Inventor · disambiguated record
Helmut Baumann
Also filed as: BAUMANN HELMUT
20 granted patents·1 pending application·623 citations·filing 1977–2010
96Inventor score
Top patents by PatentIndex Score
21 records- 0193US6106735AWafer stack and method of producing sensorsBOSCH GMBH ROBERT·Filed 1998·Granted Aug 22, 2000·102 cites·12 claims
- 0286US6360605B1Micromechanical deviceBOSCH GMBH ROBERT·Filed 2000·Granted Mar 26, 2002·73 cites·9 claims
- 0384US6936902B2Sensor with at least one micromechanical structure and method for production thereofBOSCH GMBH ROBERT·Filed 2000·Granted Aug 30, 2005·34 cites·9 claims
- 0483US5629538ASemiconductor sensor having a protective layerBOSCH GMBH ROBERT·Filed 1995·Granted May 13, 1997·53 cites·10 claims
- 0581US5273939AMethod of assembling micromechanical sensorsBOSCH GMBH ROBERT·Filed 1992·Granted Dec 28, 1993·71 cites·11 claims
- 0680US5721377AAngular velocity sensor with built-in limit stopsBOSCH GMBH ROBERT·Filed 1996·Granted Feb 24, 1998·74 cites·13 claims
- 0780US5705745AMass flow sensorBOSCH GMBH ROBERT·Filed 1996·Granted Jan 6, 1998·51 cites·10 claims
- 0878US7273764B2Sensor with at least one micromechanical structure, and method for producing itBOSCH GMBH ROBERT·Filed 2005·Granted Sep 25, 2007·6 cites·30 claims
- 0976US6465854B1Micromechanical componentBOSCH GMBH ROBERT·Filed 1998·Granted Oct 15, 2002·36 cites·9 claims
- 1073US6462392B1Micromechanical cap structure and the respective manufacturing methodBOSCH GMBH ROBERT·Filed 2001·Granted Oct 8, 2002·27 cites·8 claims
- 1165US5461917AAcceleration sensorBOSCH GMBH ROBERT·Filed 1993·Granted Oct 31, 1995·23 cites·12 claims
- 1258US5369060AMethod for dicing composite wafersBOSCH GMBH ROBERT·Filed 1993·Granted Nov 29, 1994·32 cites·9 claims
- 1356US5355569AMethod of making sensorBOSCH GMBH ROBERT·Filed 1992·Granted Oct 18, 1994·16 cites·10 claims
- 1455US7834452B2Device made of single-crystal siliconBOSCH GMBH ROBERT·Filed 2008·Granted Nov 16, 2010·0 cites·4 claims
- 1543US8298962B2Device made of single-crystal siliconKAELBERER ARND·Filed 2010·Granted Oct 30, 2012·0 cites·4 claims
- 1643US6204086B1Method for manufacturing semiconductor components having micromechanical structuresBOSCH GMBH ROBERT·Filed 1998·Granted Mar 20, 2001·9 cites·2 claims
- 1738US4106893ASintering furnaceRIEDHAMMER LUDWIG GMBH·Filed 1977·Granted Aug 15, 1978·3 cites·1 claims
- 1836US5683947AMethod for producing a component according to the anodic bonding method and componentBOSCH GMBH ROBERT·Filed 1995·Granted Nov 4, 1997·6 cites·10 claims
- 1933US2011108932A1Micromechanical Capacitive Sensor ElementBENZEL HUBERT·Filed 2005·Application pending·0 cites
- 2030US6723250B1Method of producing structured wafersBOSCH GMBH ROBERT·Filed 1999·Granted Apr 20, 2004·6 cites·9 claims
- 2128US6271471B1Housing for electronic component, and method of producing the sameBOSCH GMBH ROBERT·Filed 1999·Granted Aug 7, 2001·1 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →