Inventor · disambiguated record
Han Shin Youn
Also filed as: YOUN HAN S · YOUN HAN-SHIN
20 granted patents·6 pending applications·313 citations·filing 1988–2024
93Inventor score
Files withHYUNDAI MOTOR CO LTD12SAMSUNG ELECTRONICS CO LTD8YOUN HAN-SHIN2HYUNDAI ELECTRONICS IND1SAM YANG CO1
Top patents by PatentIndex Score
26 records- 0193US6060778ABall grid array packageHYUNDAI ELECTRONICS IND·Filed 1998·Granted May 9, 2000·252 cites·8 claims
- 0291US9866130B1DC-DC converter and control method thereofHYUNDAI MOTOR CO LTD·Filed 2016·Granted Jan 9, 2018·13 cites·7 claims
- 0385US10618426B2Method and system for controlling vehicle during chargingHYUNDAI MOTOR CO LTD·Filed 2018·Granted Apr 14, 2020·5 cites·20 claims
- 0481US8124459B2Bump chip carrier semiconductor package systemYOON IN SANG·Filed 2006·Granted Feb 28, 2012·11 cites·20 claims
- 0581US7504736B2Semiconductor packaging mold and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 17, 2009·11 cites·12 claims
- 0679US11271417B2System and method for controlling charge and discharge of batteryHYUNDAI MOTOR CO LTD·Filed 2019·Granted Mar 8, 2022·3 cites·9 claims
- 0776US7952199B2Circuit board including solder ball land having hole and semiconductor package having the circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted May 31, 2011·4 cites·7 claims
- 0875US11124083B2Periodic supplementary charge method for battery of vehicleHYUNDAI MOTOR CO LTD·Filed 2019·Granted Sep 21, 2021·1 cites·7 claims
- 0974US10554113B1Control system and method of low voltage DC-DC converterHYUNDAI MOTOR CO LTD·Filed 2019·Granted Feb 4, 2020·2 cites·9 claims
- 1068US2025202346A1Power factor correction circuit switching method for reducing leakage currentHYUNDAI MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 1166US11135927B2Four wheel drive vehicleHYUNDAI MOTOR CO LTD·Filed 2019·Granted Oct 5, 2021·1 cites·13 claims
- 1266US7436049B2Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 14, 2008·7 cites·25 claims
- 1361US9018041B2Package for semiconductor device including guide rings and manufacturing method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Apr 28, 2015·1 cites·10 claims
- 1457US12113430B2Converter using active clamp and solar cell system having the sameHYUNDAI MOTOR CO LTD·Filed 2022·Granted Oct 8, 2024·0 cites·20 claims
- 1557US7667325B2Circuit board including solder ball land having hole and semiconductor package having the circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 23, 2010·1 cites·6 claims
- 1651US2010019372A1Semiconductor device package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1750US10756551B2Charging system with sensor diagnosis function and method of diagnosing sensor applied to the sameHYUNDAI MOTOR CO LTD·Filed 2018·Granted Aug 25, 2020·0 cites·10 claims
- 1849US11260766B2System and method for controlling low voltage DC-DC converter for vehicleHYUNDAI MOTOR CO LTD·Filed 2019·Granted Mar 1, 2022·0 cites·10 claims
- 1947US11376976B2Vehicle charger and method for controlling the sameHYUNDAI MOTOR CO LTD·Filed 2019·Granted Jul 5, 2022·0 cites·12 claims
- 2042US11110801B2Fault diagnosis system of power converter for electric vehicleHYUNDAI MOTOR CO LTD·Filed 2018·Granted Sep 7, 2021·0 cites·4 claims
- 2141US2007108635A1Integrated circuit package systemSTATS CHIPPAC LTD·Filed 2006·Application pending·0 cites
- 2240US8278154B2Method of fabricating a semiconductor device package including a heat radiation plateYOUN HAN-SHIN·Filed 2011·Granted Oct 2, 2012·0 cites·9 claims
- 2340US2007190688A1Method for manufacturing semiconductor device with protection layerSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2440US2013234310A1Flip chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 2532US2006097377A1Flip chip bonding structure using non-conductive adhesive and related fabrication methodYOUN HAN-SHIN·Filed 2005·Application pending·0 cites
- 2618US4960812APolyester resin compoundSAM YANG CO·Filed 1988·Granted Oct 2, 1990·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →