Inventor · disambiguated record
Gilroy Vandentop
Also filed as: BRAUNISCH HENNING · LU DAOQIANG · VANDENTOP GILROY · VANDENTOP GILROY J
29 granted patents·8 pending applications·701 citations·filing 1994–2013
97Inventor score
Top patents by PatentIndex Score
37 records- 0198US6580611B1Dual-sided heat removal systemINTEL CORP·Filed 2002·Granted Jun 17, 2003·176 cites·31 claims
- 0294US6888240B2High performance, low cost microelectronic circuit package with interposerINTEL CORP·Filed 2001·Granted May 3, 2005·146 cites·38 claims
- 0393US7359591B2Electrical/optical integration scheme using direct copper bondingINTEL CORP·Filed 2006·Granted Apr 15, 2008·24 cites·5 claims
- 0488US7569426B2Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die packageINTEL CORP·Filed 2007·Granted Aug 4, 2009·14 cites·12 claims
- 0588US6792179B2Optical thumbtackINTEL CORP·Filed 2002·Granted Sep 14, 2004·35 cites·31 claims
- 0686US7038316B2Bumpless die and heat spreader lid module bonded to bumped die carrierINTEL CORP·Filed 2004·Granted May 2, 2006·34 cites·14 claims
- 0784US7355277B2Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die packageINTEL CORP·Filed 2003·Granted Apr 8, 2008·30 cites·15 claims
- 0882US7063268B2Electro-active fluid cooling systemINTEL CORP·Filed 2004·Granted Jun 20, 2006·26 cites·24 claims
- 0982US5844300ASingle poly devices for monitoring the level and polarity of process induced charging in a MOS processINTEL CORP·Filed 1996·Granted Dec 1, 1998·48 cites·6 claims
- 1081US7826694B2Electrical/optical integration scheme using direct copper bondingINTEL CORP·Filed 2007·Granted Nov 2, 2010·7 cites·3 claims
- 1181US7703991B2Flip-chip mountable optical connector for chip-to-chip optical interconnectabilityINTEL CORP·Filed 2005·Granted Apr 27, 2010·10 cites·7 claims
- 1280US9153547B2Integrated inductor structure and method of fabricationCRAWFORD ANKUR MOHAN·Filed 2009·Granted Oct 6, 2015·9 cites·17 claims
- 1379US7236666B2On-substrate microlens to couple an off-substrate light emitter and/or receiver with an on-substrate optical deviceINTEL CORP·Filed 2004·Granted Jun 26, 2007·19 cites·16 claims
- 1478US8541876B2Microelectronic package having direct contact heat spreader and method of manufacturing sameLU DAOQIANG·Filed 2005·Granted Sep 24, 2013·7 cites·19 claims
- 1577US7372120B1Methods and apparatus to optically couple an optoelectronic chip to a waveguideINTEL CORP·Filed 2003·Granted May 13, 2008·16 cites·31 claims
- 1675US9508675B2Microelectronic package having direct contact heat spreader and method of manufacturing sameLU DAOQIANG·Filed 2013·Granted Nov 29, 2016·3 cites·27 claims
- 1774US6992381B2Using external radiators with electroosmotic pumps for cooling integrated circuitsINTEL CORP·Filed 2003·Granted Jan 31, 2006·16 cites·18 claims
- 1872US6717066B2Electronic packages having multiple-zone interconnects and methods of manufactureINTEL CORP·Filed 2001·Granted Apr 6, 2004·14 cites·54 claims
- 1965US7283699B2Optical packageINTEL CORP·Filed 2004·Granted Oct 16, 2007·8 cites·16 claims
- 2062US6593793B1Electronic package with integrated clock distribution structureINTEL CORP·Filed 2002·Granted Jul 15, 2003·7 cites·30 claims
- 2160US7576432B2Using external radiators with electroosmotic pumps for cooling integrated circuitsINTEL CORP·Filed 2005·Granted Aug 18, 2009·1 cites·15 claims
- 2259US6720814B2Electronic package with integrated clock distribution structureINTEL CORP·Filed 2003·Granted Apr 13, 2004·5 cites·31 claims
- 2357US6001699AHighly selective etch process for submicron contactsINTEL CORP·Filed 1996·Granted Dec 14, 1999·24 cites·19 claims
- 2456US7821073B2Patterned backside stress engineering for transistor performance optimizationINTEL CORP·Filed 2008·Granted Oct 26, 2010·0 cites·5 claims
- 2553US2008096323A1Integrated circuit die/package interconnectVANDENTOP GILROY J·Filed 2007·Application pending·0 cites
- 2651US7371630B2Patterned backside stress engineering for transistor performance optimizationINTEL CORP·Filed 2004·Granted May 13, 2008·2 cites·8 claims
- 2751US7195941B2Optical devices and methods to construct the sameINTEL CORP·Filed 2003·Granted Mar 27, 2007·2 cites·35 claims
- 2851US2007069333A1Integrated inductor structure and method of fabricationCRAWFORD ANKUR M·Filed 2006·Application pending·0 cites
- 2947US2007127865A1Optical devices and methods to construct the sameLU DAOQIANG·Filed 2007·Application pending·0 cites
- 3046US5549784AMethod for etching silicon oxide films in a reactive ion etch system to prevent gate oxide damageINTEL CORP·Filed 1994·Granted Aug 27, 1996·18 cites·13 claims
- 3145US7085449B2Waveguide coupling mechanismINTEL CORP·Filed 2004·Granted Aug 1, 2006·0 cites·22 claims
- 3243US7330357B2Integrated circuit die/package interconnectINTEL CORP·Filed 2003·Granted Feb 12, 2008·0 cites·4 claims
- 3343US2006088971A1Integrated inductor and method of fabricationCRAWFORD ANKUR M·Filed 2004·Application pending·0 cites
- 3441US2007013080A1Voltage regulators and systems containing sameINTEL CORP·Filed 2005·Application pending·0 cites
- 3540US2003113947A1Electrical/optical integration scheme using direct copper bondingFiled 2001·Application pending·0 cites
- 3637US2004126064A1Optical assemblyFiled 2002·Application pending·0 cites
- 3737US2004188811A1Circuit package apparatus, systems, and methodsINTEL CORP·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →