Inventor · disambiguated record
Gen Toyota
Also filed as: TOYOTA GEN
13 granted patents·6 pending applications·101 citations·filing 2003–2023
90Inventor score
Top patents by PatentIndex Score
19 records- 0194US7217662B2Method of processing a substrateTOSHIBA KK·Filed 2005·Granted May 15, 2007·26 cites·18 claims
- 0293US7014529B1Substrate processing method and substrate processing apparatusTOSHIBA KK·Filed 2005·Granted Mar 21, 2006·26 cites·20 claims
- 0391US7744445B2Polishing apparatus and polishing methodTOSHIBA KK·Filed 2005·Granted Jun 29, 2010·26 cites·13 claims
- 0480US7883394B2Substrate holding mechanism, substrate polishing apparatus and substrate polishing methodEBARA CORP·Filed 2008·Granted Feb 8, 2011·5 cites·10 claims
- 0575US8292694B2Substrate holding mechanism, substrate polishing apparatus and substrate polishing methodTOGAWA TETSUJI·Filed 2009·Granted Oct 23, 2012·4 cites·13 claims
- 0672US7241205B2Method of processing a substrateTOSHIBA KK·Filed 2005·Granted Jul 10, 2007·5 cites·5 claims
- 0770US7767472B2Substrate processing method and substrate processing apparatusEBARA CORP·Filed 2007·Granted Aug 3, 2010·2 cites·14 claims
- 0869US9935232B2Method of manufacturing semiconductor deviceTOSHIBA MEMORY CORP·Filed 2015·Granted Apr 3, 2018·2 cites·17 claims
- 0964US12482788B2Semiconductor device and method of manufacturing a semiconductor deviceKIOXIA CORP·Filed 2022·Granted Nov 25, 2025·0 cites·20 claims
- 1059US7419420B2Substrate holding mechanism, substrate polishing apparatus and substrate polishing methodEBARA CORP·Filed 2003·Granted Sep 2, 2008·5 cites·8 claims
- 1156US12199066B2Semiconductor device and method for producing the sameKIOXIA CORP·Filed 2022·Granted Jan 14, 2025·0 cites·6 claims
- 1254US11830847B2Manufacturing method of semiconductor device and semiconductor deviceKIOXIA CORP·Filed 2021·Granted Nov 28, 2023·0 cites·8 claims
- 1351US2007178701A1Method of processing a substrateTOSHIBA KK·Filed 2007·Application pending·0 cites
- 1451US2023307415A1Semiconductor device and semiconductor device manufacturing methodKIOXIA CORP·Filed 2022·Application pending·0 cites
- 1551US2024055363A1Semiconductor device, method of manufacturing semiconductor device, and method of disposing alignment markKIOXIA CORP·Filed 2023·Application pending·0 cites
- 1649US2006019417A1Substrate processing method and substrate processing apparatusSHIGETA ATSUSHI·Filed 2005·Application pending·0 cites
- 1747US2010255757A1Substrate processing method and substrate processing apparatusSHIGETA ATSUSHI·Filed 2010·Application pending·0 cites
- 1841US10818501B2Method for manufacturing semiconductor deviceTOSHIBA MEMORY CORP·Filed 2019·Granted Oct 27, 2020·0 cites·13 claims
- 1941US2007000873A1Substrate processing method and semiconductor device manufacturing methodKUBOTA TAKEO·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →