Inventor · disambiguated record
Gunther Mackh
Also filed as: MACKH GUNTHER
26 granted patents·6 pending applications·37 citations·filing 2002–2025
93Inventor score
Top patents by PatentIndex Score
32 records- 0183US9040389B2Singulation processesINFINEON TECHNOLOGIES AG·Filed 2012·Granted May 26, 2015·8 cites·29 claims
- 0280US9570352B2Method of dicing a wafer and semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 14, 2017·3 cites·15 claims
- 0380US2025357214A1Chip separation supported by back side trench and adhesive thereinINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0476US8951915B2Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangementsHESS REINHARD·Filed 2012·Granted Feb 10, 2015·6 cites·14 claims
- 0574US9147624B2Chip comprising a backside metal stackINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 29, 2015·2 cites·13 claims
- 0673US8697574B2Through substrate features in semiconductor substratesMACKH GUNTHER·Filed 2009·Granted Apr 15, 2014·5 cites·25 claims
- 0772US10748801B2Carrier arrangement and method for processing a carrier by generating a crack structureINFINEON TECHNOLOGIES AG·Filed 2018·Granted Aug 18, 2020·1 cites·13 claims
- 0871US12424495B2Chip separation supported by back side trench and adhesive thereinINFINEON TECHNOLOGIES AG·Filed 2022·Granted Sep 23, 2025·0 cites·17 claims
- 0965US9159620B2Semiconductor structure and method for making sameINFINEON TECHNOLOGIES AG·Filed 2014·Granted Oct 13, 2015·1 cites·13 claims
- 1063US12374632B2Semiconductor device and method for manufacturing a plurality of semiconductive devicesINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 1162US8436707B2System and method for integrated inductorAHRENS CARSTEN·Filed 2010·Granted May 7, 2013·1 cites·29 claims
- 1260US8809165B2Method for fusing a laser fuse and method for processing a waferMACKH GUNTHER·Filed 2012·Granted Aug 19, 2014·1 cites·30 claims
- 1358US8822329B2Method for making conductive interconnectsLEUSCHNER RAINER·Filed 2009·Granted Sep 2, 2014·1 cites·23 claims
- 1455US12406940B2Semiconductor chip having a crack stop structureINFINEON TECHNOLOGIES AG·Filed 2022·Granted Sep 2, 2025·0 cites·13 claims
- 1555US2024145408A1Chip with crack guiding structure combined with crack stop structureINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1654US10008318B2System and method for integrated inductorINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jun 26, 2018·0 cites·13 claims
- 1754US2023066813A1Wafer, electronic component and method using laser penetration affecting structureINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1853US10600701B2Wafer and method for processing a waferINFINEON TECHNOLOGIES AG·Filed 2018·Granted Mar 24, 2020·0 cites·20 claims
- 1953US8785234B2Method for manufacturing a plurality of chipsINFINEON TECHNOLOGIES AG·Filed 2012·Granted Jul 22, 2014·0 cites·24 claims
- 2052US9040354B2Chip comprising a fill structureINFINEON TECHNOLOGIES AG·Filed 2014·Granted May 26, 2015·0 cites·28 claims
- 2152US2013239404A1System and Method for Integrated InductorINFINEON TECHNOLOGIES AG·Filed 2013·Application pending·0 cites
- 2250US9911655B2Method of dicing a wafer and semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2016·Granted Mar 6, 2018·0 cites·20 claims
- 2349US9196670B2Through substrate features in semiconductor substratesINFINEON TECHNOLOGIES AG·Filed 2014·Granted Nov 24, 2015·0 cites·27 claims
- 2447US10090214B2Wafer and method for processing a waferINFINEON TECHNOLOGIES AG·Filed 2012·Granted Oct 2, 2018·0 cites·27 claims
- 2547US8704338B2Chip comprising a fill structureMACKH GUNTHER·Filed 2011·Granted Apr 22, 2014·0 cites·19 claims
- 2647US7660175B2Integrated circuit, method for acquiring data and measurement systemINFINEON TECHNOLOGIES AG·Filed 2008·Granted Feb 9, 2010·3 cites·25 claims
- 2746US9576875B2Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangementsINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 21, 2017·0 cites·11 claims
- 2846US6884688B2Method for producing a MOS transistor and MOS transistorINFINEON TECHNOLOGIES AG·Filed 2002·Granted Apr 26, 2005·3 cites·8 claims
- 2943US7816791B2Bonding pad for contacting a deviceINFINEON TECHNOLOGIES AG·Filed 2007·Granted Oct 19, 2010·0 cites·21 claims
- 3043US7202527B2MOS transistor and ESD protective device each having a settable voltage ratio of the lateral breakdown voltage to the vertical breakdown voltageINFINEON TECHNOLOGIES AG·Filed 2004·Granted Apr 10, 2007·2 cites·10 claims
- 3141US2014217577A1Semiconductor Device and Method for Manufacturing a Semiconductor DeviceINFINEON TECHNOLOGIES AG·Filed 2013·Application pending·0 cites
- 3238US2020043562A1Method for programming a one-time programmable structure, semiconductor component and radio frequency componentINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →