Inventor · disambiguated record
Georg Seidemann
Also filed as: SEIDEMANN GEORG
82 granted patents·47 pending applications·161 citations·filing 2007–2025
98Inventor score
Top patents by PatentIndex Score
129 records- 0197US11955462B2Package stacking using chip to wafer bondingINTEL CORP·Filed 2021·Granted Apr 9, 2024·3 cites·20 claims
- 0297US9997444B2Microelectronic package having a passive microelectronic device disposed within a package bodyINTEL CORP·Filed 2014·Granted Jun 12, 2018·41 cites·24 claims
- 0393US10319688B2Antenna on ceramics for a packaged dieINTEL CORP·Filed 2013·Granted Jun 11, 2019·21 cites·18 claims
- 0491US8779564B1Semiconductor device with capacitive coupling structureINTEL IP CORP·Filed 2013·Granted Jul 15, 2014·14 cites·26 claims
- 0589US10403609B2System-in-package devices and methods for forming system-in-package devicesINTEL IP CORP·Filed 2015·Granted Sep 3, 2019·7 cites·25 claims
- 0689US10186499B2Integrated circuit package assemblies including a chip recessINTEL IP CORP·Filed 2016·Granted Jan 22, 2019·6 cites·15 claims
- 0788US11031699B2Antenna with graded dielectirc and method of making the sameINTEL IP CORP·Filed 2018·Granted Jun 8, 2021·4 cites·12 claims
- 0887US10115668B2Semiconductor package having a variable redistribution layer thicknessINTEL IP CORP·Filed 2015·Granted Oct 30, 2018·5 cites·10 claims
- 0987US2025323155A1Bare-die smart bridge connected with copper pillars for system-in-package apparatusINTEL CORP·Filed 2025·Application pending·0 cites
- 1085US11270941B2Bare-die smart bridge connected with copper pillars for system-in-package apparatusINTEL CORP·Filed 2016·Granted Mar 8, 2022·4 cites·20 claims
- 1185US9142475B2Magnetic contactsINTEL CORP·Filed 2013·Granted Sep 22, 2015·6 cites·24 claims
- 1285US2025285972A1Bare-die smart bridge connected with copper pillars for system-in-package apparatusINTEL CORP·Filed 2025·Application pending·0 cites
- 1385US2025285971A1Bare-die smart bridge connected with copper pillars for system-in-package apparatusINTEL CORP·Filed 2025·Application pending·0 cites
- 1484US10714455B2Integrated circuit package assemblies including a chip recessINTEL IP CORP·Filed 2018·Granted Jul 14, 2020·3 cites·17 claims
- 1581US10209466B2Integrated circuit packages including an optical redistribution layerINTEL IP CORP·Filed 2016·Granted Feb 19, 2019·3 cites·17 claims
- 1681US2024213225A1Package stacking using chip to wafer bondingINTEL CORP·Filed 2024·Application pending·0 cites
- 1779US11735570B2Fan out packaging pop mechanical attach methodINTEL CORP·Filed 2018·Granted Aug 22, 2023·2 cites·9 claims
- 1879US10553538B2Semiconductor package having a variable redistribution layer thicknessINTEL IP CORP·Filed 2018·Granted Feb 4, 2020·2 cites·19 claims
- 1979US10522485B2Electrical device and a method for forming an electrical deviceINTEL IP CORP·Filed 2015·Granted Dec 31, 2019·3 cites·25 claims
- 2079US9209143B2Die edge side connectionINTEL IP CORP·Filed 2013·Granted Dec 8, 2015·5 cites·24 claims
- 2178US11239199B2Package stacking using chip to wafer bondingINTEL CORP·Filed 2015·Granted Feb 1, 2022·2 cites·18 claims
- 2277US12243856B2Fan out packaging pop mechanical attach methodINTEL CORP·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 2377US11134573B2Printed wiring-board islands for connecting chip packages and methods of assembling sameINTEL CORP·Filed 2017·Granted Sep 28, 2021·2 cites·23 claims
- 2476US12341096B2Bare-die smart bridge connected with copper pillars for system-in-package apparatusINTEL CORP·Filed 2022·Granted Jun 24, 2025·0 cites·10 claims
- 2576US12080655B2Method to implement wafer-level chip-scale packages with grounded conformal shieldINTEL CORP·Filed 2019·Granted Sep 3, 2024·2 cites·22 claims
- 2676US9368461B2Contact pads for integrated circuit packagesINTEL CORP·Filed 2014·Granted Jun 14, 2016·4 cites·23 claims
- 2776US2025132259A1Microelectronic assemblies having topside power delivery structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 2875US10403602B2Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memoryINTEL CORP·Filed 2017·Granted Sep 3, 2019·2 cites·9 claims
- 2974US9819327B2Bulk acoustic wave resonator tuner circuitsMARUTHAMUTHU SARAVANA·Filed 2013·Granted Nov 14, 2017·5 cites·22 claims
- 3073US10629731B2Power mesh-on-die trace bumpingINTEL IP CORP·Filed 2019·Granted Apr 21, 2020·1 cites·19 claims
- 3173US9397019B2Integrated circuit package configurations to reduce stiffnessINTEL IP CORP·Filed 2014·Granted Jul 19, 2016·2 cites·14 claims
- 3272US12394726B2Method to implement wafer-level chip-scale packages with grounded conformal shieldINTEL CORP·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 3372US2025167183A1Fan out packaging pop mechanical attach methodINTEL CORP·Filed 2025·Application pending·0 cites
- 3470US12191571B2Antenna with graded dielectirc and method of making the sameINTEL CORP·Filed 2021·Granted Jan 7, 2025·0 cites·22 claims
- 3569US11877403B2Printed wiring-board islands for connecting chip packages and methods of assembling sameINTEL CORP·Filed 2021·Granted Jan 16, 2024·0 cites·20 claims
- 3669US10672731B2Wafer level package structure with internal conductive layerINTEL IP CORP·Filed 2015·Granted Jun 2, 2020·1 cites·18 claims
- 3769US10263106B2Power mesh-on-die trace bumpingINTEL IP CORP·Filed 2017·Granted Apr 16, 2019·1 cites·21 claims
- 3867US10366968B2Interconnect structure for a microelectronic deviceINTEL IP CORP·Filed 2016·Granted Jul 30, 2019·1 cites·13 claims
- 3967US9601468B2Magnetic contactsINTEL CORP·Filed 2016·Granted Mar 21, 2017·1 cites·9 claims
- 4067US9343389B2Magnetic contactsINTEL CORP·Filed 2015·Granted May 17, 2016·1 cites·21 claims
- 4166US12211796B2Microelectronic assemblies having topside power delivery structuresINTEL CORP·Filed 2021·Granted Jan 28, 2025·0 cites·20 claims
- 4266US12125815B2Assembly of 2XD module using high density interconnect bridgesINTEL CORP·Filed 2020·Granted Oct 22, 2024·0 cites·21 claims
- 4366US11469213B2Systems, methods, and apparatuses for implementing reduced height semiconductor packages for mobile electronicsINTEL CORP·Filed 2016·Granted Oct 11, 2022·1 cites·25 claims
- 4465US12406925B2Bare-die smart bridge connected with copper pillars for system-in-package apparatusINTEL CORP·Filed 2021·Granted Sep 2, 2025·0 cites·17 claims
- 4565US12243828B2Microelectronic assemblies having topside power delivery structuresINTEL CORP·Filed 2021·Granted Mar 4, 2025·0 cites·20 claims
- 4665US11424209B2Wafer level package structure with internal conductive layerINTEL CORP·Filed 2020·Granted Aug 23, 2022·0 cites·20 claims
- 4765US10490527B2Vertical wire connections for integrated circuit packageINTEL IP CORP·Filed 2015·Granted Nov 26, 2019·1 cites·22 claims
- 4865US2025157941A1Microelectronic assemblies having topside power delivery structuresINTEL CORP·Filed 2025·Application pending·0 cites
- 4965US2022294115A1Patch antennas stitched to systems in packages and methods of assembling sameINTEL CORP·Filed 2022·Application pending·0 cites
- 5064US10651102B2Interposer with conductive routing exposed on sidewallsINTEL IP CORP·Filed 2015·Granted May 12, 2020·1 cites·11 claims
Showing the top 50 of 129 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →