Inventor · disambiguated record
Glen E. Richard
Also filed as: RICHARD GLEN E
16 granted patents·116 citations·filing 2001–2017
92Inventor score
Top patents by PatentIndex Score
16 records- 0197US9508680B1Induction heating for underfill removal and chip reworkGLOBALFOUNDRIES INC·Filed 2015·Granted Nov 29, 2016·28 cites·16 claims
- 0296US9472490B1IC structure with recessed solder bump area and methods of forming sameGLOBALFOUNDRIES INC·Filed 2015·Granted Oct 18, 2016·18 cites·17 claims
- 0388US9776270B2Chip joining by induction heatingGLOBALFOUNDRIES INC·Filed 2013·Granted Oct 3, 2017·7 cites·7 claims
- 0485US10245667B2Chip joining by induction heatingGLOBALFOUNDRIES INC·Filed 2017·Granted Apr 2, 2019·3 cites·8 claims
- 0585US9711422B2Visually detecting electrostatic discharge eventsGLOBALFOUNDRIES INC·Filed 2015·Granted Jul 18, 2017·4 cites·19 claims
- 0682US6901542B2Internal cache for on chip test data storageIBM·Filed 2001·Granted May 31, 2005·35 cites·33 claims
- 0781US9190375B2Solder bump reflow by induction heatingIBM·Filed 2014·Granted Nov 17, 2015·6 cites·20 claims
- 0877US9704830B1Semiconductor structure and method of makingIBM·Filed 2016·Granted Jul 11, 2017·2 cites·16 claims
- 0969US9105573B2Visually detecting electrostatic discharge eventsAYOTTE STEPHEN P·Filed 2012·Granted Aug 11, 2015·2 cites·21 claims
- 1066US8765593B2Controlled collapse chip connection (C4) structure and methods of formingAYOTTE STEPHEN P·Filed 2012·Granted Jul 1, 2014·2 cites·13 claims
- 1162US9059097B2Inhibiting propagation of imperfections in semiconductor devicesAYOTTE STEPHEN P·Filed 2012·Granted Jun 16, 2015·1 cites·9 claims
- 1258US6675323B2Incremental fault dictionaryIBM·Filed 2001·Granted Jan 6, 2004·8 cites·7 claims
- 1346US10050012B2Method for semiconductor die removal reworkIBM·Filed 2015·Granted Aug 14, 2018·0 cites·13 claims
- 1446US9645573B2Reliability monitor test strategy definitionIBM·Filed 2014·Granted May 9, 2017·0 cites·20 claims
- 1544US9177931B2Reducing thermal energy transfer during chip-join processingIBM·Filed 2014·Granted Nov 3, 2015·0 cites·19 claims
- 1643US10256204B2Separation of integrated circuit structure from adjacent chipGLOBALFOUNDRIES INC·Filed 2016·Granted Apr 9, 2019·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →