Inventor · disambiguated record
Guangbi Yuan
Also filed as: Yuan Guangbi
10 granted patents·4 pending applications·118 citations·filing 2016–2023
88Inventor score
Files withLAM RES CORP14
Top patents by PatentIndex Score
14 records- 0197US9837270B1Densification of silicon carbide film using remote plasma treatmentLAM RES CORP·Filed 2016·Granted Dec 5, 2017·62 cites·19 claims
- 0296US11365479B2Ex situ coating of chamber components for semiconductor processingLAM RES CORP·Filed 2020·Granted Jun 21, 2022·8 cites·16 claims
- 0396US10297442B2Remote plasma based deposition of graded or multi-layered silicon carbide filmLAM RES CORP·Filed 2016·Granted May 21, 2019·22 cites·20 claims
- 0494US12227837B2Ex situ coating of chamber components for semiconductor processingLAM RES CORP·Filed 2022·Granted Feb 18, 2025·2 cites·19 claims
- 0594US10760158B2Ex situ coating of chamber components for semiconductor processingLAM RES CORP·Filed 2018·Granted Sep 1, 2020·14 cites·23 claims
- 0689US11848199B2Doped or undoped silicon carbide deposition and remote hydrogen plasma exposure for gapfillLAM RES CORP·Filed 2019·Granted Dec 19, 2023·4 cites·31 claims
- 0787US11761079B2Oxidation resistant protective layer in chamber conditioningLAM RES CORP·Filed 2018·Granted Sep 19, 2023·5 cites·14 claims
- 0882US12300488B2Doped or undoped silicon carbide deposition and remote hydrogen plasma exposure for gapfillLAM RES CORP·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 0979US12163219B2Ex situ coating of chamber components for semiconductor processingLAM RES CORP·Filed 2022·Granted Dec 10, 2024·0 cites·19 claims
- 1072US2022238333A1Doped or undoped silicon carbide deposition and remote hydrogen plasma exposure for gapfillLAM RES CORP·Filed 2022·Application pending·0 cites
- 1172US2022238334A1Doped or undoped silicon carbide deposition and remote hydrogen plasma exposure for gapfillLAM RES CORP·Filed 2022·Application pending·0 cites
- 1270US11702748B2Wafer level uniformity control in remote plasma film depositionLAM RES CORP·Filed 2017·Granted Jul 18, 2023·1 cites·8 claims
- 1369US2023304156A1Wafer level uniformity control in remote plasma film depositionLAM RES CORP·Filed 2023·Application pending·0 cites
- 1445US2022235463A1SixNy AS A NUCLEATION LAYER FOR SiCxOyLAM RES CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →