Inventor · disambiguated record
Gregory George
Also filed as: GEORGE GREGORY · GEORGE GREGORY A
31 granted patents·4 pending applications·320 citations·filing 1995–2020
97Inventor score
Files withSUSS MICROTEC LITHOGRAPHY GMBH16GEORGE GREGORY10ATTIVIO INC3KARL SUSS AMERICA INC2HURLEY DANIEL T1
Top patents by PatentIndex Score
35 records- 0193US8551291B2Debonding equipment and methods for debonding temporary bonded wafersGEORGE GREGORY·Filed 2011·Granted Oct 8, 2013·16 cites·24 claims
- 0292US9507824B2Automated creation of join graphs for unrelated data sets among relational databasesATTIVIO INC·Filed 2015·Granted Nov 29, 2016·17 cites·36 claims
- 0392US8366873B2Debonding equipment and methods for debonding temporary bonded wafersSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2011·Granted Feb 5, 2013·14 cites·30 claims
- 0492US8267143B2Apparatus for mechanically debonding temporary bonded semiconductor wafersGEORGE GREGORY·Filed 2010·Granted Sep 18, 2012·23 cites·11 claims
- 0591US7948034B2Apparatus and method for semiconductor bondingSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2007·Granted May 24, 2011·27 cites·39 claims
- 0690US8147630B2Method and apparatus for wafer bonding with enhanced wafer matingGEORGE GREGORY·Filed 2009·Granted Apr 3, 2012·19 cites·13 claims
- 0788US8950459B2Debonding temporarily bonded semiconductor wafersSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2012·Granted Feb 10, 2015·10 cites·20 claims
- 0888US8139219B2Apparatus and method for semiconductor wafer alignmentGEORGE GREGORY·Filed 2009·Granted Mar 20, 2012·15 cites·36 claims
- 0986US6829988B2Nanoimprinting apparatus and methodSUSS MICROTEC INC·Filed 2003·Granted Dec 14, 2004·35 cites·27 claims
- 1085US9583374B2Debonding temporarily bonded semiconductor wafersSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2016·Granted Feb 28, 2017·4 cites·18 claims
- 1185US8764026B2Device for centering wafersGEORGE GREGORY·Filed 2010·Granted Jul 1, 2014·8 cites·8 claims
- 1281US9472437B2Debonding temporarily bonded semiconductor wafersSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2014·Granted Oct 18, 2016·4 cites·6 claims
- 1379US9916350B2Automated creation of join graphs for unrelated data sets among relational databasesATTIVIO INC·Filed 2016·Granted Mar 13, 2018·3 cites·20 claims
- 1479US9281229B2Method for thermal-slide debonding of temporary bonded semiconductor wafersSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2014·Granted Mar 8, 2016·3 cites·16 claims
- 1578US10825705B2Apparatus, system, and method for handling aligned wafer pairsSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2016·Granted Nov 3, 2020·2 cites·14 claims
- 1678US9837295B2Apparatus and method for semiconductor wafer leveling, force balancing and contact sensingSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2014·Granted Dec 5, 2017·3 cites·18 claims
- 1778US9159595B2Thin wafer carrierHURLEY DANIEL T·Filed 2011·Granted Oct 13, 2015·7 cites·21 claims
- 1876US9875917B2Semiconductor bonding apparatus and related techniquesSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2017·Granted Jan 23, 2018·2 cites·29 claims
- 1976US8919412B2Apparatus for thermal-slide debonding of temporary bonded semiconductor wafersGEORGE GREGORY·Filed 2010·Granted Dec 30, 2014·3 cites·15 claims
- 2074US5622400AApparatus and method for handling semiconductor wafersKARL SUSS AMERICA INC·Filed 1995·Granted Apr 22, 1997·49 cites·7 claims
- 2173US10825701B2Baking device for a wafer coated with a coating containing a solventSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2015·Granted Nov 3, 2020·2 cites·14 claims
- 2273US8425715B2Apparatus for high throughput wafer bondingGEORGE GREGORY·Filed 2011·Granted Apr 23, 2013·3 cites·17 claims
- 2369US11651983B2Apparatus, system, and method for handling aligned wafer pairsSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2020·Granted May 16, 2023·0 cites·16 claims
- 2469US9859141B2Apparatus and method for aligning and centering wafersSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2014·Granted Jan 2, 2018·2 cites·7 claims
- 2568US6178361B1Automatic modular wafer substrate handling deviceKARL SUSS AMERICA INC·Filed 1998·Granted Jan 23, 2001·47 cites·1 claims
- 2663US9064686B2Method and apparatus for temporary bonding of ultra thin wafersGEORGE GREGORY·Filed 2013·Granted Jun 23, 2015·1 cites·15 claims
- 2762US8574398B2Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafersGEORGE GREGORY·Filed 2011·Granted Nov 5, 2013·1 cites·16 claims
- 2855US10580678B2Apparatus and method for semiconductor wafer leveling, force balancing and contact sensingSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2017·Granted Mar 3, 2020·0 cites·3 claims
- 2954US9640418B2Apparatus, system, and method for handling aligned wafer pairsSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2016·Granted May 2, 2017·0 cites·20 claims
- 3053US10319615B2Semiconductor bonding apparatus and related techniquesSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2017·Granted Jun 11, 2019·0 cites·20 claims
- 3146US2007005665A1Separation of duties in a data audit systemLUMIGENT TECHNOLOGIES INC·Filed 2005·Application pending·0 cites
- 3246US2016055212A1Automatic joining of data sets based on statistics of field values in the data setsATTIVIO INC·Filed 2014·Application pending·0 cites
- 3344US11183401B2System and related techniques for handling aligned substrate pairsSUSS MICROTEC LITHOGRAPHY GMBH·Filed 2017·Granted Nov 23, 2021·0 cites·15 claims
- 3443US2015251396A1Method and apparatus for temporary bonding of ultra thin wafersGEORGE GREGORY·Filed 2015·Application pending·0 cites
- 3531US2015206783A1System amd method for substrate holdingJOHNSON HALE·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →