Inventor · disambiguated record
Hayato Tanoue
Also filed as: TANOUE HAYATO
18 granted patents·22 pending applications·8 citations·filing 2014–2025
87Inventor score
Files withTOKYO ELECTRON LTD40
Top patents by PatentIndex Score
40 records- 0187US11450523B2Substrate processing system with eccentricity detection device and substrate processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Sep 20, 2022·6 cites·18 claims
- 0283US2025259896A1Substrate processing method, substrate processing apparatus and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0383US2025259899A1Substrate processing method, substrate processing apparatus and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0483US2025259898A1Substrate processing method, substrate processing apparatus and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0583US2025259897A1Substrate processing method, substrate processing apparatus and substrate processing systemTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0678US2025279320A1Substrate processing system and substrate processing methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 0777US11752576B2Substrate processing system for removing peripheral portion of substrate, substrate processing method and computer readable recording medium thereofTOKYO ELECTRON LTD·Filed 2019·Granted Sep 12, 2023·2 cites·28 claims
- 0875US12327768B2Substrate processing system and substrate processing methodTOKYO ELECTRON LTD·Filed 2022·Granted Jun 10, 2025·0 cites·14 claims
- 0975US2025095995A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1072US12322656B2Substrate laser processing method and substrate laser processing apparatusTOKYO ELECTRON LTD·Filed 2020·Granted Jun 3, 2025·0 cites·27 claims
- 1172US2024367266A1Processing apparatus and processing methodTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1270US2024379370A1Substrate processing methodTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1365US12512336B2Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Dec 30, 2025·0 cites·20 claims
- 1465US2025191905A1Substrate processing system and substrate processing methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 1563US12191149B2Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2020·Granted Jan 7, 2025·0 cites·20 claims
- 1659US11450578B2Substrate processing system and substrate processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Sep 20, 2022·0 cites·14 claims
- 1758US12070820B2Processing apparatus and processing methodTOKYO ELECTRON LTD·Filed 2020·Granted Aug 27, 2024·0 cites·16 claims
- 1858US2024395573A1Bonding method and bonding systemTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1956US12377497B2Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Aug 5, 2025·0 cites·19 claims
- 2056US12142483B2Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Nov 12, 2024·0 cites·19 claims
- 2155US12381085B2Bonded substrate peripheral laser processing method and substrate processing apparatus thereofTOKYO ELECTRON LTD·Filed 2021·Granted Aug 5, 2025·0 cites·18 claims
- 2253US12255063B2Substrate processing system and substrate processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Mar 18, 2025·0 cites·25 claims
- 2353US2025293065A1Bonding apparatus and bonding methodTOKYO ELECTRON LTD·Filed 2025·Application pending·0 cites
- 2452US2024404852A1Processing method and processing systemTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 2549US2024071765A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 2649US2021053150A1Laser processing device and laser processing methodTOKYO ELECTRON LTD·Filed 2019·Application pending·0 cites
- 2749US2024312804A1Substrate processing apparatus, substrate processing method, and substrate manufacturing methodTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 2849US2024082957A1Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 2949US2024153822A1Semiconductor chip manufacturing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 3049US2024162081A1Stacked substrate manufacturing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 3148US12397375B2Processing apparatus and processing methodTOKYO ELECTRON LTD·Filed 2020·Granted Aug 26, 2025·0 cites·11 claims
- 3247US2024087900A1Substrate processing method and substrate processing apparatusTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 3345US12300495B2Processing apparatus and processing methodTOKYO ELECTRON LTD·Filed 2020·Granted May 13, 2025·0 cites·4 claims
- 3445US11969827B2Processing apparatus and processing methodTOKYO ELECTRON LTD·Filed 2020·Granted Apr 30, 2024·0 cites·9 claims
- 3543US12076820B2Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Sep 3, 2024·0 cites·14 claims
- 3643US2022184743A1Substrate processing system and substrate processing methodTOKYO ELECTRON LTD·Filed 2020·Application pending·0 cites
- 3743US2022223475A1Substrate processing method and substrate processing systemTOKYO ELECTRON LTD·Filed 2020·Application pending·0 cites
- 3842US12087588B2Substrate processing apparatus and substrate processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Sep 10, 2024·0 cites·21 claims
- 3940US12191168B2Laser processing device, laser processing system and laser processing methodTOKYO ELECTRON LTD·Filed 2019·Granted Jan 7, 2025·0 cites·7 claims
- 4040US2014352611A1Coating apparatus and method of cleaning sealing unitTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →