Inventor · disambiguated record
Han-Jin Lim
Also filed as: LIM HAN-JIN
54 granted patents·20 pending applications·291 citations·filing 1999–2025
98Inventor score
Top patents by PatentIndex Score
74 records- 0196US11728372B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 15, 2023·2 cites·18 claims
- 0294US7271055B2Methods of forming low leakage currents metal-insulator-metal (MIM) capacitors and related MIM capacitorsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 18, 2007·26 cites·31 claims
- 0392US11322578B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 3, 2022·5 cites·20 claims
- 0492US10403638B2Vertical memory devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 3, 2019·7 cites·17 claims
- 0592US9455259B2Semiconductor devices including diffusion barriers with high electronegativity metalsSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Sep 27, 2016·11 cites·20 claims
- 0692US9362422B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 7, 2016·15 cites·17 claims
- 0791US9437420B2Capacitors including amorphous dielectric layers and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Sep 6, 2016·10 cites·20 claims
- 0891US9041122B2Semiconductor devices having metal silicide layers and methods of manufacturing such semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 26, 2015·16 cites·18 claims
- 0990US9716094B2Semiconductor device having capacitor and method of fabricating the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 25, 2017·7 cites·20 claims
- 1090US9184227B1Methods of manufacturing semiconductor devices having self-aligned contact padsKIM YOUNG-KUK·Filed 2014·Granted Nov 10, 2015·10 cites·13 claims
- 1189US10756185B2Semiconductor device including vertical channel layer and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 25, 2020·6 cites·20 claims
- 1288US9287270B2Semiconductor device and fabricating method thereofOH JUNG-HWAN·Filed 2014·Granted Mar 15, 2016·11 cites·20 claims
- 1387US11127828B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 21, 2021·3 cites·11 claims
- 1487US10325992B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 18, 2019·4 cites·17 claims
- 1586US11735637B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 22, 2023·1 cites·11 claims
- 1685US10825889B2Semiconductor device including capacitor and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 3, 2020·3 cites·20 claims
- 1785US7722926B2Organometallic compounds and methods of forming thin films including the use of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 25, 2010·6 cites·19 claims
- 1884US10103026B2Methods of forming material layerSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 16, 2018·3 cites·15 claims
- 1983US9349821B2Electrode structure, method of fabricating the same, and semiconductor device including the electrode structureLEE DONG-KAK·Filed 2015·Granted May 24, 2016·3 cites·14 claims
- 2082US8012823B2Methods of fabricating stack type capacitors of semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Sep 6, 2011·8 cites·19 claims
- 2181US12336260B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·18 claims
- 2281US12125872B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·16 claims
- 2381US9240414B1Semiconductor devices having self-aligned contact padsKIM YOUNG-KUK·Filed 2015·Granted Jan 19, 2016·3 cites·7 claims
- 2477US9153590B2Semiconductor devices including buried channelsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 6, 2015·4 cites·20 claims
- 2575US12230667B2Semiconductor device including capacitor and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·20 claims
- 2675US9543196B2Methods of fabricating semiconductor devices using nanowiresSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 10, 2017·2 cites·15 claims
- 2775US6930013B2Method of forming a capacitor of an integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Aug 16, 2005·19 cites·18 claims
- 2874US11737277B2Vertical memory device with a channel layer in a stacked dielectric layerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 2973US6583056B2Storage electrode of a semiconductor memory device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Jun 24, 2003·19 cites·10 claims
- 3072US10468256B2Methods of forming material layerSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 5, 2019·1 cites·18 claims
- 3172US9484219B2Methods of fabricating memory devices using wet etching and dry etchingPARK YOUNG-GEUN·Filed 2015·Granted Nov 1, 2016·2 cites·20 claims
- 3269US11411069B2Semiconductor device including capacitor and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 9, 2022·0 cites·19 claims
- 3369US11189636B2Vertical memory device with a channel layer in a stacked dielectric layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 30, 2021·0 cites·20 claims
- 3466US9646971B2Semiconductor devices including nanowire capacitors and fabricating methods thereofSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 9, 2017·1 cites·20 claims
- 3566US7432183B2Methods of manufacturing a thin film including zirconium titanium oxide and methods of manufacturing a gate structure, a capacitor and a flash memory device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 7, 2008·3 cites·34 claims
- 3665US7049232B2Methods for forming ruthenium films with β-diketone containing ruthenium complexes and method for manufacturing metal-insulator-metal capacitor using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted May 23, 2006·8 cites·26 claims
- 3765US6743678B2Methods for manufacturing semiconductor memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jun 1, 2004·11 cites·26 claims
- 3865US6284589B1Method of fabricating concave capacitor including adhesion spacerSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Sep 4, 2001·30 cites·17 claims
- 3965US2025176195A1Semiconductor devices and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 4063US9812557B2Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 7, 2017·1 cites·19 claims
- 4163US9202813B2Electrode structure, method of fabricating the same, and semiconductor device including the electrode structureLEE DONG-KAK·Filed 2011·Granted Dec 1, 2015·1 cites·16 claims
- 4263US2023212749A1Device for manufacturing a semiconductor device and method for manufacturing a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 4362US10651194B2Semiconductor device including dielectric layerSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 12, 2020·0 cites·12 claims
- 4462US6809363B2Storage electrode of a semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Oct 26, 2004·9 cites·18 claims
- 4562US2025016978A1Capacitor structure and semiconductor memory device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4661US12230671B2Semiconductor devices and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 18, 2025·0 cites·16 claims
- 4761US10685959B2Electrode structure, method of fabricating the same, and semiconductor device including the electrode structureSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 16, 2020·0 cites·20 claims
- 4861US6838719B2Dram cell capacitors having U-shaped electrodes with rough inner and outer surfacesSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Jan 4, 2005·10 cites·2 claims
- 4960US8039344B2Methods of forming a capacitor structure and methods of manufacturing a semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Oct 18, 2011·1 cites·15 claims
- 5060US2024357796A1Semiconductor memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
Showing the top 50 of 74 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →