Inventor · disambiguated record
Gyeong Min Park
Also filed as: PARK GYEONG MIN
8 granted patents·6 pending applications·1 citations·filing 2021–2025
73Inventor score
Top patents by PatentIndex Score
14 records- 0186US12354849B2Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2022·Granted Jul 8, 2025·1 cites·15 claims
- 0274US12504890B2Storage device and method of operating the sameSK HYNIX INC·Filed 2024·Granted Dec 23, 2025·0 cites·20 claims
- 0374US12482638B2Substrate processing apparatus and shutterTOKYO ELECTRON LTD·Filed 2023·Granted Nov 25, 2025·0 cites·19 claims
- 0473US2025054793A1Substrate processing system and transfer methodTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0570US2025273444A1Plasma processing apparatusTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0669US2025069862A1Substrate support and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0767US12165893B2Substrate processing system and transfer methodTOKYO ELECTRON LTD·Filed 2023·Granted Dec 10, 2024·0 cites·21 claims
- 0866US12105964B2Storage device and method of operating the sameSK HYNIX INC·Filed 2023·Granted Oct 1, 2024·0 cites·19 claims
- 0958US12469738B2Substrate support, plasma processing apparatus, and ring replacement methodTOKYO ELECTRON LTD·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 1058US12165854B2Substrate support and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Dec 10, 2024·0 cites·19 claims
- 1156US12308221B2Substrate processing system and method for installing edge ringTOKYO ELECTRON LTD·Filed 2024·Granted May 20, 2025·0 cites·16 claims
- 1256US2025104979A1Substrate processing systemTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1349US2025226189A1Substrate treatment systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1448US2025279264A1Substrate processing system and transfer methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →