Inventor · disambiguated record
Heng-Sheng Huang
Also filed as: HUANG HENG · HUANG HENG S · HUANG HENG-SHENG
32 granted patents·3 pending applications·1,286 citations·filing 1993–2023
98Inventor score
Files withUNITED MICROELECTRONICS CORP31HONEYWELL INT INC1LIANYUNGANG JINKANG HEXIN PHARMACEUTICAL CO LTD1UNIV DALIAN TECH1
Top patents by PatentIndex Score
35 records- 0198US5378649AProcess for producing non-volatile memory devices having closely spaced buried bit lines and non-overlapping code implant areasUNITED MICROELECTRONICS CORP·Filed 1994·Granted Jan 3, 1995·337 cites·26 claims
- 0292US6064107AGate structure of a semiconductor device having an air gapUNITED MICROELECTRONICS CORP·Filed 1998·Granted May 16, 2000·88 cites·10 claims
- 0390US5920783AMethod of fabricating a self-aligned silicide MOSFETUNITED MICROELECTRONICS CORP·Filed 1998·Granted Jul 6, 1999·96 cites·24 claims
- 0487US5429988AProcess for producing high density conductive linesUNITED MICROELECTRONICS CORP·Filed 1994·Granted Jul 4, 1995·115 cites·18 claims
- 0586US6043545AMOSFET device with two spacersUNITED MICROELECTRONICS CORP·Filed 1998·Granted Mar 28, 2000·68 cites·10 claims
- 0683US5350698AMultilayer polysilicon gate self-align process for VLSI CMOS deviceUNITED MICROELECTRONICS CORP·Filed 1993·Granted Sep 27, 1994·57 cites·25 claims
- 0781US5326722APolysilicon contactUNITED MICROELECTRONICS CORP·Filed 1993·Granted Jul 5, 1994·69 cites·23 claims
- 0876US5330924AMethod of making 0.6 micrometer word line pitch ROM cell by 0.6 micrometer technologyUNITED MICROELECTRONICS CORP·Filed 1993·Granted Jul 19, 1994·38 cites·31 claims
- 0975US6153478ASTI process for eliminating kink effectUNITED MICROELECTRONICS CORP·Filed 1998·Granted Nov 28, 2000·46 cites·20 claims
- 1074US6015746AMethod of fabricating semiconductor device with a gate-side air-gap structureUNITED MICROELECTRONICS CORP·Filed 1998·Granted Jan 18, 2000·30 cites·24 claims
- 1170US9150982B2Crystal form of (6S)-5-methyltetrahydrofolate salt and method for preparing sameLIANYUNGANG JINKANG HEXIN PHARMACEUTICAL CO LTD·Filed 2012·Granted Oct 6, 2015·4 cites·8 claims
- 1270US5926729AMethod for forming gate oxide layers of various predefined thicknessesUNITED MICROELECTRONICS CORP·Filed 1997·Granted Jul 20, 1999·31 cites·20 claims
- 1370US5480819AMethod of manufacture of high coupling ratio flash memory cellUNITED MICROELECTRONICS CORP·Filed 1994·Granted Jan 2, 1996·24 cites·4 claims
- 1470US5378646AProcess for producing closely spaced conductive lines for integrated circuitsUNITED MICROELECTRONICS CORP·Filed 1994·Granted Jan 3, 1995·31 cites·20 claims
- 1570US5354700AMethod of manufacturing super channel TFT structureUNITED MICROELECTRONICS CORP·Filed 1993·Granted Oct 11, 1994·29 cites·18 claims
- 1666US6750673B1Method for measuring an effective channel length of a MOSFETUNITED MICROELECTRONICS CORP·Filed 2003·Granted Jun 15, 2004·13 cites·17 claims
- 1764US5918131AMethod of manufacturing a shallow trench isolation structureUNITED MICROELECTRONICS CORP·Filed 1997·Granted Jun 29, 1999·30 cites·16 claims
- 1863US5668029AProcess for fabricating multi-level read-only memory deviceUNITED MICROELECTRONICS CORP·Filed 1996·Granted Sep 16, 1997·21 cites·13 claims
- 1963US2023265234A1Low density thermosetting foams having improved propertiesHONEYWELL INT INC·Filed 2023·Application pending·0 cites
- 2060US6008118AMethod of fabricating a barrier layerUNITED MICROELECTRONICS CORP·Filed 1998·Granted Dec 28, 1999·25 cites·13 claims
- 2156US5672534AProcess for fabricating capacitor cells in dynamic random access memory (DRAM) chipsUNITED MICROELECTRONICS CORP·Filed 1996·Granted Sep 30, 1997·17 cites·7 claims
- 2255US6057208AMethod of forming shallow trench isolationUNITED MICROELECTRONICS CORP·Filed 1998·Granted May 2, 2000·20 cites·23 claims
- 2354US5637896AHigh coupling ratio flash memory cellUNITED MICROELECTRONICS CORP·Filed 1995·Granted Jun 10, 1997·11 cites·10 claims
- 2453US2024375536A1Wireless Charging Heating System, Wireless Charging System, Wireless Charging Heating Method And Wireless Charging MethodUNIV DALIAN TECH·Filed 2023·Application pending·0 cites
- 2552US5998287AProcess for producing very narrow buried bit lines for non-volatile memory devicesUNITED MICROELECTRONICS CORP·Filed 1994·Granted Dec 7, 1999·22 cites·25 claims
- 2651US5572147APower supply voltage detectorUNITED MICROELECTRONICS CORP·Filed 1995·Granted Nov 5, 1996·19 cites·10 claims
- 2748US5989956ADRAM capacitor processUNITED MICROELECTRONICS CORP·Filed 1997·Granted Nov 23, 1999·9 cites·10 claims
- 2848US5837579ARugged polysilicon process for DRAM capacitorsUNITED MICROELECTRONICS CORP·Filed 1997·Granted Nov 17, 1998·11 cites·19 claims
- 2943US6197642B1Method for manufacturing gate terminalUNITED MICROELECTRONICS CORP·Filed 1998·Granted Mar 6, 2001·8 cites·18 claims
- 3042US6165913AManufacturing method for spacerUNITED MICROELECTRONICS CORP·Filed 1997·Granted Dec 26, 2000·7 cites·27 claims
- 3136US2002066175A1Method of manufacturing inductorFiled 2000·Application pending·0 cites
- 3234US5659511AMethod for measuring the current leakage of a dynamic random access memory capacitive junctionUNITED MICROELECTRONICS CORP·Filed 1996·Granted Aug 19, 1997·3 cites·7 claims
- 3333US6004632AMethod for increasing etch removal rate of silicon oxynitrideUNITED MICROELECTRONICS CORP·Filed 1997·Granted Dec 21, 1999·3 cites·16 claims
- 3433US5684417AData sensing apparatus of a read only memory deviceUNITED MICROELECTRONICS CORP·Filed 1995·Granted Nov 4, 1997·3 cites·22 claims
- 3531US5985717AMethod of fabricating a semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 1996·Granted Nov 16, 1999·1 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →