Inventor · disambiguated record
Guan-Yu Chen
Also filed as: CHEN GUAN-YU
40 granted patents·23 pending applications·68 citations·filing 2008–2024
96Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD15IND TECH RES INST13ANIVANCE AI CORP5PROLIFIC TECHNOLOGY INC4TAIWAN SEMICONDUCTOR MFG4
Top patents by PatentIndex Score
63 records- 0192US11502032B2Chip package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 15, 2022·2 cites·20 claims
- 0292US11416666B1Integrated circuit and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 16, 2022·2 cites·20 claims
- 0392US8598639B2Si photodiode with symmetry layout and deep well bias in CMOS technologyHSIN YUE-MING·Filed 2011·Granted Dec 3, 2013·28 cites·13 claims
- 0491US10128195B2Substrate design with balanced metal and solder resist densityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 13, 2018·6 cites·20 claims
- 0588US9153550B2Substrate design with balanced metal and solder resist densityTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 6, 2015·7 cites·20 claims
- 0685US9659896B2Interconnect structures for wafer level package and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 23, 2017·4 cites·20 claims
- 0784US10630273B2Clock circuit having a pulse width adjustment moduleREALTEK SEMICONDUCTOR CORP·Filed 2019·Granted Apr 21, 2020·5 cites·20 claims
- 0878US9425117B2Substrate design with balanced metal and solder resist densityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 23, 2016·2 cites·20 claims
- 0978US9111817B2Bump structure and method of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Aug 18, 2015·2 cites·20 claims
- 1077US9306495B2Oscillator circuit and related methodTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 5, 2016·4 cites·20 claims
- 1175US11775726B2Integrated circuit having latch-up immunityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 3, 2023·0 cites·20 claims
- 1274US2023367947A1Integrated circuit having latch-up immunityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1371US10141378B2Light emitting device free of TFT and chipletIND TECH RES INST·Filed 2014·Granted Nov 27, 2018·2 cites·7 claims
- 1469US9559326B2Light emitting elementIND TECH RES INST·Filed 2015·Granted Jan 31, 2017·1 cites·11 claims
- 1568US9621158B2Switch and multiplexer including the sameREALTEK SEMICONDUCTOR CORP·Filed 2015·Granted Apr 11, 2017·2 cites·16 claims
- 1667US9812405B2Semiconductor package and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 7, 2017·1 cites·20 claims
- 1763US2025215150A1Carbonate-epoxy copolymer, curable carbonate composition, and manufacturing method of forming carbonate-containing thermosetSWANCOR INNOVATION & INCUBATION CO LTD·Filed 2024·Application pending·0 cites
- 1861US2025333682A1Dynamic hydrogel and pulmonary fibrosis bionic chipANIVANCE AI CORP·Filed 2024·Application pending·0 cites
- 1960US11795437B2Method for cultivating primary human pulmonary alveolar epithelial cells and application thereofNATIONAL YANG MING CHIAO TUNG UNIV·Filed 2021·Granted Oct 24, 2023·0 cites·3 claims
- 2060US2025368932A1System for mimicking cellular microenvironment and method for evaluating cell development or drug therapy effectiveness using the sameANIVANCE AI CORP·Filed 2024·Application pending·0 cites
- 2159US9966346B2Bump structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 8, 2018·0 cites·20 claims
- 2258US11956994B2OLED light field architecturesAPPLIED MATERIALS INC·Filed 2021·Granted Apr 9, 2024·0 cites·20 claims
- 2358US10872855B2Chip package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 22, 2020·0 cites·20 claims
- 2458US2017092898A1Light emitting elementIND TECH RES INST·Filed 2016·Application pending·0 cites
- 2558US2017125491A1Light emitting elementIND TECH RES INST·Filed 2017·Application pending·0 cites
- 2656US9570518B2Light emitting elementIND TECH RES INST·Filed 2014·Granted Feb 14, 2017·0 cites·21 claims
- 2756US9431351B2Semiconductor package and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 30, 2016·0 cites·20 claims
- 2856US2023044229A1Battery header cap and assembly method thereofADVANTI CO LTD·Filed 2022·Application pending·0 cites
- 2955US9472599B2Light emitting deviceIND TECH RES INST·Filed 2015·Granted Oct 18, 2016·0 cites·14 claims
- 3055US2015162560A1Light emitting deviceIND TECH RES INST·Filed 2013·Application pending·0 cites
- 3154US2023352404A1Interconnect structure patternTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3253US9899288B2Interconnect structures for wafer level package and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 20, 2018·0 cites·20 claims
- 3353US2014363471A1Method of inducing autophagy and activating toll-like receptorNAT UNIV TSING HUA·Filed 2013·Application pending·0 cites
- 3452US12031923B2Microwave moisture content sensor and method for deriving linear regression correlation between moisture content of object and signal measured by moisture content sensorFINETEK CO LTD·Filed 2021·Granted Jul 9, 2024·0 cites·10 claims
- 3552US9421224B2Method of inducing autophagy and activating toll-like receptorNAT UNIV TSING HUA·Filed 2015·Granted Aug 23, 2016·0 cites·9 claims
- 3652US9293404B2Pre-applying supporting materials between bonded package componentsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 22, 2016·0 cites·18 claims
- 3751US11732230B2Biomimetic systemUNIV NATIONAL CHIAO TUNG·Filed 2020·Granted Aug 22, 2023·0 cites·7 claims
- 3849US2020201093A1Polarizer module and operation method thereofAU OPTRONICS CORP·Filed 2019·Application pending·0 cites
- 3948US11803080B2Polarizer module and operation method thereofAU OPTRONICS CORP·Filed 2022·Granted Oct 31, 2023·0 cites·8 claims
- 4048US10366971B2Pre-applying supporting materials between bonded package componentsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 30, 2019·0 cites·20 claims
- 4148US10170827B2Housing structure having conductive adhesive antenna and conductive adhesive antenna thereofTENNVAC INC·Filed 2017·Granted Jan 1, 2019·0 cites·4 claims
- 4247US11231613B1Display apparatusAU OPTRONICS CORP·Filed 2021·Granted Jan 25, 2022·0 cites·7 claims
- 4346US9331302B2Blue light emitting device and light emitting deviceIND TECH RES INST·Filed 2015·Granted May 3, 2016·0 cites·42 claims
- 4445US2010323429A1Methods for purifying baculovirusHU YU-CHEN·Filed 2008·Application pending·0 cites
- 4544US12406764B2Method for determining ciliary beat frequencyANIVANCE AI CORP·Filed 2023·Granted Sep 2, 2025·0 cites·10 claims
- 4644US2025369966A1System and Method for Analyzing Image of Cell and/or Tissue, and Computer Readable Medium ThereofANIVANCE AI CORP·Filed 2024·Application pending·0 cites
- 4743US2011079708A1Silicon photodetection moduleHSIN YUE-MING·Filed 2010·Application pending·0 cites
- 4842US12400330B2Method of tracking movement of particles in bronchusANIVANCE AI CORP·Filed 2023·Granted Aug 26, 2025·0 cites·12 claims
- 4942US9741959B1Light emitting deviceIND TECH RES INST·Filed 2016·Granted Aug 22, 2017·0 cites·30 claims
- 5041US10043774B2Integrated circuit packaging substrate, semiconductor package, and manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 7, 2018·0 cites·20 claims
Showing the top 50 of 63 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →