Inventor · disambiguated record
Harry Fujimoto
Also filed as: FUJIMOTO HARRY · FUJIMOTO HARRY H
17 granted patents·2 pending applications·2,632 citations·filing 1992–2006
96Inventor score
Top patents by PatentIndex Score
19 records- 0198US6562653B1Silicon interposer and multi-chip-module (MCM) with through substrate viasINTEL CORP·Filed 2000·Granted May 13, 2003·266 cites·27 claims
- 0298US6271469B1Direct build-up layer on an encapsulated die packageINTEL CORP·Filed 1999·Granted Aug 7, 2001·711 cites·21 claims
- 0398US6229216B1Silicon interposer and multi-chip-module (MCM) with through substrate viasINTEL CORP·Filed 1999·Granted May 8, 2001·307 cites·15 claims
- 0497US6154366AStructures and processes for fabricating moisture resistant chip-on-flex packagesINTEL CORP·Filed 1999·Granted Nov 28, 2000·496 cites·29 claims
- 0596US6709898B1Die-in-heat spreader microelectronic packageINTEL CORP·Filed 2000·Granted Mar 23, 2004·221 cites·17 claims
- 0695US5302477AInverted phase-shifted reticleINTEL CORP·Filed 1992·Granted Apr 12, 1994·195 cites·21 claims
- 0788US6509622B1Integrated circuit guard ring structuresINTEL CORP·Filed 2000·Granted Jan 21, 2003·53 cites·22 claims
- 0887US5384219AReticle with structurally identical inverted phase-shifted featuresINTEL CORP·Filed 1993·Granted Jan 24, 1995·56 cites·14 claims
- 0985US6876053B1Isolation structure configurations for modifying stresses in semiconductor devicesINTEL CORP·Filed 1999·Granted Apr 5, 2005·61 cites·7 claims
- 1085US6219243B1Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged unitsINTEL CORP·Filed 1999·Granted Apr 17, 2001·106 cites·30 claims
- 1183US5465860AMethod of forming an integrated circuit waveguideINTEL CORP·Filed 1994·Granted Nov 14, 1995·57 cites·19 claims
- 1278US7410858B2Isolation structure configurations for modifying stresses in semiconductor devicesINTEL CORP·Filed 2006·Granted Aug 12, 2008·6 cites·24 claims
- 1375US5348826AReticle with structurally identical inverted phase-shifted featuresINTEL CORP·Filed 1993·Granted Sep 20, 1994·25 cites·23 claims
- 1473US7411269B2Isolation structure configurations for modifying stresses in semiconductor devicesINTEL CORP·Filed 2005·Granted Aug 12, 2008·4 cites·24 claims
- 1572US5540346AMethod of making integrated circuit waveguideINTEL CORP·Filed 1995·Granted Jul 30, 1996·40 cites·5 claims
- 1653US5747879AInterface between titanium and aluminum-alloy in metal stack for integrated circuitINTEL CORP·Filed 1996·Granted May 5, 1998·24 cites·9 claims
- 1749US2007013023A1Isolation structure configurations for modifying stresses in semiconductor devicesMA QING·Filed 2006·Application pending·0 cites
- 1839US2004155325A1Die-in heat spreader microelectronic packageINTEL CORP·Filed 2004·Application pending·0 cites
- 1931US5962196ADeep ultraviolet light photoresist processingINTEL CORP·Filed 1993·Granted Oct 5, 1999·4 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →