Inventor · disambiguated record
Gyuho Kang
Also filed as: KANG GYUHO
12 granted patents·13 pending applications·12 citations·filing 2021–2025
84Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD25
Top patents by PatentIndex Score
25 records- 0197US11676887B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·8 cites·20 claims
- 0293US11742271B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 29, 2023·4 cites·20 claims
- 0382US2025343146A1Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0478US2025015009A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0576US12381151B2Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 5, 2025·0 cites·20 claims
- 0676US12119306B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
- 0776US2025343111A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0875US2025105116A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0974US12218039B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·15 claims
- 1073US2024429214A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1173US2024429189A1Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1272US2024321794A1Semiconductor chip having a through electrode and semiconductor package including the semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1369US11682630B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·20 claims
- 1468US12027482B2Semiconductor chip having a through electrode and semiconductor package including the semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 2, 2024·0 cites·19 claims
- 1567US11664312B2Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 30, 2023·0 cites·19 claims
- 1665US12381130B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 5, 2025·0 cites·19 claims
- 1765US12183664B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 31, 2024·0 cites·17 claims
- 1863US12119331B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 15, 2024·0 cites·18 claims
- 1960US12107063B2Semiconductor package deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 1, 2024·0 cites·13 claims
- 2060US2024387463A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2159US2025062213A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2255US2025006606A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2355US2024071899A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2452US2023042063A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2551US2024047319A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →