Inventor · disambiguated record
Habib Hichri
Also filed as: HICHRI HABIB
33 granted patents·8 pending applications·313 citations·filing 1995–2022
97Inventor score
Top patents by PatentIndex Score
41 records- 0188US7067902B2Building metal pillars in a chip for structure supportIBM·Filed 2003·Granted Jun 27, 2006·42 cites·10 claims
- 0288US6917108B2Reliable low-k interconnect structure with hybrid dielectricIBM·Filed 2002·Granted Jul 12, 2005·49 cites·32 claims
- 0383US5674555AProcess for preparing group Ib-IIIa-VIa semiconducting filmsUNIV DELAWARE·Filed 1995·Granted Oct 7, 1997·81 cites·11 claims
- 0480US7544609B2Method for integrating liner formation in back end of line processingIBM·Filed 2007·Granted Jun 9, 2009·9 cites·20 claims
- 0580US7456098B2Building metal pillars in a chip for structure supportIBM·Filed 2006·Granted Nov 25, 2008·8 cites·8 claims
- 0678US7253100B2Reducing damage to ulk dielectric during cross-linked polymer removalIBM·Filed 2005·Granted Aug 7, 2007·5 cites·20 claims
- 0777US7009280B2Low-k interlevel dielectric layer (ILD)IBM·Filed 2004·Granted Mar 7, 2006·15 cites·17 claims
- 0875US8030157B1Liner protection in deep trench etchingIBM·Filed 2010·Granted Oct 4, 2011·4 cites·8 claims
- 0973US8647535B2Conductive metal and diffusion barrier seed compositions, and methods of use in semiconductor and interlevel dielectric substratesMALONE KELLY·Filed 2011·Granted Feb 11, 2014·3 cites·14 claims
- 1073US7135398B2Reliable low-k interconnect structure with hybrid dielectricIBM·Filed 2004·Granted Nov 14, 2006·18 cites·28 claims
- 1172US6831363B2Structure and method for reducing thermo-mechanical stress in stacked viasIBM·Filed 2002·Granted Dec 14, 2004·18 cites·15 claims
- 1271US8822342B2Method to reduce depth delta between dense and wide features in dual damascene structuresSRIVASTAVA RAVI PRAKASH·Filed 2010·Granted Sep 2, 2014·3 cites·18 claims
- 1371US8492280B1Method for simultaneously forming features of different depths in a semiconductor substrateHICHRI HABIB·Filed 2012·Granted Jul 23, 2013·3 cites·15 claims
- 1468US7645621B2Optical inspection methodsIBM·Filed 2007·Granted Jan 12, 2010·3 cites·1 claims
- 1568US7279426B2Like integrated circuit devices with different depthIBM·Filed 2005·Granted Oct 9, 2007·3 cites·6 claims
- 1666US12185477B2Method for making printed wiring board, printed wiring board, and adhesive film for making printed wiring boardAJINOMOTO KK·Filed 2022·Granted Dec 31, 2024·0 cites·24 claims
- 1764US7475368B2Deflection analysis system and method for circuit designIBM·Filed 2006·Granted Jan 6, 2009·3 cites·9 claims
- 1861US6258910B1Polymerizing vinyl chloride in carbon dioxideOCCIDENTAL CHEM CO·Filed 1999·Granted Jul 10, 2001·16 cites·21 claims
- 1960US6040477ASulfodechlorinating aromatic compoundsOCCIDENTAL CHEM CO·Filed 1998·Granted Mar 21, 2000·9 cites·20 claims
- 2057US9064848B2ARC residue-free etchingGLOBALFOUNDRIES SG PTE LTD·Filed 2014·Granted Jun 23, 2015·0 cites·16 claims
- 2157US8735284B2Conductive metal and diffusion barrier seed compositions, and methods of use in semiconductor and interlevel dielectric substratesIBM·Filed 2013·Granted May 27, 2014·0 cites·20 claims
- 2255US6764873B2Semiconductor wafer including a low dielectric constant thermosetting polymer film and method of making sameIBM·Filed 2002·Granted Jul 20, 2004·4 cites·3 claims
- 2351US7214608B2Interlevel dielectric layer and metal layer sealingIBM·Filed 2004·Granted May 8, 2007·4 cites·20 claims
- 2451US6506854B2Inhibiting scale in vinyl monomer polymerizationOCCIDENTAL CHEM CO·Filed 2001·Granted Jan 14, 2003·1 cites·20 claims
- 2550US8901005B2Method for simultaneously forming features of different depths in a semiconductor substrateHICHRI HABIB·Filed 2013·Granted Dec 2, 2014·0 cites·14 claims
- 2649US8901006B2ARC residue-free etchingHU XIANG·Filed 2011·Granted Dec 2, 2014·0 cites·10 claims
- 2748US8168451B2Optical inspection methodsBRODSKY COLIN J·Filed 2009·Granted May 1, 2012·0 cites·20 claims
- 2848US2007273004A1Like integrated circuit devices with different depthIBM·Filed 2007·Application pending·0 cites
- 2946US9779932B2Sacrificial layer for post-laser debris removal systemsSUSS MICROTEC PHOTONIC SYSTEMS INC·Filed 2015·Granted Oct 3, 2017·0 cites·28 claims
- 3046US2009117360A1Self-assembled material pattern transfer contrast enhancementIBM·Filed 2007·Application pending·0 cites
- 3145US2009176350A1Integration of ion gettering material in dielectricIBM·Filed 2008·Application pending·0 cites
- 3243US5750811AMethod of making m-chlorobenzotrifluorideOCCIDENTAL CHEM CO·Filed 1997·Granted May 12, 1998·2 cites·20 claims
- 3342US2005087490A1Process for removing impurities from low dielectric constant films disposed on semiconductor devicesIBM·Filed 2003·Application pending·0 cites
- 3442US2004253457A1Semiconductor wafer including a low dielectric constant thermosetting polymer film and method of making sameFiled 2004·Application pending·0 cites
- 3541US6001937AReducing scale in vinyl polymerizationsOCCIDENTAL CHEM CO·Filed 1998·Granted Dec 14, 1999·5 cites·20 claims
- 3641US2007007244A1Detection of loss of plasma confinementIBM·Filed 2005·Application pending·0 cites
- 3740US6114476AInhibiting scale in vinyl monomer polymerizationOCCIDENTAL CHEM CO·Filed 1998·Granted Sep 5, 2000·5 cites·28 claims
- 3838US2009026587A1Gradient deposition of low-k cvd materialsIBM·Filed 2004·Application pending·0 cites
- 3937US10898932B2Method and apparatus for cleaning a substrate and computer program productSUSS MICROTEC PHOTOMASK EQUIPMENT GMBH & CO KG·Filed 2018·Granted Jan 26, 2021·0 cites·12 claims
- 4037US8642475B2Integrated circuit system with reduced polysilicon residue and method of manufacture thereofHU XIANG·Filed 2010·Granted Feb 4, 2014·0 cites·20 claims
- 4135US2020312713A1Microstructuring for electroplating processesSUSS MICROTEC PHOTONIC SYSTEMS INC·Filed 2020·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Habib Hichri files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →