Inventor · disambiguated record
Gregory Kevern
Also filed as: KEVERN GREGORY · KEVERN GREGORY A
7 granted patents·1 pending application·53 citations·filing 2000–2007
84Inventor score
Top patents by PatentIndex Score
8 records- 0176US6834426B1Method of fabricating a laminate circuit structureIBM·Filed 2000·Granted Dec 28, 2004·18 cites·10 claims
- 0272US7332212B2Circuitized substrate with conductive polymer and seed material adhesion layerENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Feb 19, 2008·5 cites·6 claims
- 0370US6395998B1Electronic package having an adhesive retaining cavityIBM·Filed 2000·Granted May 28, 2002·18 cites·23 claims
- 0461US6669805B2Drill stack formationIBM·Filed 2001·Granted Dec 30, 2003·1 cites·14 claims
- 0554US7259333B2Composite laminate circuit structureIBM·Filed 2004·Granted Aug 21, 2007·4 cites·20 claims
- 0654US7063762B2Circuitized substrate and method of making sameENDICOTT INTERCONNECT TECH INC·Filed 2003·Granted Jun 20, 2006·6 cites·12 claims
- 0747US2008032155A1Drill stack formationJAPP ROBERT M·Filed 2007·Application pending·0 cites
- 0845US7329446B2Drill stack formationIBM·Filed 2003·Granted Feb 12, 2008·1 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →