Inventor · disambiguated record
Hajime Sakamoto
Also filed as: SAKAMOTO HAJIME
39 granted patents·7 pending applications·697 citations·filing 2000–2018
98Inventor score
Top patents by PatentIndex Score
46 records- 0198US7852634B2Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Dec 14, 2010·55 cites·15 claims
- 0298US7842887B2Multilayer printed circuit boardIBIDEN CO LTD·Filed 2007·Granted Nov 30, 2010·45 cites·36 claims
- 0398US6909054B2Multilayer printed wiring board and method for producing multilayer printed wiring boardIBIDEN CO LTD·Filed 2001·Granted Jun 21, 2005·131 cites·7 claims
- 0495US8453323B2Printed circuit board manufacturing methodSAKAMOTO HAJIME·Filed 2011·Granted Jun 4, 2013·12 cites·17 claims
- 0595US7435910B2Multilayer printed circuit boardIBIDEN CO LTD·Filed 2004·Granted Oct 14, 2008·63 cites·18 claims
- 0695US6889433B1Method of manufacturing printed-circuit boardIBIDEN CO LTD·Filed 2000·Granted May 10, 2005·81 cites·8 claims
- 0795US6586276B2Method for fabricating a microelectronic device using wafer-level adhesion layer depositionINTEL CORP·Filed 2001·Granted Jul 1, 2003·122 cites·31 claims
- 0894US7893360B2Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit boardIBIDEN CO LTD·Filed 2007·Granted Feb 22, 2011·18 cites·34 claims
- 0993US8079142B2Printed circuit board manufacturing methodSAKAMOTO HAJIME·Filed 2008·Granted Dec 20, 2011·15 cites·13 claims
- 1092US8186045B2Multilayer printed circuit board and multilayer printed circuit board manufacturing methodSAKAMOTO HAJIME·Filed 2008·Granted May 29, 2012·14 cites·9 claims
- 1192US7888606B2Multilayer printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Feb 15, 2011·14 cites·18 claims
- 1291US9893016B2Multilayer wiring board having wiring structure for mounting multiple electronic components and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Feb 13, 2018·8 cites·16 claims
- 1388US8822323B2Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit boardSAKAMOTO HAJIME·Filed 2010·Granted Sep 2, 2014·6 cites·22 claims
- 1488US7855342B2Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit boardIBIDEN CO LTD·Filed 2001·Granted Dec 21, 2010·29 cites·71 claims
- 1587US9245838B2Semiconductor elementIBIDEN CO LTD·Filed 2015·Granted Jan 26, 2016·3 cites·20 claims
- 1687US8067699B2Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit boardSAKAMOTO HAJIME·Filed 2008·Granted Nov 29, 2011·8 cites·15 claims
- 1786US9837342B2Multilayer wiring board and method for manufacturing sameIBIDEN CO LTD·Filed 2015·Granted Dec 5, 2017·5 cites·20 claims
- 1884US8959756B2Method of manufacturing a printed circuit board having an embedded electronic componentSAKAMOTO HAJIME·Filed 2008·Granted Feb 24, 2015·6 cites·20 claims
- 1984US8524535B2Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit boardSAKAMOTO HAJIME·Filed 2008·Granted Sep 3, 2013·6 cites·16 claims
- 2084US7908745B2Method of manufacturing multi-layer printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Mar 22, 2011·6 cites·3 claims
- 2183US9706663B2Printed wiring board, method for manufacturing the same and semiconductor deviceIBIDEN CO LTD·Filed 2015·Granted Jul 11, 2017·4 cites·18 claims
- 2282US9711439B2Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2015·Granted Jul 18, 2017·4 cites·17 claims
- 2382US7999387B2Semiconductor element connected to printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Aug 16, 2011·5 cites·9 claims
- 2482US7884286B2Multilayer printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Feb 8, 2011·5 cites·19 claims
- 2580US8293579B2Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit boardSAKAMOTO HAJIME·Filed 2009·Granted Oct 23, 2012·4 cites·14 claims
- 2680US8046914B2Method for manufacturing multilayer printed circuit boardIBIDEN CO LTD·Filed 2009·Granted Nov 1, 2011·4 cites·12 claims
- 2778US10927226B2Prepreg and method for producing sameTOHO TENAX CO LTD·Filed 2013·Granted Feb 23, 2021·2 cites·15 claims
- 2875US10090238B2Wiring substrate and method for manufacturing the sameIBIDEN CO LTD·Filed 2017·Granted Oct 2, 2018·2 cites·20 claims
- 2975US7888605B2Multilayer printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Feb 15, 2011·3 cites·18 claims
- 3073US10186486B2Wiring boardIBIDEN CO LTD·Filed 2017·Granted Jan 22, 2019·2 cites·20 claims
- 3172US8438727B2Multilayer printed circuit board and multilayer printed circuit board manufacturing methodSAKAMOTO HAJIME·Filed 2009·Granted May 14, 2013·2 cites·7 claims
- 3270US8058563B2Interposer and method for manufacturing interposerSAKAMOTO HAJIME·Filed 2008·Granted Nov 15, 2011·4 cites·20 claims
- 3369US8188378B2Interposer and method for manufacturing interposerSAKAMOTO HAJIME·Filed 2008·Granted May 29, 2012·4 cites·17 claims
- 3467US10804191B2Printed wiring boardIBIDEN CO LTD·Filed 2018·Granted Oct 13, 2020·1 cites·20 claims
- 3564US7662694B2Capacitor having adjustable capacitance, and printed wiring board having the sameIBIDEN CO LTD·Filed 2006·Granted Feb 16, 2010·3 cites·9 claims
- 3660US9420697B2Method for manufacturing printed wiring boardIWATA YOSHIYUKI·Filed 2012·Granted Aug 16, 2016·1 cites·20 claims
- 3753US8173907B2Interposer and method for manufacturing interposerSAKAMOTO HAJIME·Filed 2008·Granted May 8, 2012·0 cites·41 claims
- 3850US8997344B2Method for manufacturing interposerSAKAMOTO HAJIME·Filed 2011·Granted Apr 7, 2015·0 cites·20 claims
- 3948US2011265323A1Interposer and method for manufacturing interposerIBIDEN CO LTD·Filed 2011·Application pending·0 cites
- 4044US8178790B2Interposer and method for manufacturing interposerFURUTANI TOSHIKI·Filed 2008·Granted May 15, 2012·0 cites·15 claims
- 4140US2019098752A1Printed wiring boardIBIDEN CO LTD·Filed 2018·Application pending·0 cites
- 4239US2005078919A1Waveguide type optical module, and temperature control component, and temperature control element thereofIBIDEN CO LTD·Filed 2003·Application pending·0 cites
- 4339US2005141845A1Temperature control element temperature control component, and waveguide opical moduleFiled 2003·Application pending·0 cites
- 4438US2017256470A1Wiring substrate and method for manufacturing the sameIBIDEN CO LTD·Filed 2017·Application pending·0 cites
- 4534US2015223318A1Multilayer wiring boardIBIDEN CO LTD·Filed 2015·Application pending·0 cites
- 4634US2016095219A1Printed wiring board and semiconductor device having the sameIBIDEN CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →