Inventor · disambiguated record
Guan-Kai Huang
Also filed as: HUANG GUAN-KAI
7 granted patents·4 pending applications·20 citations·filing 2013–2024
77Inventor score
Top patents by PatentIndex Score
11 records- 0197US11296214B2High electron mobility transistor (HEMT) and forming method thereofUNITED MICROELECTRONICS CORP·Filed 2019·Granted Apr 5, 2022·18 cites·12 claims
- 0288US11631761B2High electron mobility transistor (HEMT) and forming method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Apr 18, 2023·1 cites·7 claims
- 0373US11705512B2High electron mobility transistor (HEMT) and forming method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jul 18, 2023·0 cites·8 claims
- 0467US12493012B2Sensor device and method for making the sameUNIV NAT TSING HUA·Filed 2022·Granted Dec 9, 2025·0 cites·11 claims
- 0564US9048246B2Die seal ring and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jun 2, 2015·1 cites·19 claims
- 0662US11605631B23D semiconductor structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Mar 14, 2023·0 cites·5 claims
- 0759US11195831B23D semiconductor structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Dec 7, 2021·0 cites·11 claims
- 0858US2025351508A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0957US2025176208A1Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1054US2024266209A1Semiconductor device and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1140US2020194301A1Metal interconnection and forming method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →