Soldering material based on sn ag and cu

Abstract

The invention relates to a soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper). Furthermore, the invention relates to a soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that comprises Sn, Ag, Bi, Sb and Cu in the abovementioned alloy contents.

What is claimed: 
     
         1 . A soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that, in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper), wherein at least one of the soldering components further comprises Ni (nickel) in such an amount that the alloy comprises 1.0 wt. % or less Ni. 
     
     
         2 . The soldering material according to  claim 1  wherein the alloy comprises 2 to 5 wt. % Ag, 1 to 3 wt. % Bi, 1 to 3 wt. % Sb, 0.5 to 1.5 wt. % Cu and 0.05 to 0.3 wt. % Ni. 
     
     
         3 . The soldering material according to  claim 1  wherein a soldering component M1 and a further soldering component M2 are provided in which the soldering component M1, in addition to Sn as the major constituent, comprises 2 to 5 wt. % Ag, 3 to 12 wt. % Bi, 0.5 to 1.5 wt. % Cu and 0.1 to 0.3 wt. % Ni and the further soldering component M2, in addition to Sn as the major constituent, comprises 2 to 5 wt. % Ag, 0.5 to 1.5 wt. % Cu, 1 to 5 wt. % Sb and 1.0 wt. % Ni. 
     
     
         4 . The soldering material according to  claim 1  wherein a soldering component M1 and a further soldering component M2 are provided in which the soldering component M1, in addition to Sn as the major constituent, comprises 2 to 5 wt. % Ag, 3 to 6 wt. % Bi, 1 to 3 wt. % Sb and 0.5 to 1.5 wt. % Cu and the further soldering component M2, in addition to Sn as the major constituent, comprises 2 to 5 wt. % Ag, 0.5 to 1.5 wt. % Cu and 1.0 wt. % Ni. 
     
     
         5 . The soldering material according to  claim 3  wherein the soldering component M1 and the further soldering component M2 are combined in the ratio M1:M2=1:1.5 to 9, based on the weight of M1 and M2. 
     
     
         6 . The soldering material according to  claim 1  wherein in the alloy there exists a ratio Sb:Bi of 1:1.5 to 3, based on the weight of Sb and Bi. 
     
     
         7 . The soldering material according to  claim 6  wherein the alloy exhibits a Ni-content of 0.05 to 0.2 wt. %. 
     
     
         8 . The soldering material according to  claim 1  wherein the composition is SnAg3.3-4.7Cu0.3-1.7Bi2SblNi0.2. 
     
     
         9 . The soldering material according to  claim 1  wherein a soldering component M1 with the alloy composition SnAg3.8Cu0.7Bil0Ni0.15 and a further soldering component M2 with the alloy composition SnAg3.8Cu0.7Sb2.0Ni0.15 are provided. 
     
     
         10 . The soldering material according to  claim 9  wherein the contents of the soldering component M1 and the further soldering component M2 in the soldering material form the ratio M1:M2=30 wt. %:70 wt. %. 
     
     
         11 . A soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper), wherein the alloy further comprises 1.0 wt. % or less Ni (nickel). 
     
     
         12 . The soldering material according to  claim 11 , wherein the alloy comprises 2 to 5 wt. % Ag, 1 to 3 wt. % Bi, 1 to 3 wt. % Sb, 0.5 to 1.5 wt. % Cu and 0.05 to 0.3 wt. % Ni. 
     
     
         13 . The soldering material according to  claim 11 , wherein in the alloy there exists a ratio Sb:Bi of 1:1.5 to 3, particularly a ratio of 1:2, based on the weight of Sb and Bi. 
     
     
         14 . The soldering material according to  claim 13 , wherein the alloy exhibits a Ni content of 0.05 to 0.2 wt. %. 
     
     
         15 . The soldering material according to  claim 11 , wherein the alloy is SnAg3.3-4.7Cu0.3-1.7Bi2Sb1Ni0.2.