Inventor · disambiguated record
Hans-Jurgen Albrecht
Also filed as: ALBRECHT HANS-JUERGEN · ALBRECHT HANS-JURGEN · ALBRECHT HANS-JÜRGEN
6 granted patents·2 pending applications·90 citations·filing 1990–2022
81Inventor score
Files withHENKEL AG & CO KGAA2ALBRECHT HANS JUERGEN1ALBRECHT HANS-JURGEN1GRASMANN KARL HEINZ WLS1SENJU METAL INDUSTRY CO1
Top patents by PatentIndex Score
8 records- 0180US5192582AProcedure for processing joints to be solderedWLS KARL HEINZ GRASMANN WEICHL·Filed 1990·Granted Mar 9, 1993·69 cites·41 claims
- 0279US11285569B2Soldering material based on Sn Ag and CuHENKEL AG & CO KGAA·Filed 2019·Granted Mar 29, 2022·1 cites·10 claims
- 0372US2022168851A1Soldering material based on sn ag and cuHENKEL AG & CO KGAA·Filed 2022·Application pending·0 cites
- 0463US11331759B2Solder alloy for power devices and solder joint having a high current densitySENJU METAL INDUSTRY CO·Filed 2020·Granted May 17, 2022·0 cites·12 claims
- 0551US10376994B2Soldering material based on Sn Ag and CuALBRECHT HANS JUERGEN·Filed 2004·Granted Aug 13, 2019·6 cites·5 claims
- 0646US5193739AProcess and device for soldering electronic boards, in particular, printed circuit boards with devices installed on themGRASMANN KARL HEINZ WLS·Filed 1991·Granted Mar 16, 1993·10 cites·18 claims
- 0746US2014112710A1Solder Alloy for Power Devices and Solder Joint Having a High Current DensityALBRECHT HANS-JURGEN·Filed 2012·Application pending·0 cites
- 0824US5813595AMethod for wave-soldering printed circuit boardsSIEMENS AG·Filed 1995·Granted Sep 29, 1998·4 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →