Inventor · disambiguated record
Hau Nguyen
Also filed as: NGUYEN HAU · NGUYEN HAU T · NGUYEN HAU THANH
28 granted patents·15 pending applications·192 citations·filing 2002–2024
95Inventor score
Top patents by PatentIndex Score
43 records- 0196US7413927B1Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packagesNAT SEMICONDUCTOR CORP·Filed 2005·Granted Aug 19, 2008·44 cites·10 claims
- 0293US9663357B2Open cavity package using chip-embedding technologyTEXAS INSTRUMENTS INC·Filed 2015·Granted May 30, 2017·12 cites·20 claims
- 0391US12021019B2Semiconductor device package with thermal padTEXAS INSTRUMENTS INC·Filed 2021·Granted Jun 25, 2024·2 cites·20 claims
- 0491US7301222B1Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packagesNAT SEMICONDUCTOR CORP·Filed 2003·Granted Nov 27, 2007·55 cites·7 claims
- 0590US12160219B2Metal ribs in electromechanical devicesTEXAS INSTRUMENTS INC·Filed 2023·Granted Dec 3, 2024·1 cites·28 claims
- 0687US11736085B2Metal ribs in electromechanical devicesTEXAS INSTRUMENTS INC·Filed 2020·Granted Aug 22, 2023·2 cites·25 claims
- 0784US10541220B1Printed repassivation for wafer chip scale packagingTEXAS INSTRUMENTS INC·Filed 2018·Granted Jan 21, 2020·4 cites·26 claims
- 0883US7253078B1Method and apparatus for forming an underfill adhesive layerNAT SEMICONDUCTOR CORP·Filed 2002·Granted Aug 7, 2007·31 cites·32 claims
- 0980US2025096768A1Metal ribs in electromechanical devicesTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1078US7755200B2Methods and arrangements for forming solder joint connectionsNAT SEMICONDUCTOR CORP·Filed 2008·Granted Jul 13, 2010·5 cites·9 claims
- 1176US10763231B2Bump bond structure for enhanced electromigration performanceTEXAS INSTRUMENTS INC·Filed 2018·Granted Sep 1, 2020·2 cites·12 claims
- 1276US10312184B2Semiconductor systems having premolded dual leadframesTEXAS INSTRUMENTS INC·Filed 2015·Granted Jun 4, 2019·2 cites·20 claims
- 1374US2024421120A1Package for stress sensitive component and semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1473US2025087591A1Frame design in embedded die packageTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1572US10580715B2Stress buffer layer in embedded packageTEXAS INSTRUMENTS INC·Filed 2018·Granted Mar 3, 2020·1 cites·20 claims
- 1671US7510908B1Method to dispense light blocking material for wafer level CSPNAT SEMICONDUCTOR CORP·Filed 2005·Granted Mar 31, 2009·5 cites·13 claims
- 1771US2024347441A1Semiconductor device package with thermal padTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1870US10763230B2Integrated circuit backside metallizationTEXAS INSTRUMENTS INC·Filed 2018·Granted Sep 1, 2020·1 cites·8 claims
- 1965US11367699B2Integrated circuit backside metallizationTEXAS INSTRUMENTS INC·Filed 2020·Granted Jun 21, 2022·0 cites·19 claims
- 2065US7812462B2Conductive paths for transmitting an electrical signal through an electrical connectorNAT SEMICONDUCTOR CORP·Filed 2008·Granted Oct 12, 2010·4 cites·18 claims
- 2164US11183441B2Stress buffer layer in embedded packageTEXAS INSTRUMENTS INC·Filed 2020·Granted Nov 23, 2021·0 cites·20 claims
- 2263US7423337B1Integrated circuit device package having a support coating for improved reliability during temperature cyclingNAT SEMICONDUCTOR CORP·Filed 2003·Granted Sep 9, 2008·11 cites·20 claims
- 2362US12074134B2Package for stress sensitive component and semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2021·Granted Aug 27, 2024·0 cites·19 claims
- 2462US11450638B2Bump bond structure for enhanced electromigration performanceTEXAS INSTRUMENTS INC·Filed 2020·Granted Sep 20, 2022·0 cites·15 claims
- 2560US7629246B2High strength solder joint formation method for wafer level packages and flip applicationsNAT SEMICONDUCTOR CORP·Filed 2007·Granted Dec 8, 2009·1 cites·16 claims
- 2660US2025183129A1Thermal enhanced electronic device packageTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2758US12154861B2Frame design in embedded die packageTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 26, 2024·0 cites·23 claims
- 2857US10573582B2Semiconductor systems having dual leadframesTEXAS INSTRUMENTS INC·Filed 2019·Granted Feb 25, 2020·0 cites·21 claims
- 2957US6973225B2Techniques for attaching rotated photonic devices to an optical sub-assembly in an optoelectronic packageNAT SEMICONDUCTOR CORP·Filed 2002·Granted Dec 6, 2005·8 cites·19 claims
- 3056US2024363465A1Die isolation with conformal coatingTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 3156US2025140653A1Hybrid quad flat package electronic deviceTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 3256US2024395731A1Electronic device with a reinforcing layerTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 3354US2023092132A1Wafer level processing for microelectronic device package with cavityTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 3453US11955456B2Flip chip packaged devices with thermal padTEXAS INSTRUMENTS INC·Filed 2021·Granted Apr 9, 2024·0 cites·19 claims
- 3552US2023317568A1Isolation package with high thermal conductivityTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 3651US2024055327A1Pre-plated lead tip for wettable flank leadframeTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 3749US2024055331A1Small outline transistor with thermal flat leadTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 3847US11158595B2Embedded die package multichip moduleTEXAS INSTRUMENTS INC·Filed 2018·Granted Oct 26, 2021·0 cites·13 claims
- 3946US8389334B2Foil-based method for packaging intergrated circuitsPODDAR ANINYDA·Filed 2010·Granted Mar 5, 2013·1 cites·10 claims
- 4045US11410875B2Fan-out electronic deviceTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 9, 2022·0 cites·14 claims
- 4145US2009174069A1I/o pad structure for enhancing solder joint reliability in integrated circuit devicesNAT SEMICONDUCTOR CORP·Filed 2008·Application pending·0 cites
- 4244US2023274993A1Fabrication process for protecting circuit componentsTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 4338US2012326300A1Low profile package and methodFENG TAO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →