Inventor · disambiguated record
Hayato Iga
Also filed as: IGA HAYATO
10 granted patents·13 pending applications·4 citations·filing 2022–2025
77Inventor score
Files withDISCO CORP23
Top patents by PatentIndex Score
23 records- 0191US12202173B2Method of manufacturing monocrystalline silicon substrateDISCO CORP·Filed 2022·Granted Jan 21, 2025·2 cites·1 claims
- 0289US12289922B2Processing methodDISCO CORP·Filed 2022·Granted Apr 29, 2025·2 cites·2 claims
- 0372US2025091174A1Method of manufacturing waferDISCO CORP·Filed 2024·Application pending·0 cites
- 0470US2025262690A1Method of processing monocrystalline silicon waferDISCO CORP·Filed 2025·Application pending·0 cites
- 0565US12311470B2Method of processing monocrystalline silicon waferDISCO CORP·Filed 2022·Granted May 27, 2025·0 cites·5 claims
- 0663US2023364716A1Manufacturing method of substrateDISCO CORP·Filed 2023·Application pending·0 cites
- 0762US12454076B2Substrate manufacturing methodDISCO CORP·Filed 2022·Granted Oct 28, 2025·0 cites·4 claims
- 0862US2023234169A1Manufacturing method of single-crystal silicon substrateDISCO CORP·Filed 2023·Application pending·0 cites
- 0962US2023415274A1Method of manufacturing waferDISCO CORP·Filed 2023·Application pending·0 cites
- 1059US12129570B2Manufacturing method of single-crystal silicon substrateDISCO CORP·Filed 2022·Granted Oct 29, 2024·0 cites·8 claims
- 1158US2024399494A1Wafer processing method and chamfer removing apparatusDISCO CORP·Filed 2024·Application pending·0 cites
- 1257US12459147B2Cutting apparatusDISCO CORP·Filed 2023·Granted Nov 4, 2025·0 cites·4 claims
- 1357US2024145248A1Processing method of bonded waferDISCO CORP·Filed 2023·Application pending·0 cites
- 1457US2024128087A1Wafer processing methodDISCO CORP·Filed 2023·Application pending·0 cites
- 1556US12479048B2Wafer processing apparatusDISCO CORP·Filed 2023·Granted Nov 25, 2025·0 cites·20 claims
- 1654US2024297052A1Processing method of bonded waferDISCO CORP·Filed 2024·Application pending·0 cites
- 1754US2024304448A1Processing method of bonded waferDISCO CORP·Filed 2024·Application pending·0 cites
- 1854US2024342835A1Method for manufacturing chipsDISCO CORP·Filed 2024·Application pending·0 cites
- 1953US12447560B2Manufacturing method of single crystal silicon substrateDISCO CORP·Filed 2023·Granted Oct 21, 2025·0 cites·4 claims
- 2053US2023390870A1Method of manufacturing monocrystalline silicon substrateDISCO CORP·Filed 2023·Application pending·0 cites
- 2152US12354916B2Method of processing waferDISCO CORP·Filed 2022·Granted Jul 8, 2025·0 cites·4 claims
- 2250US12214526B2Method of manufacturing substrateDISCO CORP·Filed 2022·Granted Feb 4, 2025·0 cites·6 claims
- 2348US2025239468A1Method of processing waferDISCO CORP·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →