Inventor · disambiguated record
Guilian Gao
Also filed as: GAO GUILIAN
110 granted patents·49 pending applications·2,712 citations·filing 1993–2025
99Inventor score
Files withADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC74INVENSAS CORP35INVENSAS BONDING TECH INC24TESSERA INC5FORD MOTOR CO4
Top patents by PatentIndex Score
159 records- 0198US12266640B2Molded direct bonded and interconnected stackADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Apr 1, 2025·4 cites·35 claims
- 0298US11955463B2Direct bonded stack structures for increased reliability and improved yield in microelectronicsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Apr 9, 2024·6 cites·55 claims
- 0398US11955445B2Metal pads over TSVADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Apr 9, 2024·5 cites·23 claims
- 0498US11860415B2Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnectsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Jan 2, 2024·9 cites·17 claims
- 0598US11855064B2Techniques for processing devicesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Dec 26, 2023·5 cites·32 claims
- 0698US11837582B2Molded direct bonded and interconnected stackADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Dec 5, 2023·14 cites·33 claims
- 0798US11764189B2Molded direct bonded and interconnected stackADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Sep 19, 2023·17 cites·30 claims
- 0898US11652083B2Processed stacked diesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted May 16, 2023·18 cites·29 claims
- 0998US11515279B2Low temperature bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Nov 29, 2022·10 cites·22 claims
- 1098US11393779B2Large metal pads over TSVINVENSAS BONDING TECH INC·Filed 2019·Granted Jul 19, 2022·58 cites·15 claims
- 1198US11355404B2Mitigating surface damage of probe pads in preparation for direct bonding of a substrateINVENSAS BONDING TECH INC·Filed 2020·Granted Jun 7, 2022·50 cites·22 claims
- 1298US11348801B2Processing stacked substratesINVENSAS BONDING TECH INC·Filed 2020·Granted May 31, 2022·7 cites·20 claims
- 1398US11296053B2Direct bonded stack structures for increased reliability and improved yield in microelectronicsINVENSAS BONDING TECH INC·Filed 2020·Granted Apr 5, 2022·41 cites·18 claims
- 1498US11296044B2Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processesINVENSAS BONDING TECH INC·Filed 2019·Granted Apr 5, 2022·80 cites·24 claims
- 1598US11169326B2Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnectsINVENSAS BONDING TECH INC·Filed 2019·Granted Nov 9, 2021·60 cites·22 claims
- 1698US11171117B2Interlayer connection of stacked microelectronic componentsINVENSAS BONDING TECH INC·Filed 2019·Granted Nov 9, 2021·155 cites·14 claims
- 1798US11158606B2Molded direct bonded and interconnected stackINVENSAS BONDING TECH INC·Filed 2019·Granted Oct 26, 2021·159 cites·35 claims
- 1898US11056390B2Structures and methods for reliable packagesINVENSAS CORP·Filed 2019·Granted Jul 6, 2021·38 cites·22 claims
- 1998US11037919B2Techniques for processing devicesINVENSAS BONDING TECH INC·Filed 2020·Granted Jun 15, 2021·88 cites·29 claims
- 2098US11011494B2Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronicsINVENSAS BONDING TECH INC·Filed 2018·Granted May 18, 2021·133 cites·36 claims
- 2198US10879212B2Processed stacked diesINVENSAS BONDING TECH INC·Filed 2018·Granted Dec 29, 2020·155 cites·21 claims
- 2298US10790262B2Low temperature bonded structuresINVENSAS BONDING TECH INC·Filed 2019·Granted Sep 29, 2020·160 cites·13 claims
- 2398US10727219B2Techniques for processing devicesINVENSAS BONDING TECH INC·Filed 2019·Granted Jul 28, 2020·90 cites·22 claims
- 2498US10707087B2Processing stacked substratesINVENSAS BONDING TECH INC·Filed 2017·Granted Jul 7, 2020·154 cites·21 claims
- 2598US10508030B2Seal for microelectronic assemblyINVENSAS BONDING TECH INC·Filed 2018·Granted Dec 17, 2019·124 cites·14 claims
- 2698US9824974B2Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assembliesINVENSAS CORP·Filed 2016·Granted Nov 21, 2017·54 cites·20 claims
- 2798US9741620B2Structures and methods for reliable packagesINVENSAS CORP·Filed 2015·Granted Aug 22, 2017·186 cites·20 claims
- 2898US9478504B1Microelectronic assemblies with cavities, and methods of fabricationINVENSAS CORP·Filed 2015·Granted Oct 25, 2016·64 cites·10 claims
- 2998US9397038B1Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substratesINVENSAS CORP·Filed 2015·Granted Jul 19, 2016·27 cites·25 claims
- 3097US12272677B2Direct bonded stack structures for increased reliability and improved yield in microelectronicsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Granted Apr 8, 2025·3 cites·21 claims
- 3197US12046571B2Low temperature bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Jul 23, 2024·3 cites·5 claims
- 3297US12009338B2Dimension compensation control for directly bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Jun 11, 2024·4 cites·20 claims
- 3397US11728313B2Offset pads over TSVADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Aug 15, 2023·4 cites·22 claims
- 3497US11114408B2System and method for providing 3D wafer assembly with known-good-diesINVENSAS CORP·Filed 2019·Granted Sep 7, 2021·20 cites·11 claims
- 3597US10998292B2Offset pads over TSVINVENSAS BONDING TECH INC·Filed 2019·Granted May 4, 2021·155 cites·13 claims
- 3697US10964664B2DBI to Si bonding for simplified handle waferINVENSAS BONDING TECH INC·Filed 2019·Granted Mar 30, 2021·153 cites·17 claims
- 3797US9735084B2Bond via array for thermal conductivityINVENSAS CORP·Filed 2014·Granted Aug 15, 2017·38 cites·20 claims
- 3896US12243851B2Offset pads over TSVADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Mar 4, 2025·2 cites·20 claims
- 3996US12132020B2Low temperature bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Oct 29, 2024·2 cites·4 claims
- 4096US12100676B2Low temperature bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Sep 24, 2024·2 cites·13 claims
- 4196US11791307B2DBI to SI bonding for simplified handle waferADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Oct 17, 2023·4 cites·31 claims
- 4296US11257727B2Seal for microelectronic assemblyINVENSAS BONDING TECH INC·Filed 2019·Granted Feb 22, 2022·9 cites·20 claims
- 4395US12300662B2DBI to SI bonding for simplified handle waferADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Granted May 13, 2025·2 cites·20 claims
- 4495US12205926B2TSV as padADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Jan 21, 2025·1 cites·22 claims
- 4595US11978681B2Mitigating surface damage of probe pads in preparation for direct bonding of a substrateADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted May 7, 2024·2 cites·31 claims
- 4695US11749645B2TSV as padADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2019·Granted Sep 5, 2023·8 cites·22 claims
- 4795US11417576B2Seal for microelectronic assemblyINVENSAS BONDING TECH INC·Filed 2019·Granted Aug 16, 2022·7 cites·19 claims
- 4895US7719121B2Microelectronic packages and methods thereforTESSERA INC·Filed 2006·Granted May 18, 2010·45 cites·38 claims
- 4994US12406975B2Techniques for processing devicesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Sep 2, 2025·1 cites·20 claims
- 5094US12068278B2Processed stacked diesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Aug 20, 2024·1 cites·21 claims
Showing the top 50 of 159 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →