Inventor · disambiguated record
Hans D’Achard
Also filed as: D’ACHARD HANS
0 granted patents·2 pending applications·0 citations·filing 2024–2024
Technology areasH10W
Files withTOKYO ELECTRON LTD2
Top patents by PatentIndex Score
2 records- 0159US2025308951A1Die to wafer bonding method and apparatus with thermal contactless die shape controlTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0257US2025308949A1Die to wafer bonding method and apparatus with thermal contact die shape controlTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →