Inventor · disambiguated record
Giovanni Graziosi
Also filed as: GRAZIOSI GIOVANNI
20 granted patents·3 pending applications·17 citations·filing 2006–2024
90Inventor score
Files withST MICROELECTRONICS SRL19FONTANA FULVIO VITTORIO1ST MICROELECTRONICS INT NV1ZIGLIOLI FEDERICO1ZIGLIOLI FEDERICO GIOVANNI1
Top patents by PatentIndex Score
23 records- 0183US7616451B2Semiconductor package substrate and method, in particular for MEMS devicesST MICROELECTRONICS SRL·Filed 2006·Granted Nov 10, 2009·9 cites·28 claims
- 0278US11152289B2Semiconductor device and corresponding methodST MICROELECTRONICS SRL·Filed 2019·Granted Oct 19, 2021·2 cites·20 claims
- 0378US10211140B2Electronic device with die being sunk in substateST MICROELECTRONICS SRL·Filed 2017·Granted Feb 19, 2019·2 cites·20 claims
- 0473US9460841B2Integrated inductor device with high inductance in a radiofrequency identification systemFONTANA FULVIO VITTORIO·Filed 2012·Granted Oct 4, 2016·3 cites·16 claims
- 0572US12300585B2Semiconductor device with electrical component for bridging leadframe and chip mounting portion and corresponding method of manufactureST MICROELECTRONICS SRL·Filed 2023·Granted May 13, 2025·0 cites·18 claims
- 0669US11626355B2Semiconductor device and corresponding methodST MICROELECTRONICS SRL·Filed 2021·Granted Apr 11, 2023·0 cites·20 claims
- 0762US2024413120A1Semiconductor device and corresponding method of manufactureST MICROELECTRONICS SRL·Filed 2024·Application pending·0 cites
- 0860US10593614B2Integrated capacitors on lead frame in semiconductor devicesST MICROELECTRONICS SRL·Filed 2019·Granted Mar 17, 2020·0 cites·17 claims
- 0959US10643940B2Electronic device with die being sunk in substrateST MICROELECTRONICS SRL·Filed 2019·Granted May 5, 2020·0 cites·16 claims
- 1055US12068276B2Semiconductor device and corresponding method of manufactureST MICROELECTRONICS SRL·Filed 2021·Granted Aug 20, 2024·0 cites·13 claims
- 1155US11764134B2Semiconductor device including electrical component connecting a semiconductor chip to a leadframe and a corresponding method of manufactureST MICROELECTRONICS SRL·Filed 2020·Granted Sep 19, 2023·0 cites·15 claims
- 1254US8854830B2Semiconductor package substrate in particular for MEMS devicesST MICROELECTRONICS SRL·Filed 2013·Granted Oct 7, 2014·0 cites·24 claims
- 1354US8411457B2Semiconductor package substrateZIGLIOLI FEDERICO·Filed 2009·Granted Apr 2, 2013·1 cites·14 claims
- 1452US11915989B2Semiconductor device and corresponding manufacturing methodST MICROELECTRONICS SRL·Filed 2022·Granted Feb 27, 2024·0 cites·28 claims
- 1552US10283441B2Method of integrating capacitors on lead frame in semiconductor devicesST MICROELECTRONICS SRL·Filed 2016·Granted May 7, 2019·0 cites·19 claims
- 1652US2023005803A1Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2022·Application pending·0 cites
- 1752US2024178178A1Semiconductor device and corresponding methodST MICROELECTRONICS INT NV·Filed 2023·Application pending·0 cites
- 1851US9704794B2Electronic device with die being sunk in substrateST MICROELECTRONICS SRL·Filed 2015·Granted Jul 11, 2017·0 cites·22 claims
- 1949US9060227B2Shielded encapsulating structure and manufacturing method thereofST MICROELECTRONICS SRL·Filed 2012·Granted Jun 16, 2015·0 cites·22 claims
- 2047US11705388B2Assortment of substrates for semiconductor circuits, corresponding assortment of devices and methodST MICROELECTRONICS SRL·Filed 2020·Granted Jul 18, 2023·0 cites·13 claims
- 2147US11521861B2Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2020·Granted Dec 6, 2022·0 cites·23 claims
- 2245US9428380B2Shielded encapsulating structure and manufacturing method thereofST MICROELECTRONICS SRL·Filed 2015·Granted Aug 30, 2016·0 cites·25 claims
- 2343US8633583B2Semiconductor package substrate and methods for forming same, in particular for MEMS devicesZIGLIOLI FEDERICO GIOVANNI·Filed 2007·Granted Jan 21, 2014·0 cites·23 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →