Inventor · disambiguated record
Haruo Shimamoto
Also filed as: SHIMAMOTO HARUO
19 granted patents·1 pending application·719 citations·filing 1988–2014
96Inventor score
Top patents by PatentIndex Score
20 records- 0195US5554887APlastic molded semiconductor packageMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Sep 10, 1996·168 cites·15 claims
- 0287US6046071APlastic molded semiconductor package and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Apr 4, 2000·73 cites·2 claims
- 0386US5548482ASemiconductor integrated circuit apparatus including clamped heat sinkMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Aug 20, 1996·98 cites·2 claims
- 0483US8883566B2Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structureROHM CO LTD·Filed 2014·Granted Nov 11, 2014·5 cites·5 claims
- 0582US5834340APlastic molded semiconductor package and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Nov 10, 1998·50 cites·1 claims
- 0679US5710062APlastic molded semiconductor package and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Jan 20, 1998·44 cites·6 claims
- 0779US5157478ATape automated bonding packaged semiconductor device incorporating a heat sinkMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Oct 20, 1992·65 cites·23 claims
- 0873US4865193ATape carrier for tape automated bonding process and a method of producing the sameMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Sep 12, 1989·40 cites·4 claims
- 0972US8729698B2Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structureMORIFUJI TADAHIRO·Filed 2010·Granted May 20, 2014·3 cites·6 claims
- 1067US5309021ASemiconductor device having particular power distribution interconnection arrangementMITSUBISHI ELECTRIC CORP·Filed 1992·Granted May 3, 1994·38 cites·13 claims
- 1166US8546244B2Method of manufacturing semiconductor deviceABE YOSHIYUKI·Filed 2012·Granted Oct 1, 2013·2 cites·18 claims
- 1265US5166099AManufacturing method for semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Nov 24, 1992·39 cites·6 claims
- 1362US5064706ACarrier tape including molten resin flow path element for resin packaged semiconductor devicesMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Nov 12, 1991·29 cites·1 claims
- 1451US6475829B2Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Nov 5, 2002·5 cites·4 claims
- 1549US4839713APackage structure for semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Jun 13, 1989·17 cites·4 claims
- 1646US5220196ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Jun 15, 1993·16 cites·8 claims
- 1744US5359203ALaser OLB apparatus and method of mounting semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Oct 25, 1994·13 cites·23 claims
- 1836US5412157ASemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1993·Granted May 2, 1995·8 cites·9 claims
- 1935US2002100963A1Semiconductor package and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Application pending·0 cites
- 2034US4826068AOuter lead bonding device utilizing tape carriersMITSUBISHI ELECTRIC CORP·Filed 1988·Granted May 2, 1989·6 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →