Inventor · disambiguated record
Harufumi Kobayashi
Also filed as: KOBAYASHI HARUFUMI
10 granted patents·249 citations·filing 1997–2012
89Inventor score
Top patents by PatentIndex Score
10 records- 0196US6573598B2Semiconductor device and method of fabricating the sameOKI ELECTRIC IND CO LTD·Filed 2000·Granted Jun 3, 2003·132 cites·22 claims
- 0287US6852564B2Semiconductor device and method of fabricating the sameOKI ELECTRIC IND CO LTD·Filed 2002·Granted Feb 8, 2005·40 cites·18 claims
- 0372US6495916B1Resin-encapsulated semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 1999·Granted Dec 17, 2002·38 cites·16 claims
- 0456US6054757ASemiconductor apparatus, circuit board and combination thereofOKI ELECTRIC IND CO LTD·Filed 1998·Granted Apr 25, 2000·22 cites·17 claims
- 0554US6653218B2Method of fabricating resin-encapsulated semiconductor deviceOKI ELECTRIC IND CO LTD·Filed 2002·Granted Nov 25, 2003·5 cites·10 claims
- 0649US8501542B2Double-faced electrode package, and its manufacturing methodISHIHARA MASAMICHI·Filed 2012·Granted Aug 6, 2013·0 cites·8 claims
- 0748US8154110B2Double-faced electrode package and its manufacturing methodISHIHARA MASAMICHI·Filed 2006·Granted Apr 10, 2012·0 cites·6 claims
- 0846US8500984B2Method for manufacturing printed-circuit boardEGAWA YOSHIMI·Filed 2009·Granted Aug 6, 2013·0 cites·11 claims
- 0938US6369440B1Semiconductor substrate and manufacturing method thereofOKI ELECTRIC IND CO LTD·Filed 1999·Granted Apr 9, 2002·7 cites·20 claims
- 1034US5952710ASemiconductor device and method of manufacturing sameOKI ELECTRIC IND CO LTD·Filed 1997·Granted Sep 14, 1999·5 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →