Inventor · disambiguated record
Heng-Chieh Chien
Also filed as: CHIEN HENG-CHIEH
15 granted patents·6 pending applications·171 citations·filing 2002–2024
92Inventor score
Top patents by PatentIndex Score
21 records- 0195US11942396B2Heterogeneous integration semiconductor package structureIND TECH RES INST·Filed 2021·Granted Mar 26, 2024·4 cites·16 claims
- 0294US8075182B2Apparatus and method for measuring characteristic and chip temperature of LEDDAI MING-JI·Filed 2008·Granted Dec 13, 2011·64 cites·22 claims
- 0389US10051742B2Power module and manufacturing method thereofIND TECH RES INST·Filed 2015·Granted Aug 14, 2018·7 cites·15 claims
- 0489US8609454B2Self-assembly apparatus, device self-assembling method, and method of assembling thermoelectric devicesDAI MING-JI·Filed 2012·Granted Dec 17, 2013·20 cites·22 claims
- 0585US8456017B2Filled through-silicon via with conductive composite materialDAI MING-JI·Filed 2011·Granted Jun 4, 2013·10 cites·20 claims
- 0685US6663278B1Method for determining the thermal performance of a heat sinkIND TECHNOLOGIES RES INST·Filed 2002·Granted Dec 16, 2003·45 cites·20 claims
- 0784US9252054B2Thinned integrated circuit device and manufacturing process for the sameIND TECH RES INST·Filed 2014·Granted Feb 2, 2016·7 cites·18 claims
- 0882US11602128B2Ear tag moduleIND TECH RES INST·Filed 2020·Granted Mar 14, 2023·1 cites·10 claims
- 0977US8519524B1Chip stacking structure and fabricating method of the chip stacking structureWU SHENG-TSAI·Filed 2012·Granted Aug 27, 2013·6 cites·31 claims
- 1075US10197255B2Rail-type OLED lamp assemblyIND TECH RES INST·Filed 2017·Granted Feb 5, 2019·3 cites·21 claims
- 1172US9418921B2Power moduleIND TECH RES INST·Filed 2015·Granted Aug 16, 2016·2 cites·20 claims
- 1268US12401109B2Antenna-in-package with heat dissipation structureIND TECH RES INST·Filed 2023·Granted Aug 26, 2025·0 cites·26 claims
- 1366US12352501B1Radiators and immersion tanks using the sameIND TECH RES INST·Filed 2023·Granted Jul 8, 2025·0 cites·32 claims
- 1465US9448121B2Measurement method, measurement apparatus, and computer program productIND TECH RES INST·Filed 2013·Granted Sep 20, 2016·2 cites·49 claims
- 1559US2024365517A1Data center and phase change coolant distribution unit thereofIND TECH RES INST·Filed 2024·Application pending·0 cites
- 1658US2025208212A1Electronic device and operating method thereofIND TECH RES INST·Filed 2024·Application pending·0 cites
- 1747US10540474B2Chip temperature computation method and chip temperature computation deviceIND TECH RES INST·Filed 2018·Granted Jan 21, 2020·0 cites·15 claims
- 1843US2007163756A1Closed-loop latent heat cooling method and capillary force or non-nozzle module thereofIND TECH RES INST·Filed 2006·Application pending·0 cites
- 1942US2013234325A1Filled through-silicon via and the fabrication method thereofIND TECH RES INST·Filed 2013·Application pending·0 cites
- 2042US2012249176A1Test structure and measurement method thereofCHIEN HENG-CHIEH·Filed 2011·Application pending·0 cites
- 2134US2005207120A1Thermal module with heat reservoir and method of applying the same on electronic productsIND TECH RES INST·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →