Inventor · disambiguated record
Guoqiang Zhang
Also filed as: ZHANG GUOQIANG · ZHANG GUOQIANG DAVID
10 granted patents·4 pending applications·108 citations·filing 1999–2021
87Inventor score
Files withMEMC ELECTRONIC MATERIALS6NIPPON TELEGRAPH & TELEPHONE3ERK HENRY F2UNIV KENT STATE OHIO2ALBRECHT PETER D1
Top patents by PatentIndex Score
14 records- 0191US7323421B2Silicon wafer etching process and compositionMEMC ELECTRONIC MATERIALS·Filed 2005·Granted Jan 29, 2008·26 cites·17 claims
- 0287US6709981B2Method and apparatus for processing a semiconductor wafer using novel final polishing methodMEMC ELECTRONIC MATERIALS·Filed 2001·Granted Mar 23, 2004·52 cites·48 claims
- 0373US8192248B2Semiconductor wafer polishing apparatus and method of polishingALBRECHT PETER D·Filed 2008·Granted Jun 5, 2012·6 cites·17 claims
- 0468US8054413B2Stressed liquid crystals materials for light modulationUNIV KENT STATE OHIO·Filed 2009·Granted Nov 8, 2011·2 cites·26 claims
- 0566US7595850B2Stressed liquid crystals materials for light modulationUNIV KENT STATE OHIO·Filed 2005·Granted Sep 29, 2009·2 cites·18 claims
- 0659US8309464B2Methods for etching the edge of a silicon waferERK HENRY F·Filed 2009·Granted Nov 13, 2012·1 cites·45 claims
- 0759US8192822B2Edge etched silicon wafersERK HENRY F·Filed 2009·Granted Jun 5, 2012·1 cites·21 claims
- 0855US6179950B1Polishing pad and process for forming sameMEMC ELECTRONIC MATERIALS·Filed 1999·Granted Jan 30, 2001·18 cites·10 claims
- 0954US7938982B2Silicon wafer etching compositionsMEMC ELECTRONIC MATERIALS·Filed 2008·Granted May 10, 2011·0 cites·14 claims
- 1051US2024405513A1Nanowire laser and manufacturing method thereforNIPPON TELEGRAPH & TELEPHONE·Filed 2021·Application pending·0 cites
- 1146US12155012B2Nanowire optical deviceNIPPON TELEGRAPH & TELEPHONE·Filed 2019·Granted Nov 26, 2024·0 cites·11 claims
- 1237US2004038544A1Method for processing a semiconductor wafer using double-side polishingMEMC ELECTRONIC MATERIALS·Filed 2003·Application pending·0 cites
- 1337US2021238749A1Method for fabricating gold fine particlesNIPPON TELEGRAPH & TELEPHONE·Filed 2019·Application pending·0 cites
- 1436US2004108297A1Process for etching silicon wafersMEMC ELECTRONIC MATERIALS·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →