Inventor · disambiguated record
Gwo-Liang Weng
Also filed as: WENG GWO-LIANG
19 granted patents·8 pending applications·619 citations·filing 2000–2014
95Inventor score
Technology areasH10W
Top patents by PatentIndex Score
27 records- 0196US7642133B2Method of making a semiconductor package and method of making a semiconductor deviceADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jan 5, 2010·183 cites·25 claims
- 0296US7589408B2Stackable semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Sep 15, 2009·59 cites·20 claims
- 0396US7550832B2Stackable semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jun 23, 2009·56 cites·13 claims
- 0496US7061079B2Chip package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jun 13, 2006·144 cites·19 claims
- 0594US7365427B2Stackable semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Apr 29, 2008·43 cites·8 claims
- 0691US7187067B2Sensor chip packaging structureADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Mar 6, 2007·34 cites·15 claims
- 0782US6815833B2Flip chip packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Nov 9, 2004·33 cites·50 claims
- 0875US7187070B2Stacked package moduleADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Mar 6, 2007·22 cites·16 claims
- 0970US6257857B1Molding apparatus for flexible substrate based packageADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Jul 10, 2001·15 cites·2 claims
- 1069US7122893B2Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Oct 17, 2006·16 cites·20 claims
- 1168US7547962B2Chip package with a ring having a buffer groove that surrounds the active region of a chipADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Jun 16, 2009·4 cites·6 claims
- 1266US7193282B2Contact sensor packageADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Mar 20, 2007·3 cites·9 claims
- 1358US6465277B2Molding apparatus and molding method for flexible substrate based packageADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Oct 15, 2002·7 cites·2 claims
- 1448US2014312496A1Semiconductor package and semiconductor deviceADVANCED SEMICONDUCTOR ENG·Filed 2014·Application pending·0 cites
- 1546US7989937B2Package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Aug 2, 2011·0 cites·15 claims
- 1645US7442580B2Manufacturing method of a package structureADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Oct 28, 2008·0 cites·8 claims
- 1744US2008023816A1Semiconductor packageWENG GWO-LIANG·Filed 2007·Application pending·0 cites
- 1844US2005181543A1Semiconductor package module and manufacturing method thereofFiled 2005·Application pending·0 cites
- 1944US2008105962A1Chip packageADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 2043US7439619B2Electronic package structure and the packaging process thereofADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Oct 21, 2008·0 cites·7 claims
- 2143US7432127B2Chip package and package process thereofADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Oct 7, 2008·0 cites·3 claims
- 2241US7195956B2Method for balancing molding flow during the assembly of semiconductor packages with defective carrying unitsADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Mar 27, 2007·0 cites·20 claims
- 2341US2006091513A1Chip package having flat transmission surface of transparent molding compound and method for manufacturing the sameWENG GWO-LIANG·Filed 2005·Application pending·0 cites
- 2439US7126221B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Oct 24, 2006·0 cites·7 claims
- 2539US2004113266A1[semiconductor package module and manufacturing mehod thereof]Filed 2003·Application pending·0 cites
- 2637US2007252284A1Stackable semiconductor packageSU PO-CHING·Filed 2006·Application pending·0 cites
- 2737US2004080036A1System in package structureADVANCED SEMICONDUCTOR ENG·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →