Inventor · disambiguated record
Han-Wen Chen
Also filed as: CHEN HAN-WEN
50 granted patents·16 pending applications·167 citations·filing 2004–2025
98Inventor score
Top patents by PatentIndex Score
66 records- 0198US11676832B2Laser ablation system for package fabricationAPPLIED MATERIALS INC·Filed 2020·Granted Jun 13, 2023·7 cites·18 claims
- 0298US10886232B2Package structure and fabrication methodsAPPLIED MATERIALS INC·Filed 2020·Granted Jan 5, 2021·16 cites·19 claims
- 0398US10229827B2Method of redistribution layer formation for advanced packaging applicationsAPPLIED MATERIALS INC·Filed 2017·Granted Mar 12, 2019·33 cites·13 claims
- 0498US10211072B2Method of reconstituted substrate formation for advanced packaging applicationsAPPLIED MATERIALS INC·Filed 2017·Granted Feb 19, 2019·37 cites·17 claims
- 0596US11264331B2Package structure and fabrication methodsAPPLIED MATERIALS INC·Filed 2019·Granted Mar 1, 2022·10 cites·19 claims
- 0695US11715700B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2021·Granted Aug 1, 2023·2 cites·20 claims
- 0794US11257790B2High connectivity device stackingAPPLIED MATERIALS INC·Filed 2020·Granted Feb 22, 2022·3 cites·10 claims
- 0893US10937726B1Package structure with embedded coreAPPLIED MATERIALS INC·Filed 2020·Granted Mar 2, 2021·3 cites·20 claims
- 0991US10347511B2Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device STRAPPLIED MATERIALS INC·Filed 2017·Granted Jul 9, 2019·5 cites·15 claims
- 1089US11521937B2Package structures with built-in EMI shieldingAPPLIED MATERIALS INC·Filed 2020·Granted Dec 6, 2022·2 cites·20 claims
- 1185US12354968B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 1285US10727083B1Method for via formation in flowable epoxy materials by micro-imprintAPPLIED MATERIALS INC·Filed 2019·Granted Jul 28, 2020·4 cites·20 claims
- 1384US11367643B2Method for substrate registration and anchoring in inkjet printingAPPLIED MATERIALS INC·Filed 2020·Granted Jun 21, 2022·1 cites·14 claims
- 1484US11322381B2Method for substrate registration and anchoring in inkjet printingAPPLIED MATERIALS INC·Filed 2020·Granted May 3, 2022·1 cites·16 claims
- 1584US11063169B2Substrate structuring methodsAPPLIED MATERIALS INC·Filed 2019·Granted Jul 13, 2021·2 cites·20 claims
- 1683US11887934B2Package structure and fabrication methodsAPPLIED MATERIALS INC·Filed 2022·Granted Jan 30, 2024·0 cites·20 claims
- 1783US7432177B2Post-ion implant cleaning for silicon on insulator substrate preparationAPPLIED MATERIALS INC·Filed 2005·Granted Oct 7, 2008·7 cites·21 claims
- 1882US11329003B2Anchoring dies using 3D printing to form reconstructed waferAPPLIED MATERIALS INC·Filed 2020·Granted May 10, 2022·1 cites·17 claims
- 1980US11388822B2Methods for improved polymer-copper adhesionAPPLIED MATERIALS INC·Filed 2020·Granted Jul 12, 2022·1 cites·20 claims
- 2079US11798831B2Method for substrate registration and anchoring in inkjet printingAPPLIED MATERIALS INC·Filed 2022·Granted Oct 24, 2023·0 cites·15 claims
- 2179US10304703B2Small thermal mass pressurized chamberAPPLIED MATERIALS INC·Filed 2016·Granted May 28, 2019·2 cites·11 claims
- 2279US10032624B2Substrate support and baffle apparatusAPPLIED MATERIALS INC·Filed 2016·Granted Jul 24, 2018·2 cites·18 claims
- 2378US12388049B2High connectivity device stackingAPPLIED MATERIALS INC·Filed 2023·Granted Aug 12, 2025·0 cites·16 claims
- 2478US11281094B2Method for via formation by micro-imprintingAPPLIED MATERIALS INC·Filed 2018·Granted Mar 22, 2022·2 cites·17 claims
- 2577US11837680B2Substrate structuring methodsAPPLIED MATERIALS INC·Filed 2022·Granted Dec 5, 2023·0 cites·20 claims
- 2677US8530356B2Method of BARC removal in semiconductor device manufacturingGOUK ROMAN·Filed 2011·Granted Sep 10, 2013·4 cites·16 claims
- 2776US11521935B2Package structure and fabrication methodsAPPLIED MATERIALS INC·Filed 2021·Granted Dec 6, 2022·0 cites·20 claims
- 2875US2022328336A1Apparatus for substrate registration and anchoring in inkjet printingAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2974US11476202B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2020·Granted Oct 18, 2022·0 cites·20 claims
- 3074US11398433B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2020·Granted Jul 26, 2022·0 cites·19 claims
- 3174US10573510B2Substrate support and baffle apparatusAPPLIED MATERIALS INC·Filed 2018·Granted Feb 25, 2020·1 cites·20 claims
- 3274US7718009B2Cleaning submicron structures on a semiconductor wafer surfaceAPPLIED MATERIALS INC·Filed 2004·Granted May 18, 2010·18 cites·19 claims
- 3373US12374611B2Package core assembly and fabrication methodsAPPLIED MATERIALS INC·Filed 2021·Granted Jul 29, 2025·0 cites·24 claims
- 3473US11881447B2Package core assembly and fabrication methodsAPPLIED MATERIALS INC·Filed 2021·Granted Jan 23, 2024·0 cites·18 claims
- 3573US11362235B2Substrate structuring methodsAPPLIED MATERIALS INC·Filed 2021·Granted Jun 14, 2022·0 cites·20 claims
- 3673US11264333B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2020·Granted Mar 1, 2022·0 cites·20 claims
- 3772US12482736B2Semiconductor device packagesAPPLIED MATERIALS INC·Filed 2022·Granted Nov 25, 2025·0 cites·19 claims
- 3872US11742330B2High connectivity device stackingAPPLIED MATERIALS INC·Filed 2022·Granted Aug 29, 2023·0 cites·8 claims
- 3971US12087679B2Package core assembly and fabrication methodsAPPLIED MATERIALS INC·Filed 2020·Granted Sep 10, 2024·0 cites·9 claims
- 4067US10777405B2Drying process for high aspect ratio featuresAPPLIED MATERIALS INC·Filed 2016·Granted Sep 15, 2020·1 cites·17 claims
- 4167US10354892B2Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device structuresAPPLIED MATERIALS INC·Filed 2013·Granted Jul 16, 2019·1 cites·15 claims
- 4264US11862546B2Package core assembly and fabrication methodsAPPLIED MATERIALS INC·Filed 2019·Granted Jan 2, 2024·0 cites·19 claims
- 4364US11011392B2Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device structuresAPPLIED MATERIALS INC·Filed 2019·Granted May 18, 2021·0 cites·17 claims
- 4464US7914623B2Post-ion implant cleaning for silicon on insulator substrate preparationAPPLIED MATERIALS INC·Filed 2007·Granted Mar 29, 2011·1 cites·7 claims
- 4564US2022171281A1Method for via formation by micro-imprintingAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 4659US2019181019A1Method of reconstituted substrate formation for advanced packaging applicationsAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 4758US11424137B2Drying process for high aspect ratio featuresAPPLIED MATERIALS INC·Filed 2019·Granted Aug 23, 2022·0 cites·20 claims
- 4856US11133174B2Reduced volume processing chamberAPPLIED MATERIALS INC·Filed 2019·Granted Sep 28, 2021·0 cites·18 claims
- 4955US2024123551A1Apparatus and method for laser machining of a substrateAPPLIED MAT ITALIA SRL·Filed 2021·Application pending·0 cites
- 5054US2023070053A1Stiffener frame for semiconductor device packagesAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
Showing the top 50 of 66 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →