Inventor · disambiguated record
Hayato Kiuchi
Also filed as: KIUCHI HAYATO
53 granted patents·8 pending applications·34 citations·filing 2008–2025
96Inventor score
Top patents by PatentIndex Score
61 records- 0192US7821140B2Semiconductor device and wire bonding methodSHINKAWA KK·Filed 2010·Granted Oct 26, 2010·16 cites·6 claims
- 0290US11289379B2Wafer processing methodDISCO CORP·Filed 2020·Granted Mar 29, 2022·2 cites·12 claims
- 0381US11024543B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2020·Granted Jun 1, 2021·1 cites·13 claims
- 0480US10991624B2Wafer processing method including applying a polyolefin sheet to a waferDISCO CORP·Filed 2020·Granted Apr 27, 2021·1 cites·14 claims
- 0579US10847420B2Wafer processing methodDISCO CORP·Filed 2019·Granted Nov 24, 2020·2 cites·11 claims
- 0677US8815732B2Wire bonding method and semiconductor deviceMII TATSUNARI·Filed 2012·Granted Aug 26, 2014·4 cites·5 claims
- 0772US11037814B2Wafer processing method using a ring frame with a polyester sheet with no adhesive layerDISCO CORP·Filed 2019·Granted Jun 15, 2021·1 cites·13 claims
- 0871US11062948B2Wafer processing methodDISCO CORP·Filed 2019·Granted Jul 13, 2021·1 cites·12 claims
- 0970US8143155B2Wire bonding method and semiconductor deviceMII TATSUNARI·Filed 2009·Granted Mar 27, 2012·4 cites·11 claims
- 1067US11088008B2Wafer processing methodDISCO CORP·Filed 2019·Granted Aug 10, 2021·1 cites·11 claims
- 1164US2025018528A1Processing method for workpieceDISCO CORP·Filed 2024·Application pending·0 cites
- 1262US10933500B2Blade mounting and dismounting jig, blade mounting and dismounting method, blade extracting method, and cutting apparatusDISCO CORP·Filed 2018·Granted Mar 2, 2021·1 cites·20 claims
- 1360US11545393B2Wafer processing method including uniting wafer, ring frame and polyester sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Jan 3, 2023·0 cites·8 claims
- 1458US2024379402A1Wafer processing methodDISCO CORP·Filed 2024·Application pending·0 cites
- 1554US11696411B2Sleeve soldering device and method of producing electronic deviceDENSO CORP·Filed 2020·Granted Jul 4, 2023·0 cites·14 claims
- 1654US2025249614A1Chuck table and half-cutting methodDISCO CORP·Filed 2025·Application pending·0 cites
- 1753US7851347B2Wire bonding method and semiconductor deviceSHINKAWA KK·Filed 2009·Granted Dec 14, 2010·0 cites·8 claims
- 1850US10804131B2Carrier plate removing methodDISCO CORP·Filed 2019·Granted Oct 13, 2020·0 cites·2 claims
- 1950US2022399235A1Manufacturing method for device chipDISCO CORP·Filed 2022·Application pending·0 cites
- 2049US11610815B2Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Mar 21, 2023·0 cites·11 claims
- 2149US11594454B2Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Feb 28, 2023·0 cites·11 claims
- 2249US11587833B2Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Feb 21, 2023·0 cites·11 claims
- 2349US11587832B2Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Feb 21, 2023·0 cites·11 claims
- 2449US11476161B2Wafer processing method including applying a polyolefin sheet to a waferDISCO CORP·Filed 2020·Granted Oct 18, 2022·0 cites·13 claims
- 2549US11393721B2Wafer processing methodDISCO CORP·Filed 2020·Granted Jul 19, 2022·0 cites·12 claims
- 2649US11380588B2Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Jul 5, 2022·0 cites·15 claims
- 2749US11322407B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2020·Granted May 3, 2022·0 cites·12 claims
- 2848US11380587B2Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Jul 5, 2022·0 cites·15 claims
- 2948US11361997B2Wafer processing method including uniting a wafer, ring frame and a polyolefin sheet without using an adhesive layerDISCO CORP·Filed 2020·Granted Jun 14, 2022·0 cites·21 claims
- 3048US11322406B2Wafer processing methodDISCO CORP·Filed 2020·Granted May 3, 2022·0 cites·8 claims
- 3148US11270916B2Wafer processing methodDISCO CORP·Filed 2020·Granted Mar 8, 2022·0 cites·18 claims
- 3248US11049772B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2020·Granted Jun 29, 2021·0 cites·13 claims
- 3348US10933618B2Carrier plate removing methodDISCO CORP·Filed 2020·Granted Mar 2, 2021·0 cites·17 claims
- 3447US11302578B2Wafer processing methodDISCO CORP·Filed 2020·Granted Apr 12, 2022·0 cites·9 claims
- 3547US11251082B2Wafer processing methodDISCO CORP·Filed 2020·Granted Feb 15, 2022·0 cites·8 claims
- 3647US11056334B2Wafer processing method using a ring frame and a polyester sheetDISCO CORP·Filed 2019·Granted Jul 6, 2021·0 cites·10 claims
- 3747US11049757B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2020·Granted Jun 29, 2021·0 cites·13 claims
- 3847US11031234B2Wafer processing method including applying a polyolefin sheet to a waferDISCO CORP·Filed 2019·Granted Jun 8, 2021·0 cites·15 claims
- 3947US11018058B2Wafer processing method for dividing a wafer along predefined division lines using polyester sheetDISCO CORP·Filed 2020·Granted May 25, 2021·0 cites·9 claims
- 4047US11011407B2Wafer processing method using a ring frame and a polyolefin sheetDISCO CORP·Filed 2019·Granted May 18, 2021·0 cites·11 claims
- 4147US11004744B2Wafer processing method for dividing a wafer along predefined division linesDISCO CORP·Filed 2020·Granted May 11, 2021·0 cites·10 claims
- 4247US10998232B2Wafer processing method of uniting a wafer and a ring frame using a polyolefin sheetDISCO CORP·Filed 2020·Granted May 4, 2021·0 cites·9 claims
- 4347US10991587B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2019·Granted Apr 27, 2021·0 cites·14 claims
- 4447US10985067B2Wafer processing method using a laser beam dividing stepDISCO CORP·Filed 2020·Granted Apr 20, 2021·0 cites·18 claims
- 4547US10720355B2Wafer processing methodDISCO CORP·Filed 2019·Granted Jul 21, 2020·0 cites·9 claims
- 4646US11127633B2Wafer processing method including a thermocompression bonding step of bonding a wafer to a ring frame via a polyolefin sheetDISCO CORP·Filed 2019·Granted Sep 21, 2021·0 cites·21 claims
- 4746US11069574B2Wafer processing method including applying a polyester sheet to a waferDISCO CORP·Filed 2019·Granted Jul 20, 2021·0 cites·20 claims
- 4846US11043421B2Wafer processing methodDISCO CORP·Filed 2019·Granted Jun 22, 2021·0 cites·21 claims
- 4946US11037813B2Wafer processing methodDISCO CORP·Filed 2019·Granted Jun 15, 2021·0 cites·25 claims
- 5046US10985066B2Wafer processing method for dividing a wafer along division linesDISCO CORP·Filed 2019·Granted Apr 20, 2021·0 cites·9 claims
Showing the top 50 of 61 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →