Inventor · disambiguated record
Heui-Seog Kim
Also filed as: KIM HEUI-SEOG
21 granted patents·15 pending applications·195 citations·filing 2000–2015
94Inventor score
Top patents by PatentIndex Score
36 records- 0191US7420814B2Package stack and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 2, 2008·25 cites·18 claims
- 0286US7245138B2POGO pin and test socket including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jul 17, 2007·12 cites·26 claims
- 0384US7151368B2Insert block with pusher to push semiconductor device under testSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Dec 19, 2006·14 cites·15 claims
- 0484US6851100B1Management system for automated wire bonding processSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Feb 1, 2005·67 cites·31 claims
- 0581US7745932B2Semiconductor package, semiconductor package module including the semiconductor package, and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jun 29, 2010·11 cites·39 claims
- 0680US7791178B2Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Sep 7, 2010·9 cites·20 claims
- 0773US7576438B2Printed circuit board and method thereof and a solder ball land and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 18, 2009·5 cites·32 claims
- 0873US6787393B2Semiconductor package including a double-faced semiconductor chip having integrated circuitry on both sides thereof and a method of fabricating the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Sep 7, 2004·17 cites·12 claims
- 0972US7713788B2Method of manufacturing semiconductor package using redistribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted May 11, 2010·5 cites·24 claims
- 1070US7427558B2Method of forming solder ball, and fabricating method and structure of semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 23, 2008·4 cites·20 claims
- 1169US8420450B2Method of molding semiconductor packageKO JUN-YOUNG·Filed 2011·Granted Apr 16, 2013·2 cites·12 claims
- 1267US6780734B2Wafer table and semiconductor package manufacturing apparatus using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 24, 2004·11 cites·20 claims
- 1366US8466074B2Method for processing a substrate using a laser beamCHO SUNG-IL·Filed 2011·Granted Jun 18, 2013·2 cites·22 claims
- 1464US7663219B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 16, 2010·2 cites·7 claims
- 1562US7452753B2Method of processing a semiconductor wafer for manufacture of semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Nov 18, 2008·2 cites·10 claims
- 1660US7906423B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Mar 15, 2011·1 cites·7 claims
- 1759US8039972B2Printed circuit board and method thereof and a solder ball land and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Oct 18, 2011·1 cites·32 claims
- 1855US8956921B2Method of molding semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 17, 2015·0 cites·19 claims
- 1953US9184065B2Method of molding semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Nov 10, 2015·0 cites·7 claims
- 2051US6407446B2Leadframe and semiconductor chip package having cutout portions and increased lead countSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jun 18, 2002·5 cites·20 claims
- 2149US2009200362A1Method of manufacturing a semiconductor packageJUNG KY-HYUN·Filed 2009·Application pending·0 cites
- 2247US2008061434A1Substrate for semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2344US2008251949A1Molding apparatus, molded semiconductor package using multi-layered film, fabricating and molding method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2441US2004224439A1Semiconductor package including a double-faced semiconductor chip having integrated circuitry on both sides thereof and a method of fabricating the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2004·Application pending·0 cites
- 2541US2008012096A1Semiconductor chip and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2640US8115323B2Semiconductor package and method of manufacturing the semiconductor packageSIN WHA-SU·Filed 2008·Granted Feb 14, 2012·0 cites·18 claims
- 2740US2008111230A1Wiring film having wire, semiconductor package including the wiring film, and method of fabricating the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2839US2007052094A1Semiconductor wafer level chip package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2938US2007013404A1Apparatus, customer tray, and method for testing semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 3037US2004108578A1Leadframe and method for manufacturing the sameFiled 2003·Application pending·0 cites
- 3137US2009174078A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 3236US2011110062A1Stack-type semiconductor device having chips having different backside structure and electronic apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
- 3335US2012013007A1Package-on-package semiconductor package having spacers disposed between two package substratesHWANG HYUN-IK·Filed 2011·Application pending·0 cites
- 3433US2011124273A1Wafer polishing apparatus for adjusting height of wheel tipSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
- 3529US2006003491A1Apparatus for ejecting relatively thin IC chip from semiconductor waferKIM GOON-WOO·Filed 2005·Application pending·0 cites
- 3627US2012108035A1Method of Fabricating Semiconductor DeviceKIM GOON-WOO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →