductive LayerAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →