Inventor · disambiguated record
Guido Strotmann
Also filed as: STROTMANN GUIDO
9 granted patents·5 pending applications·38 citations·filing 2005–2024
84Inventor score
Top patents by PatentIndex Score
14 records- 0186US8360300B1Method and apparatus for ultrasonic weldingINFINEON TECHNOLOGIES AG·Filed 2011·Granted Jan 29, 2013·12 cites·8 claims
- 0278US8317078B1Method and apparatus for ultrasonic welding or bondingSTROTMANN GUIDO·Filed 2011·Granted Nov 27, 2012·11 cites·14 claims
- 0375US8586420B2Power semiconductor arrangement and method for producing a power semiconductor arrangementSTOLZE THILO·Filed 2011·Granted Nov 19, 2013·4 cites·18 claims
- 0474US8563364B2Method for producing a power semiconductor arrangementSTOLZE THILO·Filed 2011·Granted Oct 22, 2013·4 cites·25 claims
- 0572US9768035B2Electronic module and method for producing an electronic moduleINFINEON TECHNOLOGIES AG·Filed 2015·Granted Sep 19, 2017·2 cites·17 claims
- 0666US7986034B2Power semiconductor module and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jul 26, 2011·4 cites·29 claims
- 0759US2025047049A1Methods for connecting two connection partnersINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0857US2024162048A1Method for forming a power semiconductor module arrangementINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0953US8222741B2Semiconductor module with current connection elementBAYERER REINHOLD·Filed 2007·Granted Jul 17, 2012·1 cites·15 claims
- 1042US2009127317A1Device and method for producing a bonding connectionINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
- 1139US10092974B2Method for producing a circuit carrier and for connecting an electrical conductor to a metallization layer of a circuit carrierINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 9, 2018·0 cites·12 claims
- 1239US2006076389A1Method and apparatus for controlling and monitoring a brazing processKEMPER ALFRED·Filed 2005·Application pending·0 cites
- 1334US2019356098A1Method for Bonding an Electrically Conductive Element to a Bonding PartnerINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 1427US8941035B2Soldering methodSTROTMANN GUIDO·Filed 2011·Granted Jan 27, 2015·0 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →