Inventor · disambiguated record
Henry F. Erk
Also filed as: ERK HENRY · ERK HENRY F · ERK HENRY FRANK
30 granted patents·9 pending applications·591 citations·filing 1993–2022
97Inventor score
Top patents by PatentIndex Score
39 records- 0191US7323421B2Silicon wafer etching process and compositionMEMC ELECTRONIC MATERIALS·Filed 2005·Granted Jan 29, 2008·26 cites·17 claims
- 0289US11798835B2Methods for preparing a SOI structureGLOBALWAFERS CO LTD·Filed 2022·Granted Oct 24, 2023·1 cites·17 claims
- 0389US6454635B1Method and apparatus for a wafer carrier having an insertMEMC ELECTRONIC MATERIALS·Filed 2000·Granted Sep 24, 2002·58 cites·16 claims
- 0487US6709981B2Method and apparatus for processing a semiconductor wafer using novel final polishing methodMEMC ELECTRONIC MATERIALS·Filed 2001·Granted Mar 23, 2004·52 cites·48 claims
- 0585US6376335B1Semiconductor wafer manufacturing processMEMC ELECTRONIC MATERIALS·Filed 2000·Granted Apr 23, 2002·48 cites·23 claims
- 0685US5340437AProcess and apparatus for etching semiconductor wafersMEMC ELECTRONIC MATERIALS·Filed 1993·Granted Aug 23, 1994·88 cites·21 claims
- 0784US11282739B2Methods for removing an oxide film from a SOI structure and methods for preparing a SOI structureGLOBALWAFERS CO LTD·Filed 2020·Granted Mar 22, 2022·1 cites·14 claims
- 0884US8821825B2Methods for producing silaneGUPTA PUNEET·Filed 2010·Granted Sep 2, 2014·3 cites·43 claims
- 0983US5837662APost-lapping cleaning process for silicon wafersMEMC ELECTRONIC MATERIALS·Filed 1997·Granted Nov 17, 1998·77 cites·23 claims
- 1082US6257954B1Apparatus and process for high temperature wafer edge polishingMEMC ELECTRONIC MATERIALS·Filed 2000·Granted Jul 10, 2001·27 cites·23 claims
- 1180US8388914B2Systems for producing silaneGUPTA PUNEET·Filed 2010·Granted Mar 5, 2013·2 cites·46 claims
- 1277US5593505AMethod for cleaning semiconductor wafers with sonic energy and passing through a gas-liquid-interfaceMEMC ELECTRONIC MATERIALS·Filed 1995·Granted Jan 14, 1997·50 cites·9 claims
- 1376US8974761B2Methods for producing silaneSUNEDISON INC·Filed 2014·Granted Mar 10, 2015·1 cites·24 claims
- 1475US9011803B2Systems for producing silaneMEMC ELECTRONIC MATERIALS·Filed 2012·Granted Apr 21, 2015·1 cites·15 claims
- 1575US6479386B1Process for reducing surface variations for polished waferMEMC ELECTRONIC MATERIALS·Filed 2000·Granted Nov 12, 2002·22 cites·37 claims
- 1669US7559825B2Method of polishing a semiconductor waferMEMC ELECTRONIC MATERIALS·Filed 2006·Granted Jul 14, 2009·5 cites·21 claims
- 1767US6600557B1Method for the detection of processing-induced defects in a silicon waferMEMC ELECTRONIC MATERIALS·Filed 2000·Granted Jul 29, 2003·16 cites·24 claims
- 1861US9487406B2Systems for producing silaneSUNEDISON INC·Filed 2015·Granted Nov 8, 2016·0 cites·8 claims
- 1959US8309464B2Methods for etching the edge of a silicon waferERK HENRY F·Filed 2009·Granted Nov 13, 2012·1 cites·45 claims
- 2059US8192822B2Edge etched silicon wafersERK HENRY F·Filed 2009·Granted Jun 5, 2012·1 cites·21 claims
- 2159US6227944B1Method for processing a semiconductor waferMEMC ELECTRONICS MATERIALS INC·Filed 1999·Granted May 8, 2001·27 cites·14 claims
- 2258US10796946B2Method of manufacture of a semiconductor on insulator structureSUNEDISON SEMICONDUCTOR LTD UEN201334164H·Filed 2019·Granted Oct 6, 2020·0 cites·26 claims
- 2358US6189546B1Polishing process for manufacturing dopant-striation-free polished silicon wafersMEMC ELECTRONIC MATERIALS·Filed 1999·Granted Feb 20, 2001·26 cites·26 claims
- 2456US5626159AApparatus for cleaning semiconductor wafersMEMC ELECTRONIC MATERIALS·Filed 1996·Granted May 6, 1997·19 cites·18 claims
- 2555US6179950B1Polishing pad and process for forming sameMEMC ELECTRONIC MATERIALS·Filed 1999·Granted Jan 30, 2001·18 cites·10 claims
- 2655US2013118091A1Methods For Processing Abrasive SlurryMEMC ELECTRONIC MATERIALS·Filed 2013·Application pending·0 cites
- 2755US2013118962A1Systems For Processing Abrasive SlurryMEMC ELECTRONIC MATERIALS·Filed 2013·Application pending·0 cites
- 2854US10475696B2Method of manufacture of a semiconductor on insulator structureSUNEDISON SEMICONDUCTOR LTD UEN201334164H·Filed 2018·Granted Nov 12, 2019·0 cites·30 claims
- 2954US7938982B2Silicon wafer etching compositionsMEMC ELECTRONIC MATERIALS·Filed 2008·Granted May 10, 2011·0 cites·14 claims
- 3054US6135863AMethod of conditioning wafer polishing padsMEMC ELECTRONIC MATERIALS·Filed 1999·Granted Oct 24, 2000·21 cites·20 claims
- 3151US2011017230A1Method and System for Processing Abrasive SlurryMEMC ELECTRONIC MATERIALS·Filed 2010·Application pending·0 cites
- 3250US2014144846A1Methods For The Recycling of Wire-Saw Cutting FluidMEMC SINGAPORE PTE LTD UEN200614797D·Filed 2012·Application pending·0 cites
- 3350US2014145309A1Systems For The Recycling of Wire-Saw Cutting FluidUEN200614797D MEMC SINGAPORE PTE LTD·Filed 2012·Application pending·0 cites
- 3448US2019203378A1Methods for Removing a Melt of Silicon from a Crucible and Related Wick AssembliesCORNER STAR LTD·Filed 2018·Application pending·0 cites
- 3545US8828324B2Fluidized bed reactor systems and distributors for use in sameERK HENRY F·Filed 2010·Granted Sep 9, 2014·0 cites·17 claims
- 3637US11848227B2Method of manufacturing a semiconductor on insulator structure by a pressurized bond treatmentGLOBALWAFERS CO LTD·Filed 2017·Granted Dec 19, 2023·0 cites·27 claims
- 3737US2004038544A1Method for processing a semiconductor wafer using double-side polishingMEMC ELECTRONIC MATERIALS·Filed 2003·Application pending·0 cites
- 3836US2004108297A1Process for etching silicon wafersMEMC ELECTRONIC MATERIALS·Filed 2003·Application pending·0 cites
- 3930US2002034881A1Process for etching silicon wafersFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →