Inventor · disambiguated record
Guan Huei See
Also filed as: SEE GUAN HUEI
48 granted patents·19 pending applications·134 citations·filing 2013–2025
97Inventor score
Top patents by PatentIndex Score
67 records- 0198US10229827B2Method of redistribution layer formation for advanced packaging applicationsAPPLIED MATERIALS INC·Filed 2017·Granted Mar 12, 2019·33 cites·13 claims
- 0298US10211072B2Method of reconstituted substrate formation for advanced packaging applicationsAPPLIED MATERIALS INC·Filed 2017·Granted Feb 19, 2019·37 cites·17 claims
- 0396US9472512B1Integrated circuits with contacts through a buried oxide layer and methods of producing the sameGLOBALFOUNDRIES SG PTE LTD·Filed 2015·Granted Oct 18, 2016·29 cites·20 claims
- 0495US11715700B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2021·Granted Aug 1, 2023·2 cites·20 claims
- 0595US11417605B2Reconstituted substrate for radio frequency applicationsAPPLIED MATERIALS INC·Filed 2020·Granted Aug 16, 2022·6 cites·20 claims
- 0693US11854886B2Methods of TSV formation for advanced packagingAPPLIED MATERIALS INC·Filed 2022·Granted Dec 26, 2023·2 cites·6 claims
- 0789US11404318B2Methods of forming through-silicon vias in substrates for advanced packagingAPPLIED MATERIALS INC·Filed 2020·Granted Aug 2, 2022·2 cites·20 claims
- 0887US2024404960A1Reconstituted substrate for radio frequency applicationsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0985US12354968B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 1084US9087906B2Grounding of silicon-on-insulator structureGLOBALFOUNDRIES SG PTE LTD·Filed 2014·Granted Jul 21, 2015·6 cites·23 claims
- 1181US2025391809A1Procedure to enable die rework for hybrid bondingAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1280US12374586B2Methods of TSV formation for advanced packagingAPPLIED MATERIALS INC·Filed 2023·Granted Jul 29, 2025·0 cites·20 claims
- 1379US12087571B2Methods, systems, and apparatus for tape-frame substrate cleaning and dryingAPPLIED MATERIALS INC·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 1478US12051653B2Reconstituted substrate for radio frequency applicationsAPPLIED MATERIALS INC·Filed 2022·Granted Jul 30, 2024·0 cites·20 claims
- 1578US10002771B1Methods for chemical mechanical polishing (CMP) processing with ozoneAPPLIED MATERIALS INC·Filed 2017·Granted Jun 19, 2018·3 cites·20 claims
- 1675US10515927B2Methods and apparatus for semiconductor package processingAPPLIED MATERIALS INC·Filed 2017·Granted Dec 24, 2019·2 cites·17 claims
- 1774US11476202B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2020·Granted Oct 18, 2022·0 cites·20 claims
- 1874US11398433B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2020·Granted Jul 26, 2022·0 cites·19 claims
- 1973US11264333B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2020·Granted Mar 1, 2022·0 cites·20 claims
- 2071US10020394B2Extended drain metal-oxide-semiconductor transistorGLOBALFOUNDRIES SG PTE LTD·Filed 2018·Granted Jul 10, 2018·1 cites·20 claims
- 2170US11837464B2Methods, systems, and apparatus for tape-frame substrate cleaning and dryingAPPLIED MATERIALS INC·Filed 2022·Granted Dec 5, 2023·0 cites·11 claims
- 2270US11355358B2Methods of thinning silicon on epoxy mold compound for radio frequency (RF) applicationsAPPLIED MATERIALS INC·Filed 2019·Granted Jun 7, 2022·1 cites·19 claims
- 2370US10319601B2Slurry for polishing of integrated circuit packagingAPPLIED MATERIALS INC·Filed 2017·Granted Jun 11, 2019·1 cites·15 claims
- 2469US12417998B2Procedure to enable die rework for hybrid bondingAPPLIED MATERIALS INC·Filed 2022·Granted Sep 16, 2025·0 cites·16 claims
- 2569US11373803B2Method of forming a magnetic core on a substrateAPPLIED MATERIALS INC·Filed 2018·Granted Jun 28, 2022·1 cites·17 claims
- 2669US10276424B2Method and apparatus for wafer level packagingAPPLIED MATERIALS INC·Filed 2017·Granted Apr 30, 2019·1 cites·20 claims
- 2768US9899514B2Extended drain metal-oxide-semiconductor transistorGLOBALFOUNDRIES SG PTE LTD·Filed 2016·Granted Feb 20, 2018·1 cites·20 claims
- 2867US11791094B2Semiconductor substrate having magnetic core inductorAPPLIED MATERIALS INC·Filed 2021·Granted Oct 17, 2023·0 cites·19 claims
- 2967US11421316B2Methods and apparatus for controlling warpage in wafer level packaging processesAPPLIED MATERIALS INC·Filed 2019·Granted Aug 23, 2022·1 cites·15 claims
- 3066US12495582B2Self-aligned wide backside power rail contacts to multiple transistor sourcesAPPLIED MATERIALS INC·Filed 2022·Granted Dec 9, 2025·0 cites·20 claims
- 3165US11309278B2Methods for bonding substratesAPPLIED MATERIALS INC·Filed 2019·Granted Apr 19, 2022·1 cites·18 claims
- 3264US12424446B2Silicon (Si) dry etch for die-to-wafer thinningAPPLIED MATERIALS INC·Filed 2022·Granted Sep 23, 2025·0 cites·18 claims
- 3363US9685364B2Silicon-on-insulator integrated circuit devices with body contact structures and methods for fabricating the sameGLOBALFOUNDRIES SG PTE LTD·Filed 2014·Granted Jun 20, 2017·1 cites·17 claims
- 3462US9954051B2Structure and method of fabricating three-dimensional (3D) metal-insulator-metal (MIM) capacitor and resistor in semi-additive plating metal wiringSEE GUAN HUEI·Filed 2016·Granted Apr 24, 2018·1 cites·21 claims
- 3560US9922868B2Integrated circuits using silicon on insulator substrates and methods of manufacturing the sameGLOBALFOUNDRIES SG PTE LTD·Filed 2015·Granted Mar 20, 2018·1 cites·12 claims
- 3660US2025364349A1Dummy features for dissipating heat in packages including advanced semiconductor chipsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3759US2019181019A1Method of reconstituted substrate formation for advanced packaging applicationsAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 3858US2024390950A1Method and apparatus for substrate cleaning in stack-die hybrid bonding processAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 3957US8946819B2Silicon-on-insulator integrated circuits with local oxidation of silicon and methods for fabricating the sameGLOBALFOUNDRIES SG PTE LTD·Filed 2013·Granted Feb 3, 2015·1 cites·20 claims
- 4056US12138742B2Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2021·Granted Nov 12, 2024·0 cites·20 claims
- 4156US2025167167A1Die Stacking with Integrated Thermal TreatmentAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 4256US2024110284A1Selective Deposition of Thin Films with Improved StabilityAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4356US2024379411A1Embedding redistribution layer metal traces in a polymeric dielectricAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4455US12237186B2On-board cleaning of tooling parts in hybrid bonding toolAPPLIED MATERIALS INC·Filed 2022·Granted Feb 25, 2025·0 cites·14 claims
- 4555US12001193B2Apparatus for environmental control of dies and substrates for hybrid bondingAPPLIED MATERIALS INC·Filed 2022·Granted Jun 4, 2024·0 cites·19 claims
- 4655US2024266319A1Method of Multi-layer Die Stacking with Die-to-Wafer BondingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4754US11899376B1Methods for forming alignment marksAPPLIED MATERIALS INC·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 4854US2025062129A1DIE BACKSIDE PROFILE for SEMICONDUCTOR DEVICESAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4954US2023045597A1Methods and apparatus for minimizing voids for chip on wafer componentsAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 5051US12020992B2Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2022·Granted Jun 25, 2024·0 cites·20 claims
Showing the top 50 of 67 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →