Inventor · disambiguated record
Hao-Juin Liu
Also filed as: LIU HAO-JUIN
19 granted patents·87 citations·filing 2011–2019
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD10TAIWAN SEMICONDUCTOR MFG5LIU HAO-JUIN2CHUANG YAO-CHUN1LIN TSUNG-SHU1
Top patents by PatentIndex Score
19 records- 0194US9117825B2Substrate pad structureTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Aug 25, 2015·12 cites·19 claims
- 0294US8829673B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Sep 9, 2014·17 cites·20 claims
- 0388US9978656B2Mechanisms for forming fine-pitch copper bump structuresLIN TSUNG SHU·Filed 2012·Granted May 22, 2018·12 cites·20 claims
- 0488US9406629B2Semiconductor package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 2, 2016·8 cites·12 claims
- 0586US9397059B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jul 19, 2016·4 cites·20 claims
- 0686US9257412B2Stress reduction apparatusCHUANG YAO-CHUN·Filed 2012·Granted Feb 9, 2016·6 cites·16 claims
- 0785US9472521B2Scheme for connector site spacing and resulting structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Oct 18, 2016·7 cites·14 claims
- 0883US9741589B2Substrate pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 22, 2017·3 cites·20 claims
- 0983US9673161B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 6, 2017·3 cites·20 claims
- 1077US9287191B2Semiconductor device package and methodLIU HAO-JUIN·Filed 2011·Granted Mar 15, 2016·5 cites·18 claims
- 1176US10037973B2Method for manufacturing semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 31, 2018·2 cites·20 claims
- 1275US11088102B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·1 cites·20 claims
- 1375US8765497B2Packaging and function tests for package-on-package and system-in-package structuresLIU HAO-JUIN·Filed 2011·Granted Jul 1, 2014·3 cites·14 claims
- 1471US10468366B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 5, 2019·1 cites·20 claims
- 1566US9673125B2Interconnection structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Jun 6, 2017·2 cites·5 claims
- 1666US9123788B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 1, 2015·1 cites·20 claims
- 1764US10867810B2Substrate pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
- 1858US10748785B2Substrate pad structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 18, 2020·0 cites·20 claims
- 1958US9040350B2Packaging and function tests for package-on-package and system-in-package structuresTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted May 26, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →