Inventor · disambiguated record
Gordon M. Grivna
Also filed as: GRIVNA GORDON · GRIVNA GORDON M
220 granted patents·15 pending applications·2,291 citations·filing 1991–2025
99Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC100SEMICONDUCTOR COMPONENTS IND56PLASMA THERM LLC21MOTOROLA INC14GRIVNA GORDON M11
Top patents by PatentIndex Score
235 records- 0198US11563091B2Semiconductor devices with dissimlar materials and methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Jan 24, 2023·4 cites·20 claims
- 0298US8012857B2Semiconductor die singulation methodSEMICONDUCTOR COMPONENTS IND·Filed 2010·Granted Sep 6, 2011·58 cites·15 claims
- 0398US7989319B2Semiconductor die singulation methodSEMICONDUCTOR COMPONENTS IND·Filed 2010·Granted Aug 2, 2011·60 cites·20 claims
- 0498US7985661B2Semiconductor die singulation methodSEMICONDUCTOR COMPONENTS IND·Filed 2010·Granted Jul 26, 2011·51 cites·19 claims
- 0598US7781310B2Semiconductor die singulation methodSEMICONDUCTOR COMPONENTS IND·Filed 2007·Granted Aug 24, 2010·55 cites·13 claims
- 0698US7253477B2Semiconductor device edge termination structureSEMICONDUCTOR COMPONENTS IND·Filed 2005·Granted Aug 7, 2007·118 cites·23 claims
- 0798US7176524B2Semiconductor device having deep trench charge compensation regions and methodSEMICONDUCTOR COMPONENTS IND·Filed 2005·Granted Feb 13, 2007·91 cites·20 claims
- 0897US10026605B2Method of reducing residual contamination in singulated semiconductor dieSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Jul 17, 2018·220 cites·23 claims
- 0997US9620585B1Termination for a stacked-gate super-junction MOSFETSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Apr 11, 2017·16 cites·10 claims
- 1097US9391135B1Semiconductor deviceSEMICONDUCTOR COMPONENTS IND·Filed 2015·Granted Jul 12, 2016·20 cites·14 claims
- 1197US8384231B2Method of forming a semiconductor dieSEMICONDUCTOR COMPONENTS IND·Filed 2010·Granted Feb 26, 2013·33 cites·16 claims
- 1297US7411266B2Semiconductor device having trench charge compensation regions and methodSEMICONDUCTOR COMPONENTS IND·Filed 2006·Granted Aug 12, 2008·61 cites·20 claims
- 1396US7579632B2Multi-channel ESD device and method thereforSEMICONDUCTOR COMPONENTS IND·Filed 2007·Granted Aug 25, 2009·62 cites·20 claims
- 1496US7482220B2Semiconductor device having deep trench charge compensation regions and methodSEMICONDUCTOR COMPONENTS IND·Filed 2006·Granted Jan 27, 2009·37 cites·11 claims
- 1596US7285823B2Superjunction semiconductor device structureSEMICONDUCTOR COMPONENTS IND·Filed 2005·Granted Oct 23, 2007·57 cites·18 claims
- 1696US7256119B2Semiconductor device having trench structures and methodSEMICONDUCTOR COMPONENTS IND·Filed 2005·Granted Aug 14, 2007·38 cites·20 claims
- 1795US10916474B2Method of reducing residual contamination in singulated semiconductor dieSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Feb 9, 2021·8 cites·20 claims
- 1895US9472458B2Method of reducing residual contamination in singulated semiconductor dieSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Oct 18, 2016·21 cites·20 claims
- 1995US8802545B2Method and apparatus for plasma dicing a semi-conductor waferJOHNSON CHRIS·Filed 2012·Granted Aug 12, 2014·15 cites·5 claims
- 2095US8785332B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA THERM LLC·Filed 2013·Granted Jul 22, 2014·15 cites·2 claims
- 2195US8664065B2Method of forming an insulated gate field effect transistor device having a shield electrode structureGRIVNA GORDON M·Filed 2012·Granted Mar 4, 2014·20 cites·19 claims
- 2295US8247296B2Method of forming an insulated gate field effect transistor device having a shield electrode structureGRIVNA GORDON M·Filed 2009·Granted Aug 21, 2012·37 cites·21 claims
- 2394US9570494B1Method for forming a semiconductor image sensor deviceSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Feb 14, 2017·15 cites·20 claims
- 2494US9136173B2Singulation method for semiconductor die having a layer of material along one major surfaceSEMICONDUCTOR COMPONENTS IND·Filed 2013·Granted Sep 15, 2015·12 cites·31 claims
- 2594US8981533B2Electronic device including a via and a conductive structure, a process of forming the same, and an interposerSEMICONDUCTOR COMPONENT IND LLC·Filed 2013·Granted Mar 17, 2015·20 cites·20 claims
- 2694US8466513B2Semiconductor device with enhanced mobility and methodGRIVNA GORDON M·Filed 2011·Granted Jun 18, 2013·16 cites·35 claims
- 2794US7679146B2Semiconductor device having sub-surface trench charge compensation regionsSEMICONDUCTOR COMPONENTS IND·Filed 2006·Granted Mar 16, 2010·28 cites·19 claims
- 2894US7282406B2Method of forming an MOS transistor and structure thereforSEMICONDUCTOR COMPANENTS IND L·Filed 2006·Granted Oct 16, 2007·58 cites·16 claims
- 2993US11784093B2Method of reducing residual contamination in singulated semiconductor dieSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Oct 10, 2023·2 cites·20 claims
- 3093US8859396B2Semiconductor die singulation methodGRIVNA GORDON M·Filed 2011·Granted Oct 14, 2014·12 cites·15 claims
- 3193US8778806B2Method and apparatus for plasma dicing a semi-conductor waferJOHNSON CHRIS·Filed 2012·Granted Jul 15, 2014·10 cites·12 claims
- 3293US8492260B2Processes of forming an electronic device including a feature in a trenchPARSEY JR JOHN MICHAEL·Filed 2010·Granted Jul 23, 2013·26 cites·21 claims
- 3392US9484210B2Semiconductor die singulation methodSEMICONDUCTOR COMPONENTS IND LLC·Filed 2015·Granted Nov 1, 2016·7 cites·44 claims
- 3492US9418894B2Electronic die singulation methodSEMICONDUCTOR COMPONENTS IND LLC·Filed 2014·Granted Aug 16, 2016·7 cites·20 claims
- 3592US8723238B1Method of forming a transistor and structure thereforPADMANABHAN BALAJI·Filed 2013·Granted May 13, 2014·17 cites·20 claims
- 3691US9711406B2Method and apparatus for plasma dicing a semi-conductor waferPLASMA-THERM LLC·Filed 2016·Granted Jul 18, 2017·6 cites·7 claims
- 3791US9299776B2Method of forming a semiconductor device including trench termination and trench structure thereforSEMICONDUCTOR COMPONENTS IND·Filed 2014·Granted Mar 29, 2016·10 cites·9 claims
- 3890US10090199B2Semiconductor device and method for supporting ultra-thin semiconductor dieSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Oct 2, 2018·4 cites·20 claims
- 3990US9117802B2Electronic device including a feature in an openingSEMICONDUCTOR COMPONENTS IND·Filed 2013·Granted Aug 25, 2015·9 cites·19 claims
- 4090US8106436B2Semiconductor trench structure having a sealing plugGRIVNA GORDON M·Filed 2011·Granted Jan 31, 2012·10 cites·20 claims
- 4190US7902601B2Semiconductor device having deep trench charge compensation regions and methodSEMICONDUCTOR COMPONENTS IND·Filed 2008·Granted Mar 8, 2011·13 cites·19 claims
- 4290US7300850B2Method of forming a self-aligned transistorSEMICONDUCTOR COMPONENTS IND·Filed 2005·Granted Nov 27, 2007·15 cites·9 claims
- 4389US9960265B1III-V semiconductor device and method thereforSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted May 1, 2018·5 cites·22 claims
- 4489US9484260B2Heated carrier substrate semiconductor die singulation methodSEMICONDUCTOR COMPONENTS IND LLC·Filed 2014·Granted Nov 1, 2016·7 cites·20 claims
- 4589US9070585B2Electronic device including a trench and a conductive structure therein and a process of forming the sameHOSSAIN ZIA·Filed 2012·Granted Jun 30, 2015·10 cites·20 claims
- 4689US8299560B2Electronic device including a buried insulating layer and a vertical conductive structure extending therethrough and a process of forming the sameLOECHELT GARY H·Filed 2010·Granted Oct 30, 2012·10 cites·21 claims
- 4789US7087925B2Semiconductor device having reduced capacitance to substrate and methodSEMICONDUCTOR COMPONENTS IND·Filed 2004·Granted Aug 8, 2006·42 cites·11 claims
- 4889US5641712AMethod and structure for reducing capacitance between interconnect linesMOTOROLA INC·Filed 1995·Granted Jun 24, 1997·120 cites·20 claims
- 4988US9165833B2Method of forming a semiconductor dieGRIVNA GORDON M·Filed 2010·Granted Oct 20, 2015·7 cites·7 claims
- 5088US7666751B2Method of forming a high capacitance diode and structure thereforSEMICONDUCTOR COMPONENTS IND·Filed 2007·Granted Feb 23, 2010·13 cites·11 claims
Showing the top 50 of 235 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →