Inventor · disambiguated record
Hans-Hermann Oppermann
Also filed as: OPPERMANN HANS-HERMANN
19 granted patents·1 pending application·433 citations·filing 1995–2024
93Inventor score
Files withFRAUNHOFER GES FORSCHUNG12PAC TECH GMBH2HUAWEI TECH DUESSELDORF GMBH1OPPERMANN HANS-HERMANN1SMART PAC GMBH TECHNOLOGY SERV1
Top patents by PatentIndex Score
20 records- 0197US6281577B1Chips arranged in plurality of planes and electrically connected to one anotherPAC TECH GMBH·Filed 1997·Granted Aug 28, 2001·350 cites·7 claims
- 0284US7388288B2Flip chip metallization method and devicesUNIV UTAH RES FOUND·Filed 2006·Granted Jun 17, 2008·15 cites·20 claims
- 0376US10658187B2Method for manufacturing a semiconductor component and a semiconductor componentFRAUNHOFER GES FORSCHUNG·Filed 2017·Granted May 19, 2020·4 cites·15 claims
- 0465US7087442B2Process for the formation of a spatial chip arrangement and spatial chip arrangementPAC TECH GMBH·Filed 2001·Granted Aug 8, 2006·11 cites·6 claims
- 0562US9507107B2Arrangement of a substrate with at least one optical waveguide and with an optical coupling location and of an optoelectronic component, and method for manufacturing such an arrangementFRAUNHOFER GES FORSCHUNG·Filed 2014·Granted Nov 29, 2016·1 cites·15 claims
- 0661US9134483B2Optical coupling system having an optical coupler and a light-transmissive external medium and also production and use of such a systemFRAUNHOFER GES FORSCHUNG·Filed 2013·Granted Sep 15, 2015·1 cites·23 claims
- 0761US8564969B2Component arrangement and method for production thereofOPPERMANN HANS-HERMANN·Filed 2010·Granted Oct 22, 2013·3 cites·18 claims
- 0853US11385404B2Markup system for optical system, carrier substrate, and method for manufacturing of sameFRAUNHOFER GES FORSCHUNG·Filed 2020·Granted Jul 12, 2022·0 cites·17 claims
- 0952US8521303B2In vivo implantable coil assemblySOLZBACHER FLORIAN·Filed 2007·Granted Aug 27, 2013·3 cites·28 claims
- 1052US6093971AChip module with conductor paths on the chip bonding side of a chip carrierFRAUNHOFER GES FORSCHUNG·Filed 1997·Granted Jul 25, 2000·18 cites·11 claims
- 1151US12327751B2Massive parallel assembly methodHUAWEI TECH DUESSELDORF GMBH·Filed 2022·Granted Jun 10, 2025·0 cites·20 claims
- 1251US2025079367A1Method for producing a substrate having a nanoporous bump and corresponding component having a substrate with nanoporous bumpFRAUNHOFER GES FORSCHUNG·Filed 2024·Application pending·0 cites
- 1349US6407457B1Contact-bumpless chip contacting method and an electronic circuit produced by said methodSMART PAC GMBH TECHNOLOGY SERV·Filed 2000·Granted Jun 18, 2002·4 cites·9 claims
- 1448US7861914B2Self-assembly of componentsFRAUNHOFER GES FORSCHUNG·Filed 2009·Granted Jan 4, 2011·0 cites·15 claims
- 1544US11726263B2Optical system, optical components, and method for manufacturing an optical systemFRAUNHOFER GES FORSCHUNG·Filed 2020·Granted Aug 15, 2023·0 cites·16 claims
- 1642US6107118AChip-contacting method requiring no contact bumps, and electronic circuit produced in this wayZAKEL ELKE·Filed 1996·Granted Aug 22, 2000·11 cites·9 claims
- 1738US5976302AMethod of joining electronic components to a substrateFRAUNHOFER GES FORSCHUNG·Filed 1995·Granted Nov 2, 1999·10 cites·7 claims
- 1835US11402583B2Assembly comprising a substrate and two components including optical waveguides, as well as method for productionFRAUNHOFER GES FORSCHUNG·Filed 2020·Granted Aug 2, 2022·0 cites·17 claims
- 1928US9917070B2Method for arranging electronic switching elements, electronic switching arrangement and use of a carrier having a bonding layerFRAUNHOFER GES FORSCHUNG·Filed 2015·Granted Mar 13, 2018·0 cites·12 claims
- 2028US5845838AProcess for remelting a contact surface metallizationFRAUNHOFER GES FORSCHUNG·Filed 1995·Granted Dec 8, 1998·2 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →