Inventor · disambiguated record
Hee Suk Chung
Also filed as: CHUNG HEE SUK
10 granted patents·3 pending applications·13 citations·filing 2013–2022
80Inventor score
Top patents by PatentIndex Score
13 records- 0192US11110968B2Floor structure for vehicleHYUNDAI MOTOR CO LTD·Filed 2019·Granted Sep 7, 2021·6 cites·10 claims
- 0285US11136069B2Center floor structure for vehicleHYUNDAI MOTOR CO LTD·Filed 2019·Granted Oct 5, 2021·2 cites·6 claims
- 0370US9132865B2Cowl structure of vehicleHYUNDAI MOTOR CO LTD·Filed 2013·Granted Sep 15, 2015·5 cites·4 claims
- 0466US12428069B2Coupling structure of rear end module and tailgate strikerHYUNDAI MOTOR CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·18 claims
- 0563US11155306B2Vehicle side outer structureHYUNDAI MOTOR CO LTD·Filed 2020·Granted Oct 26, 2021·0 cites·20 claims
- 0661US12415571B2Coupling structure of rear end module and quarter rear memberHYUNDAI MOTOR CO LTD·Filed 2022·Granted Sep 16, 2025·0 cites·14 claims
- 0757US12358568B2Coupling structure of rear end module and side memberHYUNDAI MOTOR CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·14 claims
- 0853US9095063B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Jul 28, 2015·0 cites·12 claims
- 0946US9099329B2In nanowire, device using the same and method of manufacturing in nanowireSAMSUNG ELECTRO MECH·Filed 2013·Granted Aug 4, 2015·0 cites·20 claims
- 1046US2015253909A1Touch sensorSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1142US2014152980A1Inspection device for substrate deformation at high temperatures and inspection method for substrate deformation at high temperatures using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1241US2014174193A1Method, apparatus and sample for evaluating bonding strengthSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1339US9022460B2Front end module for vehicleHYUNDAI MOTOR CO LTD·Filed 2013·Granted May 5, 2015·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →