Inventor · disambiguated record
Gwo-Shyan Sheu
Also filed as: SHEU GWO-SHYAN
10 granted patents·8 pending applications·4 citations·filing 2011–2024
77Inventor score
Top patents by PatentIndex Score
18 records- 0186US11322437B2Flip chip interconnection and circuit board thereofCHIPBOND TECHNOLOGY CORP·Filed 2020·Granted May 3, 2022·2 cites·19 claims
- 0258US8497571B2Thin flip chip package structureHSIEH CHIN-TANG·Filed 2011·Granted Jul 30, 2013·2 cites·6 claims
- 0356US2025157970A1Flip chip structure and circuit board thereofCHIPBOND TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0455US10999928B1Circuit boardCHIPBOND TECHNOLOGY CORP·Filed 2020·Granted May 4, 2021·0 cites·13 claims
- 0554US2025220807A1Test padCHIPBOND TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0654US2025159801A1Flexible circuit boardCHIPBOND TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0752US11309238B2Layout structure of a flexible circuit boardCHIPBOND TECHNOLOGY CORP·Filed 2021·Granted Apr 19, 2022·0 cites·16 claims
- 0852US2025071889A1Flexible circuit boardCHIPBOND TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 0951US11606860B2Flexible circuit boardCHIPBOND TECHNOLOGY CORP·Filed 2021·Granted Mar 14, 2023·0 cites·16 claims
- 1051US2024074041A1Circuit boardCHIPBOND TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 1149US12412825B2Semiconductor packageCHIPBOND TECHNOLOGY CORP·Filed 2022·Granted Sep 9, 2025·0 cites·18 claims
- 1249US11812554B2Layout structure of a flexible circuit boardCHIPBOND TECHNOLOGY CORP·Filed 2021·Granted Nov 7, 2023·0 cites·10 claims
- 1348US11581283B2Flip chip package and circuit board thereofCHIPBOND TECHNOLOGY CORP·Filed 2020·Granted Feb 14, 2023·0 cites·17 claims
- 1447US2023044345A1Layout structure of flexible circuit boardCHIPBOND TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 1545US10993319B1Chip package and circuit board thereofCHIPBOND TECHNOLOGY CORP·Filed 2020·Granted Apr 27, 2021·0 cites·15 claims
- 1644US2021257287A1Chip package and circuit board thereofCHIPBOND TECHNOLOGY CORP·Filed 2020·Application pending·0 cites
- 1742US2021204401A1Flexible circuit board having a stiffening structureCHIPBOND TECHNOLOGY CORP·Filed 2020·Application pending·0 cites
- 1834US8471372B2Thin flip chip package structureHSIEH CHIN-TANG·Filed 2011·Granted Jun 25, 2013·0 cites·7 claims
Join the waitlist — get patent alerts
Get an alert when Gwo-Shyan Sheu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →