Inventor · disambiguated record
Hailong Gu
Also filed as: GU HAILONG
5 granted patents·7 pending applications·0 citations·filing 2012–2024
62Inventor score
Top patents by PatentIndex Score
12 records- 0180US12094820B2Semiconductor device having inter-metal dielectric patterns and method for fabricating the sameUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2023·Granted Sep 17, 2024·0 cites·3 claims
- 0273US11749601B2Semiconductor device having inter-metal dielectric patterns and method for fabricating the sameUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·7 claims
- 0367US11201116B2Semiconductor device having inter-metal dielectric patterns and method for fabricating the sameUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2020·Granted Dec 14, 2021·0 cites·9 claims
- 0459US12094790B2Testkey structure for semiconductor deviceUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2022·Granted Sep 17, 2024·0 cites·15 claims
- 0558US2025334631A1Test key structure and test method thereofUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2024·Application pending·0 cites
- 0654US2025062132A1Etching method of semiconductor structureUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2023·Application pending·0 cites
- 0753US2024290667A1Test key structureUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2023·Application pending·0 cites
- 0853US2025063802A1Method for fabricating semiconductor deviceUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2023·Application pending·0 cites
- 0951US2024222472A1Semiconductor Device and Method of Fabricating the SameUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2023·Application pending·0 cites
- 1047US11107723B1Method of fabricating semiconductor deviceUNITED SEMICONDUCTOR XIAMEN CO LTD·Filed 2020·Granted Aug 31, 2021·0 cites·13 claims
- 1137US2014357050A1Method of forming isolating structure and through silicon viaUNITED MICROELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 1232US2013200519A1Through silicon via structure and method of fabricating the sameFENG JI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →