Inventor · disambiguated record
Heng-Ming Hsu
Also filed as: HSU HENG-MING
12 granted patents·2 pending applications·504 citations·filing 2000–2007
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG9SUN MICROSYSTEMS INC2UNITED MICROELECTRONICS CORP2ORACLE AMERICA INC1
Top patents by PatentIndex Score
14 records- 0197US6329234B1Copper process compatible CMOS metal-insulator-metal capacitor structure and its process flowTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Dec 11, 2001·212 cites·34 claims
- 0294US7405642B1Three dimensional transformerUNITED MICROELECTRONICS CORP·Filed 2007·Granted Jul 29, 2008·33 cites·11 claims
- 0392US6472721B2Dual damascene interconnect structures that include radio frequency capacitors and inductorsTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Oct 29, 2002·60 cites·13 claims
- 0488US6444517B1High Q inductor with Cu damascene via/trench etching simultaneous moduleTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Sep 3, 2002·58 cites·31 claims
- 0580US6903644B2Inductor device having improved quality factorTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jun 7, 2005·28 cites·31 claims
- 0673US7506162B1Methods for more flexible SAML sessionSUN MICROSYSTEMS INC·Filed 2004·Granted Mar 17, 2009·21 cites·9 claims
- 0773US7031967B2Method and system for implementing policies, resources and privileges for using services in LDAPSUN MICROSYSTEMS INC·Filed 2002·Granted Apr 18, 2006·34 cites·17 claims
- 0871US7836510B1Fine-grained attribute access controlORACLE AMERICA INC·Filed 2004·Granted Nov 16, 2010·18 cites·8 claims
- 0971US6881996B2Metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layerTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 19, 2005·15 cites·8 claims
- 1065US6812088B1Method for making a new metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layerTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 2, 2004·11 cites·19 claims
- 1162US6667217B1Method of fabricating a damascene copper inductor structure using a sub-0.18 um CMOS processTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Dec 23, 2003·12 cites·9 claims
- 1255US7542009B2Wireless communication device and signal receiving/transmitting method thereofUNITED MICROELECTRONICS CORP·Filed 2007·Granted Jun 2, 2009·2 cites·12 claims
- 1335US2003234436A1Semiconductor device with a spiral inductor and magnetic materialTAIWAN SEMICONDUCTOR MFG·Filed 2002·Application pending·0 cites
- 1433US2003231093A1Microelectronic inductor structure with annular magnetic shielding layerTAIWAN SEMICONDUCTOR MFG·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →