Inventor · disambiguated record
Glen Roeters
Also filed as: ROETERS GLEN · ROETERS GLEN E
13 granted patents·11 pending applications·360 citations·filing 1999–2006
93Inventor score
Files withHONEYWELL INT INC6STAKTEK GROUP LP4DPAC TECHNOLOGIES CORP3DENSE PAC MICROSYSTEMS INC A C1ROETERS GLEN E1
Top patents by PatentIndex Score
24 records- 0197US6878571B2Panel stacking of BGA devices to form three-dimensional modulesSTAKTEK GROUP LP·Filed 2002·Granted Apr 12, 2005·112 cites·6 claims
- 0295US6566746B2Panel stacking of BGA devices to form three-dimensional modulesDPAC TECHNOLOGIES CORP·Filed 2001·Granted May 20, 2003·71 cites·39 claims
- 0392US7193310B2Stacking system and methodSTAKTEK GROUP LP·Filed 2006·Granted Mar 20, 2007·21 cites·6 claims
- 0489US6431623B1Vacuum device for peeling off thin sheetsHONEYWELL INT INC·Filed 1999·Granted Aug 13, 2002·43 cites·13 claims
- 0588US7081373B2CSP chip stack with flex circuitSTAKTEK GROUP LP·Filed 2001·Granted Jul 25, 2006·42 cites·9 claims
- 0684US6573461B2Retaining ring interconnect used for 3-D stackingDPAC TECHNOLOGIES CORP·Filed 2001·Granted Jun 3, 2003·33 cites·10 claims
- 0772US6573460B2Post in ring interconnect using for 3-D stackingDPAC TECHNOLOGIES CORP·Filed 2001·Granted Jun 3, 2003·15 cites·9 claims
- 0864US6666810B1Device for controllable stretching of thin materialsHONEYWELL INT INC·Filed 2000·Granted Dec 23, 2003·4 cites·6 claims
- 0953US6489184B1Removing inherent stress via high temperature annealingHONEYWELL INT INC·Filed 2000·Granted Dec 3, 2002·3 cites·12 claims
- 1050US2004116266A1Device for controllable stretching of thin materialsFiled 2003·Application pending·0 cites
- 1149US6261423B1Sputtering processHONEYWELL INT INC·Filed 2000·Granted Jul 17, 2001·3 cites·11 claims
- 1247US2006113678A1CSP chip stack with flex circuitROETERS GLEN E·Filed 2006·Application pending·0 cites
- 1346US6856010B2Thin scale outline packageSTAKTEK GROUP LP·Filed 2003·Granted Feb 15, 2005·4 cites·14 claims
- 1441US2004152313A1Low species buffered rinsing fluids and methodsFiled 2003·Application pending·0 cites
- 1540US6153060ASputtering processHONEYWELL INT INC·Filed 1999·Granted Nov 28, 2000·8 cites·11 claims
- 1637US2003051903A1Retaining ring interconnect used for 3-D stackingDENSE PAC MICROSYSTEMS INC A C·Filed 2002·Application pending·0 cites
- 1736US2005048997A1Wireless connectivity moduleFiled 2003·Application pending·0 cites
- 1835US2003051911A1Post in ring interconnect using 3-D stackingFiled 2002·Application pending·0 cites
- 1932US2003002267A1I/O interface structureFiled 2002·Application pending·0 cites
- 2032US2002190367A1Slice interconnect structureFiled 2002·Application pending·0 cites
- 2132US2003085455A1Thermal ring used in 3-D stackingFiled 2001·Application pending·0 cites
- 2231US2004108583A1Thin scale outline package stackFiled 2002·Application pending·0 cites
- 2330US6652659B1Low species buffered rinsing fluids and methodHONEYWELL INT INC·Filed 1999·Granted Nov 25, 2003·1 cites·13 claims
- 2425US2002000370A1Ion processing of a substrateFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →