Inventor · disambiguated record
Goji Shiga
Also filed as: SHIGA GOJI
30 granted patents·20 pending applications·51 citations·filing 2010–2018
95Inventor score
Top patents by PatentIndex Score
50 records- 0192US8722517B2Dicing tape-integrated film for semiconductor back surfaceTAKAMOTO NAOHIDE·Filed 2011·Granted May 13, 2014·7 cites·1 claims
- 0287US8986486B2Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device productionTAKAMOTO NAOHIDE·Filed 2011·Granted Mar 24, 2015·8 cites·3 claims
- 0382US8513816B2Film for flip chip type semiconductor back surface containing thermoconductive fillerTAKAMOTO NAOHIDE·Filed 2011·Granted Aug 20, 2013·5 cites·8 claims
- 0481US9478454B2Dicing tape-integrated film for semiconductor back surfaceNITTO DENKO CORP·Filed 2014·Granted Oct 25, 2016·2 cites·1 claims
- 0580US9659883B2Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor packageNITTO DENKO CORP·Filed 2014·Granted May 23, 2017·2 cites·11 claims
- 0675US8643194B2Dicing tape-integrated film for semiconductor back surfaceTAKAMOTO NAOHIDE·Filed 2011·Granted Feb 4, 2014·4 cites·10 claims
- 0774US8692389B2Dicing tape-integrated film for semiconductor back surfaceTAKAMOTO NAOHIDE·Filed 2010·Granted Apr 8, 2014·3 cites·5 claims
- 0873US8492907B2Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor deviceTAKAMOTO NAOHIDE·Filed 2011·Granted Jul 23, 2013·3 cites·8 claims
- 0969US8652938B2Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor deviceTAKAMOTO NAOHIDE·Filed 2011·Granted Feb 18, 2014·2 cites·9 claims
- 1068US9074113B2Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor deviceTAKAMOTO NAOHIDE·Filed 2011·Granted Jul 7, 2015·2 cites·5 claims
- 1168US8679931B2Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor deviceASAI FUMITERU·Filed 2011·Granted Mar 25, 2014·3 cites·8 claims
- 1268US8420509B2Film for flip chip type semiconductor back surfaceTAKAMOTO NAOHIDE·Filed 2010·Granted Apr 16, 2013·2 cites·6 claims
- 1367US9754894B2Sheet for sealing and method for manufacturing semiconductor device using said sheet for sealingNITTO DENKO CORP·Filed 2014·Granted Sep 5, 2017·2 cites·3 claims
- 1466US8450189B2Film for flip chip type semiconductor back surfaceSHIGA GOJI·Filed 2011·Granted May 28, 2013·2 cites·8 claims
- 1564US9761475B2Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device productionNITTO DENKO CORP·Filed 2015·Granted Sep 12, 2017·1 cites·3 claims
- 1662US9324616B2Method of manufacturing flip-chip type semiconductor deviceNITTO DENKO CORP·Filed 2013·Granted Apr 26, 2016·1 cites·3 claims
- 1761US8704382B2Film for flip chip type semiconductor back surfaceTAKAMOTO NAOHIDE·Filed 2010·Granted Apr 22, 2014·1 cites·6 claims
- 1854US10211083B2Film for flip chip type semiconductor back surface and its useNITTO DENKO CORP·Filed 2014·Granted Feb 19, 2019·0 cites·4 claims
- 1954US9362156B2Dicing tape-integrated film for semiconductor back surfaceNITTO DENKO CORP·Filed 2014·Granted Jun 7, 2016·0 cites·4 claims
- 2054US9293387B2Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor deviceKOMOTO YUSUKE·Filed 2011·Granted Mar 22, 2016·1 cites·6 claims
- 2154US9050773B2Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2013·Granted Jun 9, 2015·0 cites·4 claims
- 2253US9620403B2Adhesive sheet used in manufacture of semiconductor device, adhesive sheet integrated with dicing tape, semiconductor device, and method of manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2014·Granted Apr 11, 2017·0 cites·8 claims
- 2353US2012028050A1Film for flip chip type semiconductor back surface, process for producing strip film for semiconductor back surface, and flip chip type semiconductor deviceSHIGA GOJI·Filed 2011·Application pending·0 cites
- 2452US10297470B2Resin sheet for sealing electronic device and method for manufacturing electronic-device packageNITTO DENKO CORP·Filed 2014·Granted May 21, 2019·0 cites·12 claims
- 2552US2014159254A1Dicing tape-integrated film for semiconductor back surfaceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 2652US2018346640A1Film for flip chip type semiconductor back surface, process for producing strip film for semiconductor back surface, and flip chip type semiconductor deviceNITTO DENKO CORP·Filed 2018·Application pending·0 cites
- 2748US2016172230A1Dicing tape-integrated film for semiconductor back surface and method for producing the film, and method for producing semiconductor deviceNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 2848US2012028380A1Dicing tape-integrated film for semiconductor back surface and method for producing the film, and method for producing semiconductor deviceTAKAMOTO NAOHIDE·Filed 2011·Application pending·0 cites
- 2947US8455302B2Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor deviceSHIGA GOJI·Filed 2012·Granted Jun 4, 2013·0 cites·4 claims
- 3047US8404522B2Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor deviceSHIGA GOJI·Filed 2011·Granted Mar 26, 2013·0 cites·5 claims
- 3147US2012028416A1Film for flip chip type semiconductor back surface and its useTAKAMOTO NAOHIDE·Filed 2011·Application pending·0 cites
- 3246US10128131B2Sealing sheet with separators on both surfaces, and method for manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2014·Granted Nov 13, 2018·0 cites·4 claims
- 3346US9035466B2Dicing tape-integrated film for semiconductor back surfaceTAKAMOTO NAOHIDE·Filed 2010·Granted May 19, 2015·0 cites·3 claims
- 3444US9911683B2Film for back surface of flip-chip semiconductorTAKAMOTO NAOHIDE·Filed 2011·Granted Mar 6, 2018·0 cites·7 claims
- 3544US2016237288A1Sheet for sealing and method for manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 3643US2013328217A1Method of marking semiconductor element, method of manufacturing semiconductor device, and semiconductor deviceNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 3743US2018304603A1Bump base reinforcement sheetNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 3843US2014162434A1Dicing tape integrated adhesive sheet, method of manufacturing semiconductor device using dicing tape integrated adhesive sheet, and semiconductor deviceNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 3942US2017125373A1Method for producing semiconductor packageNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 4042US2017033076A1Production method for semiconductor packageNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 4142US2017032979A1Production method for semiconductor packageNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 4241US2013017396A1Adhesive film for semiconductor device, film for backside of flip-chip semiconductor, and dicing tape-integrated film for backside of semiconductorNITTO DENKO CORP·Filed 2012·Application pending·0 cites
- 4341US2017040287A1Electronic component device production method and electronic component sealing sheetNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 4441US2017040187A1Sealing sheet provided with double-sided separator, and method for manufacturing semiconductor deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 4540US9196533B2Film for back surface of flip-chip semiconductor, dicing-tape-integrated film for back surface of semiconductor, process for producing semiconductor device, and flip-chip semiconductor deviceTAKAMOTO NAOHIDE·Filed 2011·Granted Nov 24, 2015·0 cites·8 claims
- 4639US2012021174A1Film for flip chip type semiconductor back surface, and dicing tape-integrated film for semiconductor back surfaceTAKAMOTO NAOHIDE·Filed 2011·Application pending·0 cites
- 4738US10074582B2Sealing sheetNITTO DENKO CORP·Filed 2015·Granted Sep 11, 2018·0 cites·1 claims
- 4837US2017140948A1Semiconductor package manufacturing methodNITTO DENKO CORP·Filed 2016·Application pending·0 cites
- 4937US2013122688A1Pressure-sensitive adhesive sheet for dicing and method of manufacturing semiconductor device using pressure-sensitive adhesive sheet for dicingSASAKI TAKATOSHI·Filed 2012·Application pending·0 cites
- 5032US2017278716A1Sealing sheet, sealing sheet with separator, semiconductor device, and production method for semiconductor deviceNITTO DENKO CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →